JPS6112038B2 - - Google Patents
Info
- Publication number
- JPS6112038B2 JPS6112038B2 JP57032483A JP3248382A JPS6112038B2 JP S6112038 B2 JPS6112038 B2 JP S6112038B2 JP 57032483 A JP57032483 A JP 57032483A JP 3248382 A JP3248382 A JP 3248382A JP S6112038 B2 JPS6112038 B2 JP S6112038B2
- Authority
- JP
- Japan
- Prior art keywords
- palladium
- nickel
- sodium
- bath
- content
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 34
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 29
- 229910052759 nickel Inorganic materials 0.000 claims description 15
- 229910052763 palladium Inorganic materials 0.000 claims description 12
- 239000013078 crystal Substances 0.000 claims description 9
- 239000000243 solution Substances 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 7
- JHUFGBSGINLPOW-UHFFFAOYSA-N 3-chloro-4-(trifluoromethoxy)benzoyl cyanide Chemical compound FC(F)(F)OC1=CC=C(C(=O)C#N)C=C1Cl JHUFGBSGINLPOW-UHFFFAOYSA-N 0.000 claims description 6
- 239000000654 additive Substances 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 4
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 3
- 229910001252 Pd alloy Inorganic materials 0.000 claims description 3
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims description 3
- -1 nickel amine Chemical class 0.000 claims description 3
- LDHXNOAOCJXPAH-UHFFFAOYSA-M sodium;prop-2-yne-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CC#C LDHXNOAOCJXPAH-UHFFFAOYSA-M 0.000 claims description 3
- 230000000996 additive effect Effects 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 239000007864 aqueous solution Substances 0.000 claims description 2
- 239000006115 industrial coating Substances 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- BWYYYTVSBPRQCN-UHFFFAOYSA-M sodium;ethenesulfonate Chemical compound [Na+].[O-]S(=O)(=O)C=C BWYYYTVSBPRQCN-UHFFFAOYSA-M 0.000 claims description 2
- REEBJQTUIJTGAL-UHFFFAOYSA-N 3-pyridin-1-ium-1-ylpropane-1-sulfonate Chemical compound [O-]S(=O)(=O)CCC[N+]1=CC=CC=C1 REEBJQTUIJTGAL-UHFFFAOYSA-N 0.000 claims 1
- HAKHIIUEDFEFQO-UHFFFAOYSA-M CCS(=O)(=O)[O-].C(C1=CC=CC=C1)[N+]1=CC=CC=C1.[Na] Chemical compound CCS(=O)(=O)[O-].C(C1=CC=CC=C1)[N+]1=CC=CC=C1.[Na] HAKHIIUEDFEFQO-UHFFFAOYSA-M 0.000 claims 1
- 238000009713 electroplating Methods 0.000 claims 1
- VRAHSRHQTRYBJV-UHFFFAOYSA-M sodium;2-methyl-1-oxoprop-2-ene-1-sulfonate Chemical compound [Na+].CC(=C)C(=O)S([O-])(=O)=O VRAHSRHQTRYBJV-UHFFFAOYSA-M 0.000 claims 1
- 239000003792 electrolyte Substances 0.000 description 7
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 5
- 229910017604 nitric acid Inorganic materials 0.000 description 5
- 238000000576 coating method Methods 0.000 description 4
- 238000004070 electrodeposition Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000005764 inhibitory process Effects 0.000 description 3
- 159000000000 sodium salts Chemical class 0.000 description 3
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 3
- 239000003115 supporting electrolyte Substances 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- XTEGVFVZDVNBPF-UHFFFAOYSA-N naphthalene-1,5-disulfonic acid Chemical class C1=CC=C2C(S(=O)(=O)O)=CC=CC2=C1S(O)(=O)=O XTEGVFVZDVNBPF-UHFFFAOYSA-N 0.000 description 2
