JPS61119660A - Manufacture of copper alloy having high strength and electric conductivity - Google Patents

Manufacture of copper alloy having high strength and electric conductivity

Info

Publication number
JPS61119660A
JPS61119660A JP24058384A JP24058384A JPS61119660A JP S61119660 A JPS61119660 A JP S61119660A JP 24058384 A JP24058384 A JP 24058384A JP 24058384 A JP24058384 A JP 24058384A JP S61119660 A JPS61119660 A JP S61119660A
Authority
JP
Japan
Prior art keywords
alloy
heat treatment
ingot
copper
conductivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24058384A
Other languages
Japanese (ja)
Inventor
Hidehiko So
宗 秀彦
Masahiro Tsuji
正博 辻
Susumu Kawauchi
川内 進
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eneos Corp
Original Assignee
Nippon Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co Ltd filed Critical Nippon Mining Co Ltd
Priority to JP24058384A priority Critical patent/JPS61119660A/en
Publication of JPS61119660A publication Critical patent/JPS61119660A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To manufacture a Cu alloy having high strength and electric conductivity without carrying out hot rolling by continuously casting a Cu alloy ingot contg. specified percentages of Ni and Si and by subjecting the ingot to cold rolling and heat treatment under specified conditions. CONSTITUTION:A Cu alloy ingot consisting of 0.4-4.0wt% Ni, 0.1-1.0wt% Si and the balance Cu with inevitable impurities is manufactured by continuous casting. The ingot is cold rolled at 40-95% draft and heat treated at 350-700 deg.C for 30sec-10hr in a reducing or inert atmosphere to obtain a Cu alloy having high strength and electric conductivity. A material of a desired thickness having desired hardness and elongation is obtd. by further subjecting the Cu alloy to proper cold working and heat treatment as required.

Description

【発明の詳細な説明】 本発明は、トランジスタや工0などの集積回路等、半導
体部品のリード材を始めとし、端子。
DETAILED DESCRIPTION OF THE INVENTION The present invention is applicable to lead materials for semiconductor components such as transistors and integrated circuits, as well as terminals.

コネクター、ばね材等にも広く用いられる高力高導電性
銅基合金の製造方法に関する。
This invention relates to a method for manufacturing a high-strength, high-conductivity copper-based alloy that is widely used in connectors, spring materials, etc.

電気伝導性の良い銅に、少量の種々の元素を添加すると
強度は増すが、!気体導性が著しく低下する。!気体導
性が改善された合金の1つに、析出硬化型の銅合金が近
来注目されている。
Adding small amounts of various elements to copper, which has good electrical conductivity, increases its strength, but! Gas conductivity is significantly reduced. ! Precipitation hardening copper alloys have recently attracted attention as one of the alloys with improved gas conductivity.

a4〜4.Ovt*のMlおよびa1〜1.0Wt−の
81を含有する銅基合金ならびに、さらに副成分として
、  P、Sn、As*Or、Mg、Mn、Sb、!F
e+Oo+AITLZr+Be+Znからなる群よシ選
択された1種以上を総量で1001〜2.Owt$を含
有する前記銅基台金のコルソン合金は1強度と電気伝導
性のバランスのとれた合金である。
a4~4. A copper-based alloy containing Ml of Ovt* and 81 of a1 to 1.0Wt-, and further subcomponents such as P, Sn, As*Or, Mg, Mn, Sb,! F
The total amount of one or more selected from the group consisting of e+Oo+AITLZr+Be+Zn is 1001 to 2. The copper-based Corson alloy containing Owt$ is an alloy with a good balance of strength and electrical conductivity.

従来、析出硬化型の銅合金の製造方法は、鋳造したイン
ゴットを700〜1000℃の温度で加熱保持し、溶体
化処理を行った後、熱間圧延を行う。しかし、熱間圧延
を行うことは、以下のデメリットがある。
Conventionally, in a method for producing a precipitation hardening copper alloy, a cast ingot is heated and held at a temperature of 700 to 1000°C, subjected to solution treatment, and then hot rolled. However, hot rolling has the following disadvantages.

(イ)材料表面に酸化スケールが付き、スケールを除く
ために面側が必要となシ1歩留が大きく低下する。
(a) Oxide scale is attached to the surface of the material, and the surface side is required to remove the scale.1 Yield is greatly reduced.

