JPS61122870U - - Google Patents

Info

Publication number
JPS61122870U
JPS61122870U JP752885U JP752885U JPS61122870U JP S61122870 U JPS61122870 U JP S61122870U JP 752885 U JP752885 U JP 752885U JP 752885 U JP752885 U JP 752885U JP S61122870 U JPS61122870 U JP S61122870U
Authority
JP
Japan
Prior art keywords
module
center core
core sheet
attached
card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP752885U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP752885U priority Critical patent/JPS61122870U/ja
Publication of JPS61122870U publication Critical patent/JPS61122870U/ja
Pending legal-status Critical Current

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Landscapes

  • Credit Cards Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図面は本考案の一実施例であり、第1図はIC
モジユールの説明図、第2図はICカード全体の
説明図である。 1……ICチツプ、2……プリント配線基板、
6……熱活性樹脂層、8……センターコアシート
、9……オーバーシート、11……ICモジユー
ル。
The drawing shows one embodiment of the present invention, and FIG.
FIG. 2 is an explanatory diagram of the module, and FIG. 2 is an explanatory diagram of the entire IC card. 1...IC chip, 2...Printed wiring board,
6... Heat activated resin layer, 8... Center core sheet, 9... Over sheet, 11... IC module.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント配線基板にICチツプを取りつけたI
Cモジユールを熱可塑性樹脂よりなるセンターコ
アシートに形成された空所に取りつけ、このセン
ターコアシート上に熱可塑性樹脂よりなるオーバ
シートを熱圧着にて積層してなるICカードにお
いて、前記ICモジユールの表面に熱活性型樹脂
層を形成し、このICモジユールをセンターコア
シートの空所に取りつけることを特徴とするIC
カード。
I with an IC chip attached to a printed wiring board
In an IC card in which a C module is attached to a cavity formed in a center core sheet made of a thermoplastic resin, and an oversheet made of a thermoplastic resin is laminated on the center core sheet by thermocompression bonding, the IC module is An IC characterized in that a heat-activated resin layer is formed on the surface, and this IC module is attached to a vacant space of a center core sheet.
card.
JP752885U 1985-01-23 1985-01-23 Pending JPS61122870U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP752885U JPS61122870U (en) 1985-01-23 1985-01-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP752885U JPS61122870U (en) 1985-01-23 1985-01-23

Publications (1)

Publication Number Publication Date
JPS61122870U true JPS61122870U (en) 1986-08-02

Family

ID=30485961

Family Applications (1)

Application Number Title Priority Date Filing Date
JP752885U Pending JPS61122870U (en) 1985-01-23 1985-01-23

Country Status (1)

Country Link
JP (1) JPS61122870U (en)

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