JPS61125072U - - Google Patents
Info
- Publication number
- JPS61125072U JPS61125072U JP842585U JP842585U JPS61125072U JP S61125072 U JPS61125072 U JP S61125072U JP 842585 U JP842585 U JP 842585U JP 842585 U JP842585 U JP 842585U JP S61125072 U JPS61125072 U JP S61125072U
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- heat conduction
- circuits
- utility
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005855 radiation Effects 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP842585U JPS61125072U (xx) | 1985-01-23 | 1985-01-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP842585U JPS61125072U (xx) | 1985-01-23 | 1985-01-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61125072U true JPS61125072U (xx) | 1986-08-06 |
Family
ID=30487696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP842585U Pending JPS61125072U (xx) | 1985-01-23 | 1985-01-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61125072U (xx) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100990597B1 (ko) | 2008-05-23 | 2010-10-29 | 삼성전기주식회사 | 방열패턴을 갖는 인쇄회로기판 및 그 제조방법 |
| JP2018515941A (ja) * | 2015-05-08 | 2018-06-14 | アジャイル・パワー・スイッチ・３・ディー−インテグレイション・エイ・ピー・エス・アイ・３・ディー | 半導体パワーデバイスおよび半導体パワーデバイスの組立て方法 |
-
1985
- 1985-01-23 JP JP842585U patent/JPS61125072U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100990597B1 (ko) | 2008-05-23 | 2010-10-29 | 삼성전기주식회사 | 방열패턴을 갖는 인쇄회로기판 및 그 제조방법 |
| JP2018515941A (ja) * | 2015-05-08 | 2018-06-14 | アジャイル・パワー・スイッチ・３・ディー−インテグレイション・エイ・ピー・エス・アイ・３・ディー | 半導体パワーデバイスおよび半導体パワーデバイスの組立て方法 |
| US10714428B2 (en) | 2015-05-08 | 2020-07-14 | Agile Power Switch 3D—Integration Apsi3D | Semiconductor power device and a method of assembling a semiconductor power device |