←) コルソン合金は熱間加工性が悪いため、熱圧割れ
を起こし易い。
←) Corson alloy has poor hot workability and is prone to thermal pressure cracking.

(ハ)大気中で加熱されるため、Si等活性な添加元素
が内部酸化され、圧延、熱処理、酸洗等を繰り返すと、
この酸化物が表面に現われ。
(c) Because it is heated in the atmosphere, active additive elements such as Si are internally oxidized, and when rolling, heat treatment, pickling, etc. are repeated,
This oxide appears on the surface.

欠陥となる。It becomes a defect.

に) 熱間圧延を行うインゴットを加熱保持するために
、膨大なエネルギーを必要とする。
) It requires a huge amount of energy to heat and maintain the ingot that is hot rolled.

これらの点から、熱間圧延を行わない析出硬化型銅合金
の製造方法が望、1れている。
From these points of view, a method for producing precipitation hardening copper alloys that does not involve hot rolling is desired.

本発明は、析出硬化型の高力高導電性銅基合金の熱間圧
延を行わない製造方法に関するものである。
The present invention relates to a method for manufacturing a precipitation hardening type high-strength, high-conductivity copper-based alloy without hot rolling.

Ni量が0.4〜4.Owtlである理由は、 Niが
a4wt−未満では、 Siをα1 wt優以上添加し
ても高強度でかつ高導電性を示す合金が得られず、逆に
4.0 Wtチを超えると加工性の低下が著しく。
The amount of Ni is 0.4 to 4. The reason for this is that if Ni is less than a4wt-, even if Si is added to α1wt or more, an alloy with high strength and high conductivity cannot be obtained, and on the other hand, if it exceeds 4.0wt-, workability becomes markedly decreased.

はんだ付は性も低下するためである。81蓋を11〜1
.0Wtチとする理由は、81量がa 1 wt優以下
では、 Niをα4 wt%以上添加しても高強度でか
つ高導電性を示す合金が得られず、 19i量が1、0
 ’wt%を超えると加工性、導電性の低下が著しくな
り、はんだ付は性も低下するためである。
This is because soldering also reduces performance. 81 lid 11~1
.. The reason for setting 0Wt is that if the 81 amount is less than a 1 wt, an alloy with high strength and high conductivity cannot be obtained even if Ni is added in an amount of α4 wt% or more.
This is because if it exceeds 'wt%, workability and conductivity will be significantly reduced, and soldering properties will also be reduced.

さらに副成分として。Furthermore, as a sub-ingredient.

P  :  0.  OO1〜CL  1 5  wt
優8n:0.Ol  〜 i、5wtes八S ;へα
 001〜 (11WtチCr : α OO1〜1.
  OwtmMg ; α0 1 〜i、 0wt%M
n  :  CL  O1〜1.  Ovt1日b :
 α 0 0 1 〜G、  1  wt*Pa  :
  (101〜1.  OwtlCo ; α 0 1
 〜1.  Ovrt*Al、  :  0.  O1
〜1.  0wt%T1 : α 0 1 〜1.  
OwtlZr  ;  l  0 1 〜t  Owt
lBe  :  0.  O1〜1.  OwtlZn
  :  0.  0 1 〜1.  Owtlからな
る群よシ選択された181以上を総量でα001〜2.
 Owt%添加した組成を有する銅基合金は、11It
子部品として最適な強度と良好な耐食性が得られるが、
その総髪が11001 wtチ未満では、高強度でかつ
良好な耐食性を有する合金は得られず、2.Owt−を
超えると導電性が低下し、はんだ付は性が劣化するため
である。
P: 0. OO1~CL 1 5 wt
Good 8n: 0. Ol ~ i, 5wtes 8S; to α
001~(11Wt Cr: αOO1~1.
OwtmMg; α0 1 ~i, 0wt%M
n: CL O1-1. Ovt1 day b:
α 0 0 1 ~G, 1 wt*Pa:
(101~1. OwtlCo; α 0 1
~1. Ovrt*Al, : 0. O1
~1. 0wt%T1: α 0 1 ~1.
OwtlZr ; l 0 1 ~t Owt
lBe: 0. O1~1. OwtlZn
: 0. 0 1 ~ 1. The total amount of 181 or more selected from the group consisting of Owtl is α001~2.
The copper-based alloy having a composition with Owt% addition of 11It
Optimal strength and good corrosion resistance can be obtained as child parts, but
If the total hair is less than 11001 wt, an alloy with high strength and good corrosion resistance cannot be obtained; 2. This is because if it exceeds Owt-, the conductivity decreases and the soldering properties deteriorate.