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- UXJWUQMJUKSBSL-UHFFFAOYSA-M CCS([O-])(=O)=O.C(C1=CC=CC=C1)[N+]1=CC=CC=C1 Chemical compound CCS([O-])(=O)=O.C(C1=CC=CC=C1)[N+]1=CC=CC=C1 UXJWUQMJUKSBSL-UHFFFAOYSA-M 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- ZPBSAMLXSQCSOX-UHFFFAOYSA-N naphthalene-1,3,6-trisulfonic acid Chemical class OS(=O)(=O)C1=CC(S(O)(=O)=O)=CC2=CC(S(=O)(=O)O)=CC=C21 ZPBSAMLXSQCSOX-UHFFFAOYSA-N 0.000 description 1
- PSZYNBSKGUBXEH-UHFFFAOYSA-N naphthalene-1-sulfonic acid Chemical class C1=CC=C2C(S(=O)(=O)O)=CC=CC2=C1 PSZYNBSKGUBXEH-UHFFFAOYSA-N 0.000 description 1
- 229940081974 saccharin Drugs 0.000 description 1
- 235000019204 saccharin Nutrition 0.000 description 1
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- SZHIIIPPJJXYRY-UHFFFAOYSA-M sodium;2-methylprop-2-ene-1-sulfonate Chemical compound [Na+].CC(=C)CS([O-])(=O)=O SZHIIIPPJJXYRY-UHFFFAOYSA-M 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229940124530 sulfonamide Drugs 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
Description
【発明の詳細な説明】
本発明は、浴が、５ないし30ｇ/の範囲のパ
ラジウム含有量および同様に５ないし30ｇ/の
範囲のニツケル含有量、およびスルホン酸塩の添
加物を含むパラジウムおよびニツケルアミンの水
溶液から成り、この水溶液において、電気的に析
出される合金が30ないし90重量％のパラジウム含
有量を有するように、パラジウムとニツケルの比
が設定されている、装飾的および工業的な被覆の
ためパラジウム／ニツケル合金を電気的に析出す
る浴に関する。このような浴によつて作られる被
覆は金の代用として使われる。DETAILED DESCRIPTION OF THE INVENTION The present invention provides that the bath contains palladium and nickel containing a palladium content in the range from 5 to 30 g/ and a nickel content in the range from 5 to 30 g/ as well as a sulfonate additive. Decorative and industrial coatings consisting of an aqueous solution of an amine, in which the ratio of palladium to nickel is set such that the electrolytically deposited alloy has a palladium content of 30 to 90% by weight. bath for electrolytic deposition of palladium/nickel alloys. The coating produced by such baths is used as a substitute for gold.
公知の浴（英国特許第11 43 178号明細書）に
おいて、スルホン酸および／またはその塩の添加
物が光沢を形成するために使われる。詳細に述べ
れば、ナフタリン−１・５−ジスルホン酸のナト
リウム塩、ナフタリン−１・３・６−トリスルホ
ン酸のナトリウム塩、およびサツカリン（ｏ−ス
ルホ安息香酸イミド）およびｐ−トルオスルホン
アミドのような、ナフタリンスルホン酸および芳
香族スルホンアミドの塩が挙げられる。しかし実
際にはこのような浴により作られる被覆は、機械
的に考慮して要求には相応せず、かつ光沢すら多
くの装飾のために不十分であるとわかつた。本発
明の基礎とする知識によればこれら欠点は、不完
全な晶溶体形成による。本発明において晶溶体と
は、結晶格子内にパラジウム原子とニツケル原子
を有する、いわゆる混晶のことを表すものとす
る。 In the known bath (GB 11 43 178), additives of sulfonic acid and/or its salts are used to create the shine. Specifically, sodium salts of naphthalene-1,5-disulfonic acid, sodium salts of naphthalene-1,3,6-trisulfonic acid, and saccharin (o-sulfobenzoic acid imide) and p-toluosulfonamide, etc. Examples include salts of naphthalene sulfonic acid and aromatic sulfonamides. However, in practice it has been found that the coatings produced by such baths do not meet the requirements from mechanical considerations and even the gloss is insufficient for many decorations. According to the knowledge on which the invention is based, these disadvantages are due to incomplete crystal solution formation. In the present invention, the crystal solution refers to a so-called mixed crystal having palladium atoms and nickel atoms in a crystal lattice.
本発明の課題は、支障ない晶溶体形成が行われ
るように初めて述べたような浴を構成することに
ある。 The object of the invention is to construct a bath of the type mentioned for the first time in such a way that an unhindered crystal solution formation takes place.
