JPS6112077U - IC element guide heating body of IC test equipment - Google Patents

IC element guide heating body of IC test equipment

Info

Publication number
JPS6112077U
JPS6112077U JP9758184U JP9758184U JPS6112077U JP S6112077 U JPS6112077 U JP S6112077U JP 9758184 U JP9758184 U JP 9758184U JP 9758184 U JP9758184 U JP 9758184U JP S6112077 U JPS6112077 U JP S6112077U
Authority
JP
Japan
Prior art keywords
heat
thermal conductivity
heater
heating body
guide body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9758184U
Other languages
Japanese (ja)
Other versions
JPS64617Y2 (en
Inventor
公平 佐藤
徳幸 五十嵐
真一 幸谷
Original Assignee
株式会社アドバンテスト
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社アドバンテスト filed Critical 株式会社アドバンテスト
Priority to JP9758184U priority Critical patent/JPS6112077U/en
Priority to US06/747,560 priority patent/US4691831A/en
Priority to EP85107793A priority patent/EP0166409B1/en
Priority to DE8585107793T priority patent/DE3582752D1/en
Publication of JPS6112077U publication Critical patent/JPS6112077U/en
Application granted granted Critical
Publication of JPS64617Y2 publication Critical patent/JPS64617Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図６１この考案によるＩＣ素子案内加熱体の一例を
示す断面図、第２図はそのセラミックヒータの一例を示
す斜視図、第３図はこの考案による案内加熱体の他の例
を示す断面図、第４図はこの考案の案内加熱体を適用す
ることができるＩＣ試験装置の一例を示す側面図、第５
図は第４図の斜視図、第６図は従来の案内加熱体を示す
断面図、，第７図は従来の案内加熱体に用いられる棒状
ヒータを示す略線図である。 ７１：レール、７２：案内体、７３，７４：ヒートブロ
ック、７５．７６：断熱材層、７７，７８：セラミック
ヒータ、８３，８４：断熱層、８５，８６：ヒータ押え
。Fig. 1 is a cross-sectional view showing an example of the IC element guiding heating body according to this invention, Fig. 2 is a perspective view showing an example of the ceramic heater, and Fig. 3 is a cross-sectional view showing another example of the guiding heating body according to this invention. 4 is a side view showing an example of an IC testing device to which the guide heating element of this invention can be applied, and FIG.
The drawings are a perspective view of FIG. 4, FIG. 6 is a sectional view showing a conventional guide heating body, and FIG. 7 is a schematic diagram showing a rod-shaped heater used in the conventional guide heating body. 71: Rail, 72: Guide body, 73, 74: Heat block, 75.76: Heat insulating layer, 77, 78: Ceramic heater, 83, 84: Heat insulating layer, 85, 86: Heater holder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] レールと対向して案内体かほＳ平行に延長して設けられ
、これらレール及び案内体にはそれぞれヒータが内蔵さ
れ、そのレール上にｉＣ素子が配されて、これらレール
及び案内体により案内されて移動されると共に両者によ
り加熱されるようにされたＩＣ試験装置のＩＣ素子案内
加熱体において、上記レール及び案内体の少くとも一方
は互の内側に配された熱伝導性のよい耐熱材よりなるヒ
ートブロックと、そのヒートブロックの外側のほＳ全面
に対接された熱伝導性のよい弾性材層と、その弾性材層
の外側のほＳ全面に対接され、セラミック板内にヒータ
線かほＳ均一に埋め込まれた板状セラミックヒータ，と
、その板状セラミックヒータの外側の面に対接された熱
伝導性の悪い耐熱性の弾性を持つ断熱層と、その断熱層
の外側の面に対接して設けられ、熱伝導性の悪い比較的
堅い材料よりなり、上記断熱層、セラミックヒータ、弾
性材層を上記ヒートブロックに押さえているヒータ押さ
えとよりなることを特徴とするＩＣ試験装置のＩＣ素子
案内加熱体。A guide body is provided facing the rail and extending parallel to S, each of these rails and the guide body has a built-in heater, and an iC element is disposed on the rail and is guided by these rails and the guide body. In an IC element guide heating body of an IC test device that is moved and heated by both, at least one of the rail and the guide body is made of a heat-resistant material with good thermal conductivity and arranged inside each other. A heat block, an elastic material layer with good thermal conductivity that is in contact with the entire outer surface of the heat block, and a heater wire or a thin layer that is in contact with the entire outer surface of the elastic material layer and is arranged in a ceramic plate. S A uniformly embedded plate-shaped ceramic heater, a heat-resistant elastic heat-insulating layer with poor thermal conductivity that is in contact with the outer surface of the plate-shaped ceramic heater, and a heat-resistant elastic heat-insulating layer with poor thermal conductivity, and a An IC testing device characterized by comprising a heater holder, which is provided facing each other and is made of a relatively hard material with poor thermal conductivity, and which presses the heat insulating layer, the ceramic heater, and the elastic material layer against the heat block. IC element guide heating body.
JP9758184U 1984-06-25 1984-06-27 IC element guide heating body of IC test equipment Granted JPS6112077U (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP9758184U JPS6112077U (en) 1984-06-27 1984-06-27 IC element guide heating body of IC test equipment
US06/747,560 US4691831A (en) 1984-06-25 1985-06-21 IC test equipment
EP85107793A EP0166409B1 (en) 1984-06-25 1985-06-24 Ic test equipment
DE8585107793T DE3582752D1 (en) 1984-06-25 1985-06-24 TEST DEVICE FOR INTEGRATED CIRCUITS.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9758184U JPS6112077U (en) 1984-06-27 1984-06-27 IC element guide heating body of IC test equipment

Publications (2)

Publication Number Publication Date
JPS6112077U true JPS6112077U (en) 1986-01-24
JPS64617Y2 JPS64617Y2 (en) 1989-01-09

Family

ID=30657137

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9758184U Granted JPS6112077U (en) 1984-06-25 1984-06-27 IC element guide heating body of IC test equipment

Country Status (1)

Country Link
JP (1) JPS6112077U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001316502A (en) * 2000-04-28 2001-11-16 Jsr Corp Heat transfer sheet, heating structure, heat radiation structure, electric examination method and apparatus using the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001316502A (en) * 2000-04-28 2001-11-16 Jsr Corp Heat transfer sheet, heating structure, heat radiation structure, electric examination method and apparatus using the same

Also Published As

Publication number Publication date
JPS64617Y2 (en) 1989-01-09

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