鋳造したインゴットは、熱間圧延ではなく。Cast ingots are not hot rolled.

直接冷間圧延を行う。加工度を40〜95チとする理由
は、40嘩未満の加工度では1次の熱処理によ)、高強
度かつ高導電性の材料が得られな(,95%を超える加
工度では、材料の形状が悪くなるためである。
Perform direct cold rolling. The reason why the working degree is set to 40 to 95% is that if the working degree is less than 40%, it will not be possible to obtain a material with high strength and high conductivity (by the primary heat treatment), and if the working degree is less than 95%, the material will not be able to be obtained. This is because the shape of the

との冷間圧延した材料を還元性または不活性雰囲気にお
いて、材料温度が350〜700℃で30秒〜10時間
熱処理を行う。熱処理温度を350〜700℃とする理
由は、350℃以下では、30秒以上熱処理しても、析
出硬化型銅合金の特徴である。高強度、高導性でかつ伸
びのある材料が得られず、700℃を超える温度では材
料が溶体化され、冷却後は過飽和固溶体となシ、高強度
、高導電性の材料が得られない。また、熱処理時間t−
30秒〜10時間とする理由は、30秒未満では、熱処
理の効果が認められず、10時間を超えても導電性に変
化はなく、それ以上の熱処理は無駄なためである。
The cold-rolled material is heat treated in a reducing or inert atmosphere at a material temperature of 350 to 700°C for 30 seconds to 10 hours. The reason for setting the heat treatment temperature to 350 to 700°C is that precipitation hardening copper alloys can be heat treated for 30 seconds or more at temperatures below 350°C. A material with high strength, high conductivity, and elongation cannot be obtained; the material becomes a solution at temperatures exceeding 700°C and becomes a supersaturated solid solution after cooling; a material with high strength and high conductivity cannot be obtained. . Also, the heat treatment time t-
The reason for setting the heat treatment time to 30 seconds to 10 hours is that if the heat treatment is less than 30 seconds, the effect of the heat treatment will not be recognized, and even if it exceeds 10 hours, there will be no change in conductivity, and further heat treatment is wasteful.

熱処理を還元性または不活性雰囲気で行う理由は、材料
の表面および内部酸化を防ぐためである。
The reason why the heat treatment is performed in a reducing or inert atmosphere is to prevent surface and internal oxidation of the material.

以上の製造工程に加えて、必要に応じて適宜冷間加工と
熱処理を行なうことにより、様々な板厚や硬さ、伸びの
材料を得ることができる。
In addition to the above manufacturing process, materials with various thicknesses, hardnesses, and elongations can be obtained by appropriately performing cold working and heat treatment as necessary.

実施例 第1表に示される本発明合金に係る各種成分組成のイン
ゴットを連続鋳造装置により鋳造した(板厚15 wm
 )。このインゴットを70−の加工度で冷間圧延し、
その後N、雰囲気において500℃で5時間加熱した。
Examples Ingots having various compositions of the alloy of the present invention shown in Table 1 were cast using a continuous casting machine (thickness: 15 wm).
). This ingot was cold rolled at a working degree of 70-
Thereafter, it was heated at 500° C. for 5 hours in a nitrogen atmosphere.

このときの硬さ。Hardness at this time.

伸び、導電率を測定した。結果を比較合金とともに第1
表に示す。
Elongation and conductivity were measured. The results are shown in the first column along with comparative alloys.
Shown in the table.

第2表に第1表中6の成分の連続鋳造装置によシ鋳造し
た板厚15鵡のインゴットを各加工度で冷間圧延した後
r 4雰囲気において材料温度で500℃で5時間加熱
したときの硬さ、導を率、伸びを第2表に示す。また第
2表にて用いたインゴットを板厚2藺まで冷間圧延しく
加工度87%)、その材料をN、雰囲気にて各温度。
Table 2 shows that ingots with a thickness of 15 mm were cast using a continuous casting machine using the components listed in Table 1, and were cold-rolled at various working degrees, and then heated at a material temperature of 500°C for 5 hours in an atmosphere of R4. The hardness, conductivity and elongation are shown in Table 2. In addition, the ingots used in Table 2 were cold-rolled to a plate thickness of 2 mm (working degree: 87%), the material was N, and the temperature was various in the atmosphere.