この課題を解決するため、本発明は次のことを
示している。すなわち晶溶体形成を改善するため
添加物が、ナトリウムビニルスルホナート、ナト
リウムアリルスルホナート、ナトリウムプロピン
スルホナート、ナトリウムメタリルスルホナー
ト、Ｎ−ピリジニウムプロピルスルホベタイン、
Ｎ−ピリジニウムメチルスルホベタイン、Ｎ−ベ
ンジルピリジニウム−２−エチルスルホン酸、ナ
トリウム塩のうち１つの物質またはこれら物質の
混合物から成る。本発明の教示に従つて添加物を
選択すれば、電気的析出によつて浴からパラジウ
ム／ニツケル被覆が得られ、これら被覆は、非常
に細かくかつ均一な微結晶および支障ない晶溶体
形成の点で優れている。それにより光沢、伸度お
よび種々の腐食作用に対する耐腐食性が高められ
る。さらに平坦度も改善されている。 In order to solve this problem, the present invention shows the following. That is, additives for improving crystal solution formation include sodium vinylsulfonate, sodium allylsulfonate, sodium propynesulfonate, sodium methallylsulfonate, N-pyridiniumpropylsulfobetaine,
It consists of one substance or a mixture of these substances: N-pyridinium methylsulfobetaine, N-benzylpyridinium-2-ethylsulfonic acid, sodium salt. If the additives are chosen in accordance with the teachings of the present invention, palladium/nickel coatings can be obtained from the bath by electro-deposition, and these coatings exhibit very fine and uniform crystallites and unhindered crystal solution formation. Excellent. The gloss, elongation and corrosion resistance against various corrosive effects are thereby increased. Furthermore, flatness has also been improved.
次に本発明および得られた効果を典形的な実施
例によつて説明する。 Next, the present invention and the effects obtained will be explained using typical examples.
例 １ （脂肪族スルホン酸塩の添加） 次のような電解質が作られた。Example 1 (Addition of aliphatic sulfonate) The following electrolytes were made:
（Pd（NH3）4）Cl2として20ｇのパラジウム、
（Ni（NH3）6）SO4として10ｇのニツケル、
電解質に十分な導電度を設定するため
（NH4）2SO4またはNH4Clとして50ｇの支持電解質
（Leitsalz）、
PH値を8.5に設定するためNH4OH、
１の浴にするため水、
2.5ｇのナトリウムアリルスルホナート、
電気的析出の際の浴温度30℃、わずかな物品の
動き、陰極電流密度１A/dm2、露出時間10分。 20 g of palladium as (Pd( NH3 ) 4 ) Cl2 , 10 g of nickel as (Ni( NH3 ) 6 ) SO4 , to set up sufficient conductivity in the electrolyte ( NH4 ) 2SO4 or NH4 50 g of supporting electrolyte (Leitsalz) as Cl, NH 4 OH to set the PH value to 8.5, water to make a bath of 1, 2.5 g of sodium allylsulfonate, bath temperature during electrodeposition 30 °C, slightly movement of the article, cathode current density 1 A/dm 2 , exposure time 10 minutes.
ブラシをかけたしんちゆう板上に、明白な平坦
度なしにかつ阻害現象なしに光沢のあるパラジウ
ム・ニツケル層が得られた。 A shiny palladium-nickel layer was obtained on the brushed steel plate without any obvious flatness and without any inhibition phenomena.
耐腐食性を試験するため、このようにして得ら
れたテスト片は、室温で60秒間薄められた硝酸に
浸され、この硝酸は、等部の濃硝酸と水から作ら
れた。腐食作用は見られなかつた。 To test the corrosion resistance, the test pieces thus obtained were immersed for 60 seconds at room temperature in diluted nitric acid, which was made from equal parts of concentrated nitric acid and water. No corrosive effects were observed.
