JPS6112299U - Tape for taping semiconductor devices - Google Patents
Tape for taping semiconductor devicesInfo
- Publication number
- JPS6112299U JPS6112299U JP9640884U JP9640884U JPS6112299U JP S6112299 U JPS6112299 U JP S6112299U JP 9640884 U JP9640884 U JP 9640884U JP 9640884 U JP9640884 U JP 9640884U JP S6112299 U JPS6112299 U JP S6112299U
- Authority
- JP
- Japan
- Prior art keywords
- tape
- semiconductor devices
- taping
- taping semiconductor
- semiconductor elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Packages (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の一実施例を示すもので、Ａはその斜視
図、Ｂは半導体素子を取り付けた時の斜視図である。
第２図は従来のテーピング用テープを示すもので、Ａは
その斜視図、Ｂは半導体素子を取り付けた時の斜視図で
ある。
１・・・・・・キャリアテープ、２・・・・・・粘着テ
ープ、３・・・・・・半導体素子。FIG. 1 shows an embodiment of the present invention, in which A is a perspective view thereof and B is a perspective view when a semiconductor element is attached. FIG. 2 shows a conventional taping tape, in which A is a perspective view thereof and B is a perspective view when a semiconductor element is attached. 1...Carrier tape, 2...Adhesive tape, 3...Semiconductor element.
Claims (1)
いて、キャリアテープと粘着テープとをスリット状に配
したことを特徴とする半導体素子のテーピング用テープ
。A tape for taping semiconductor elements for fixing semiconductor elements to the tape, characterized in that a carrier tape and an adhesive tape are arranged in a slit shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9640884U JPS6112299U (en) | 1984-06-27 | 1984-06-27 | Tape for taping semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9640884U JPS6112299U (en) | 1984-06-27 | 1984-06-27 | Tape for taping semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6112299U true JPS6112299U (en) | 1986-01-24 |
Family
ID=30655870
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9640884U Pending JPS6112299U (en) | 1984-06-27 | 1984-06-27 | Tape for taping semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6112299U (en) |
-
1984
- 1984-06-27 JP JP9640884U patent/JPS6112299U/en active Pending
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