時間で熱処理した。その時の硬さ、伸び、導電率を第5
表に示す。
Heat treated for an hour. The hardness, elongation, and conductivity at that time were determined as
Shown in the table.

第  1  表 1)IJ・1 第  2  表 第  3  表 第1表〜第3表から1本発明に係る合金の製造方法によ
シ、すぐれた強度、伸び、導電性を兼ね具える合金が安
価に得られることがわかる。
Table 1 1) IJ・1 Table 2 Table 3 1 From Tables 1 to 3 The method of manufacturing the alloy according to the present invention allows the alloy to have excellent strength, elongation, and conductivity at low cost. You can see that it can be obtained.

Claims (4)

【特許請求の範囲】[Claims] (1)(A)連続鋳造により0.4〜4.0wt%のN
i、0.1〜1.0wt%のSiを含み、残部Cuおよ
び不可避的な不純物からなる銅基合金インゴット を製造する工程 (B)上記インゴットを40〜95%の加工度で冷間圧
延する工程 (C)上記冷間圧延した材料を還元性または不活性雰囲
気において、材料温度が350〜 700℃で、30秒〜10時間熱処理する 工程 からなり、熱間圧延を行わない高力高導電性銅基合金の
製造方法。
(1) (A) 0.4 to 4.0 wt% N by continuous casting
i. Step of manufacturing a copper-based alloy ingot containing 0.1 to 1.0 wt% of Si and the balance being Cu and unavoidable impurities. (B) Cold rolling the above ingot at a working degree of 40 to 95%. Step (C) The above-mentioned cold-rolled material is heat-treated in a reducing or inert atmosphere at a material temperature of 350 to 700°C for 30 seconds to 10 hours, resulting in high strength and high conductivity without hot rolling. A method for producing copper-based alloys.
(2)必要に応じ前記熱処理の後、冷間加工と熱処理を
行うことを特徴とする特許請求の範囲第1項記載の高力
高導電性銅基合金の製造方法。
(2) The method for producing a high-strength, high-conductivity copper-based alloy according to claim 1, characterized in that, if necessary, cold working and heat treatment are performed after the heat treatment.
(3)(A)連続鋳造により0.4〜4.0wt%のN
i、0.1〜1.0wt%のSi、副成分として、 P;0.001〜0.15wt% Sn;0.01〜1.5wt% As;0.001〜0.1wt% Cr;0.001〜1.0wt% Mg;0.01〜1.0wt% Mn;0.01〜1.0wt% Sb;0.001〜0.1wt% Fe;0.01〜1.0wt% Co;0.01〜1.0wt% Al;0.01〜1.0wt% Ti;0.01〜1.0wt% Zr;0.01〜1.0wt% Be;0.01〜1.0wt% Zn;0.01〜1.0wt% からなる群より選択された1種以上を総量で0.001
〜20wt%、残部Cuおよび不可避的な不純物からな
る銅基合金インゴットを製造する工程 (B)上記インゴットを40〜95%の加工度で冷間圧
延する工程 (C)上記合金を還元性または不活性雰囲気において、
材料温度が350〜700℃で、 30秒〜10時間熱処理する工程 からなり、熱間圧延を行わない高力高導電性銅基合金の
製造方法。
(3) (A) 0.4 to 4.0 wt% N by continuous casting
i, 0.1-1.0 wt% Si, as subcomponents: P; 0.001-0.15 wt% Sn; 0.01-1.5 wt% As; 0.001-0.1 wt% Cr; 0 .001-1.0wt% Mg; 0.01-1.0wt% Mn; 0.01-1.0wt% Sb; 0.001-0.1wt% Fe; 0.01-1.0wt% Co; 0 .01-1.0wt% Al; 0.01-1.0wt% Ti; 0.01-1.0wt% Zr; 0.01-1.0wt% Be; 0.01-1.0wt% Zn; 0 One or more selected from the group consisting of .01 to 1.0 wt% in a total amount of 0.001
Step of manufacturing a copper-based alloy ingot consisting of ~20 wt%, balance Cu and unavoidable impurities (B) Step of cold rolling the above ingot at a workability of 40 to 95% (C) Step of rolling the above alloy with reducible or non-reducible In an active atmosphere,
A method for producing a high-strength, high-conductivity copper-based alloy, which comprises a step of heat-treating the material at a temperature of 350 to 700°C for 30 seconds to 10 hours, without hot rolling.
(4)必要に応じ前記熱処理の後、冷間加工と熱処理を
行うことを特徴とする特許請求の範囲第3項記載の高力
高導電性銅基合金の製造方法。
(4) The method for producing a high-strength, high-conductivity copper-based alloy according to claim 3, wherein cold working and heat treatment are performed after the heat treatment, if necessary.
JP24058384A 1984-11-16 1984-11-16 Manufacture of copper alloy having high strength and electric conductivity Pending JPS61119660A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24058384A JPS61119660A (en) 1984-11-16 1984-11-16 Manufacture of copper alloy having high strength and electric conductivity