しかし初めに述べた英国特許第11 43 178号明
細書に従つて、ナトリウムアリルスルホナートの
代りに10ｇのナトリウムナフタリン−１・３・６
−トリルスルホナートを電解質に加えると、パラ
ジウム・ニツケル層は得られるが、この層は、前
記の硝酸試験においてかなり腐食した。この原因
は、不完全な晶溶体形成にある。Ｘ線検査によれ
ば、遊離したニツケルが検出され、これが腐食の
原因をなしている。 However, according to British Patent No. 11 43 178 mentioned at the outset, instead of sodium allylsulfonate, 10 g of sodium naphthalene-1,3,6
- When tolylsulfonate is added to the electrolyte, a palladium-nickel layer is obtained, which corrodes considerably in the nitric acid test described above. The cause of this is incomplete crystal solution formation. X-ray inspection detected loose nickel, which is the cause of the corrosion.
例 ２ （脂肪族スルホン酸塩組合せの添加） 次のような電解質が作られた。Example 2 (Addition of aliphatic sulfonate combination) The following electrolytes were made:
（Pd（NH3）4）Cl2として20ｇのパラジウム、
（Ni（NH3）6）SO4として10ｇのニツケル、
電解質に十分な導電度を設定するため
（NH4）2SO4またはNH4CLとして50ｇの支持電解
質（Leitsalz）、
PH値を8.5に設定するためNH4OH、
１の浴にするため水、
2.5ｇのナトリウムアリルスルホナート、
0.25ｇのナトリウムプロピンスルホナート、
電気的析出の際の浴温度30℃、わずかな物品の
動き、陰極電流密度１A/dm2、露出時間10分。 20 g of palladium as (Pd( NH3 ) 4 ) Cl2 , 10 g of nickel as (Ni( NH3 ) 6 ) SO4 , to set up sufficient conductivity in the electrolyte ( NH4 ) 2SO4 or NH4 50 g of supporting electrolyte (Leitsalz) as CL, NH 4 OH to set the PH value to 8.5, water to make a bath of 1, 2.5 g of sodium allylsulfonate, 0.25 g of sodium propynesulfonate, electrodeposition Bath temperature at 30°C, slight movement of the article, cathode current density 1A/dm 2 , exposure time 10 minutes.
ブラシをかけたしんちゆう板上に、著しい平坦
度なしにかつ阻害現象なしに例１と比較して一層
光沢のあるパラジウム・ニツケル層が得られた。
例１による硝酸試験に同様に良好に耐えた。 A more shiny palladium-nickel layer than in Example 1 was obtained on the brushed solid wood board, without significant flatness and without any inhibition phenomena.
It also withstood the nitric acid test according to Example 1 well.
例 ３
（脂肪族および異種環状のスルホン酸塩を組合
せて添加）
次のような電解質が作られた。Example 3 (Combined addition of aliphatic and heterocyclic sulfonates) The following electrolyte was made.
（Pd（NH3）4）SO4として20ｇのパラジウム、
（Ni（NH3）6）Cl2として10ｇのニツケル、
電解質に十分な導電度を設定するため
（NH4）2SO4またはNH4Clとして50ｇの支持電解
質、
PH値を8.5に設定するためNH4OH、
１の浴にするため水、
2.5ｇのナトリウムアリルスルホナート、
0.1ｇのＮ−ピリジニウムプロピルスルホベタ
イン、
電気的析出の際の浴温度30℃、わずかな物品の
動き、陰極電流密度１A/dm2、露出時間10分。 20 g of palladium as (Pd( NH3 ) 4 ) SO4 , 10 g of nickel as (Ni( NH3 ) 6 ) Cl2 , to set up sufficient conductivity in the electrolyte ( NH4 ) 2SO4 or NH4 50 g of supporting electrolyte as Cl, NH 4 OH to set the PH value to 8.5, water to make a bath of 1, 2.5 g of sodium allylsulfonate, 0.1 g of N-pyridinium propylsulfobetaine, during electrodeposition. bath temperature 30°C, slight article movement, cathode current density 1A/dm 2 , exposure time 10 minutes.
ブラシをかけたしんちゆう板上に、明白な平坦
度なしにかつ阻害現象なしに光沢のあるパラジウ
ム・ニツケル層が得られた。硝酸試験に良好に耐
えた。 A shiny palladium-nickel layer was obtained on the brushed steel plate without any obvious flatness and without any inhibition phenomena. Withstood the nitric acid test well.
Claims (1)
含有量および同様に５ないし30ｇ/の範囲のニ
ツケル含有量、および晶溶体形成を改善する添加
物を含むパラジウムおよびニツケルアミンの水溶
液から成り、この水溶液において、電気的に析出
される合金が30ないし90重量％のパラジウム含有
量を有するように、パラジウムとニツケルの比が
設定されている、装飾的および工業的な被覆のた
めパラジウム／ニツケル合金を電気的に析出する
浴において、晶溶体形成を改善するため添加物
が、ナトリウムビニルスルホナート、ナトリウム
アリルスルホナート、ナトリウムプロピンスルホ
ナート、ナトリウムメタクリルスルホナート、Ｎ
−ピリジニウムプロピルスルホベタイン、Ｎ−ピ
リジニウムメチルスルホベタイン、Ｎ−ベンジル
ピリジニウム−２−エチルスルホン酸ナトリウム
塩のうち１つの物質またはこれら物質の混合物か
ら成ることを特徴とする、パラジウム／ニツケル
合金を電気的に析出する浴。1. The bath consists of an aqueous solution of palladium and nickel amine with a palladium content in the range from 5 to 30 g/ and a nickel content likewise in the range from 5 to 30 g/, and an additive which improves crystal solution formation; In the electroplating of palladium/nickel alloys for decorative and industrial coatings, the ratio of palladium to nickel is set such that the electroplated alloy has a palladium content of 30 to 90% by weight. In order to improve crystalline solution formation, additives may be added to the baths where sodium vinylsulfonate, sodium allylsulfonate, sodium propynesulfonate, sodium methacrylsulfonate, N
- a palladium/nickel alloy, characterized in that it consists of one of the following substances: pyridinium propylsulfobetaine, N-pyridinium methylsulfobetaine, N-benzylpyridinium-2-ethylsulfonic acid sodium salt, or a mixture of these substances; bath to precipitate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3108508.3 | 1981-03-06 | ||
| DE3108508A DE3108508C2 (en) | 1981-03-06 | 1981-03-06 | Bath for the electrodeposition of a palladium / nickel alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5816089A JPS5816089A (en) | 1983-01-29 |
| JPS6112038B2 true JPS6112038B2 (en) | 1986-04-05 |
Family
ID=6126504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57032483A Granted JPS5816089A (en) | 1981-03-06 | 1982-03-03 | Bath for electrically depositing palladium/nickel alloy |
Country Status (14)
| Country | Link |
|---|---|
| JP (1) | JPS5816089A (en) |
| AT (1) | AT377013B (en) |
| AU (1) | AU535531B2 (en) |
| BE (1) | BE892344A (en) |
| BR (1) | BR8201157A (en) |
| CA (1) | CA1176204A (en) |
| CH (1) | CH649318A5 (en) |
| DE (1) | DE3108508C2 (en) |
| FR (1) | FR2501243B1 (en) |
| GB (1) | GB2094836B (en) |
| IT (1) | IT1150627B (en) |
| NL (1) | NL8200908A (en) |
| SE (1) | SE8201299L (en) |
| ZA (1) | ZA821367B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3443420A1 (en) * | 1984-11-26 | 1986-05-28 | Siemens AG, 1000 Berlin und 8000 München | Electroplating bath for the rapid deposition of palladium alloys |
| US4628165A (en) * | 1985-09-11 | 1986-12-09 | Learonal, Inc. | Electrical contacts and methods of making contacts by electrodeposition |
| DE3809139A1 (en) * | 1988-03-18 | 1989-09-28 | Lpw Chemie Gmbh | USE OF A PALLADIUM / NICKEL ALLOY LAYER AS AN INTERMEDIATE LAYER BETWEEN A NON-CORROSION-RESISTANT OR LESS-CORROSION-RESISTANT METAL BASE MATERIAL AND A COATING APPLIED BY THE PVD PROCESS |
| GB2242200B (en) * | 1990-02-20 | 1993-11-17 | Omi International | Plating compositions and processes |
| US5415685A (en) * | 1993-08-16 | 1995-05-16 | Enthone-Omi Inc. | Electroplating bath and process for white palladium |