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24058384A JPS61119660A (en) 1984-11-16 1984-11-16 Manufacture of copper alloy having high strength and electric conductivity

Publications (1)

Publication Number Publication Date
JPS61119660A true JPS61119660A (en) 1986-06-06

Family

ID=17061672

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24058384A Pending JPS61119660A (en) 1984-11-16 1984-11-16 Manufacture of copper alloy having high strength and electric conductivity

Country Status (1)

Country Link
JP (1) JPS61119660A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61284946A (en) * 1985-06-11 1986-12-15 Mitsubishi Shindo Kk Cu alloy lead blank for semiconductor device
JPS61287156A (en) * 1985-06-13 1986-12-17 Ngk Insulators Ltd Blank for lead frame
JPS62177160A (en) * 1986-01-29 1987-08-04 Sumitomo Metal Mining Co Ltd Manufacture of precipitation hardening-type copper alloy material
JPS62180025A (en) * 1986-02-04 1987-08-07 Furukawa Electric Co Ltd:The Copper alloy for electronic apparatus and its production
JPS62199742A (en) * 1986-02-27 1987-09-03 Ngk Insulators Ltd High strength copper alloy and its manufacture
JPH01119635A (en) * 1987-10-30 1989-05-11 Ngk Insulators Ltd Spring material having electric conductivity
JPH01263243A (en) * 1988-04-12 1989-10-19 Mitsubishi Electric Corp Copper alloy for electronic equipment
WO1990011852A1 (en) * 1989-04-03 1990-10-18 Olin Corporation Method of treating spray cast metal deposits
JPH02282441A (en) * 1989-04-22 1990-11-20 Mitsubishi Electric Corp Copper alloy for electronic equipment
JPH0356636A (en) * 1989-07-25 1991-03-12 Mitsubishi Shindoh Co Ltd Connector for electric apparatus made of cu alloy
JPH0397818A (en) * 1989-09-11 1991-04-23 Kobe Steel Ltd Electrode material for resistance welding

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61284946A (en) * 1985-06-11 1986-12-15 Mitsubishi Shindo Kk Cu alloy lead blank for semiconductor device
JPH0478701B2 (en) * 1985-06-11 1992-12-11 Mitsubishi Shindo Kk
JPS61287156A (en) * 1985-06-13 1986-12-17 Ngk Insulators Ltd Blank for lead frame
JPH0453936B2 (en) * 1985-06-13 1992-08-28 Ngk Insulators Ltd
JPS62177160A (en) * 1986-01-29 1987-08-04 Sumitomo Metal Mining Co Ltd Manufacture of precipitation hardening-type copper alloy material
JPS62180025A (en) * 1986-02-04 1987-08-07 Furukawa Electric Co Ltd:The Copper alloy for electronic apparatus and its production
JPH036214B2 (en) * 1986-02-27 1991-01-29 Ngk Insulators Ltd
JPS62199742A (en) * 1986-02-27 1987-09-03 Ngk Insulators Ltd High strength copper alloy and its manufacture
JPH01119635A (en) * 1987-10-30 1989-05-11 Ngk Insulators Ltd Spring material having electric conductivity
JPH01263243A (en) * 1988-04-12 1989-10-19 Mitsubishi Electric Corp Copper alloy for electronic equipment
WO1990011852A1 (en) * 1989-04-03 1990-10-18 Olin Corporation Method of treating spray cast metal deposits
JPH02282441A (en) * 1989-04-22 1990-11-20 Mitsubishi Electric Corp Copper alloy for electronic equipment
JPH0356636A (en) * 1989-07-25 1991-03-12 Mitsubishi Shindoh Co Ltd Connector for electric apparatus made of cu alloy
JPH0397818A (en) * 1989-09-11 1991-04-23 Kobe Steel Ltd Electrode material for resistance welding

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