| EP0916747B1 (en) * | 1997-11-15 | 2002-10-16 | AMI Doduco GmbH | Electrolytic bath for the deposition of palladium and palladium alloys |
| CN113699565B (en) * | 2021-09-28 | 2023-07-04 | 万明电镀智能科技(东莞)有限公司 | High corrosion resistance palladium-nickel alloy plating layer, electroplating method thereof and palladium-nickel plating layer electroplating liquid |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2328243A (en) * | 1941-04-28 | 1943-08-31 | Posture Res Corp | Chair |
| US2800442A (en) * | 1955-10-04 | 1957-07-23 | Udylite Res Corp | Electrodeposition of nickel |
| JPS4733176B1 (en) * | 1967-01-11 | 1972-08-23 | ||
| US3730854A (en) * | 1971-10-29 | 1973-05-01 | Basf Ag | Stabilized aqueous solutions of unsaturated aliphatic sulfonic acids or salts thereof |
| CH572989A5 (en) * | 1973-04-27 | 1976-02-27 | Oxy Metal Industries Corp | |
| GB1553503A (en) * | 1976-05-14 | 1979-09-26 | Oxy Metal Industries Corp | Electrodeposition of bright nickel-iron deposits |
| FR2364980A1 (en) * | 1976-09-17 | 1978-04-14 | Parker Ste Continentale | Electrodeposition of palladium alloys for jewellery - or protective coatings, using bath contg. organic cpds. and brighteners |
| DE2825966A1 (en) * | 1978-06-14 | 1980-01-03 | Basf Ag | ACID GALVANIC NICKEL BATH, WHICH CONTAINS SULFOBETAINE AS A GLOSSY AND LEVELING AGENT |
-
1981
- 1981-03-06 DE DE3108508A patent/DE3108508C2/en not_active Expired
-
1982
- 1982-02-18 GB GB8204857A patent/GB2094836B/en not_active Expired
- 1982-02-26 CH CH1184/82A patent/CH649318A5/en not_active IP Right Cessation
- 1982-03-02 ZA ZA821367A patent/ZA821367B/en unknown
- 1982-03-02 AU AU81049/82A patent/AU535531B2/en not_active Ceased
- 1982-03-03 SE SE8201299A patent/SE8201299L/en not_active Application Discontinuation
- 1982-03-03 AT AT0082182A patent/AT377013B/en not_active IP Right Cessation
- 1982-03-03 JP JP57032483A patent/JPS5816089A/en active Granted
- 1982-03-03 BE BE2/59611A patent/BE892344A/en not_active IP Right Cessation
- 1982-03-04 FR FR8203613A patent/FR2501243B1/en not_active Expired
- 1982-03-05 IT IT19992/82A patent/IT1150627B/en active
- 1982-03-05 CA CA000397678A patent/CA1176204A/en not_active Expired
- 1982-03-05 NL NL8200908A patent/NL8200908A/en not_active Application Discontinuation
- 1982-03-05 BR BR8201157A patent/BR8201157A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5816089A (en) | 1983-01-29 |
| IT1150627B (en) | 1986-12-17 |
| BR8201157A (en) | 1982-11-23 |
| GB2094836B (en) | 1984-12-05 |
| CA1176204A (en) | 1984-10-16 |
| AU8104982A (en) | 1982-09-09 |
| DE3108508C2 (en) | 1983-06-30 |
| IT8219992A0 (en) | 1982-03-05 |
| FR2501243B1 (en) | 1988-05-27 |
| AU535531B2 (en) | 1984-03-29 |
| GB2094836A (en) | 1982-09-22 |
| AT377013B (en) | 1985-01-25 |
| DE3108508A1 (en) | 1982-09-16 |
| ATA82182A (en) | 1984-06-15 |
| SE8201299L (en) | 1982-09-07 |
| BE892344A (en) | 1982-07-01 |
| ZA821367B (en) | 1983-01-26 |
| FR2501243A1 (en) | 1982-09-10 |
| CH649318A5 (en) | 1985-05-15 |
| NL8200908A (en) | 1982-10-01 |
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