JPS61115692A - Coloring solder cream - Google Patents

Coloring solder cream

Info

Publication number
JPS61115692A
JPS61115692A JP59236937A JP23693784A JPS61115692A JP S61115692 A JPS61115692 A JP S61115692A JP 59236937 A JP59236937 A JP 59236937A JP 23693784 A JP23693784 A JP 23693784A JP S61115692 A JPS61115692 A JP S61115692A
Authority
JP
Japan
Prior art keywords
solder cream
pigment
solder
coloring
cream
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59236937A
Other languages
Japanese (ja)
Inventor
Toshiro Nishimura
西村　利郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIPPON SUPERIASHIYA KK
Original Assignee
NIPPON SUPERIASHIYA KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIPPON SUPERIASHIYA KK filed Critical NIPPON SUPERIASHIYA KK
Priority to JP59236937A priority Critical patent/JPS61115692A/en
Publication of JPS61115692A publication Critical patent/JPS61115692A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Abstract

PURPOSE:To improve the working efficiency by mixing and scattering a pigment of a specified weight % in a solder cream. CONSTITUTION:A pigment of cadmium, red ion oxide, iron blue, etc. is mixed and scattered within a range of 0.1-30% in a solder cream. An inorganic pigment scattered in this solder cream floats up onto its surface after soldering, and a kind of a solder which has been used can be discriminated at a glance. Also, the pigment is erased completely by executing a washing afterward, therefore, a degree of washing of a soldered surface can be confirmed. Accordingly, the efficiency of a soldering work is improved.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、着色したハンダクリームに関し、使用時に
その種類・用途等を色彩により容易に判別し得るように
したことを特徴とするものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to colored solder cream, and is characterized in that the type, purpose, etc. of the colored solder cream can be easily distinguished by color when used. .

〔従来の技術およびその問題点〕[Conventional technology and its problems]

一般にハンダクリームは、錫及び鉛を主成分とし、それ
に銀、アンチモン、ビスマス等を適宜配合して合金組成
物とした粉状はんだに、塩化物、樹脂等のフラックスを
添加混合してペースト状としたものであるが、上記合金
組成、形態、フラ・ノクスタイプ、フランクス含有量、
メソシュサイズ又はハンダ粒子の形状等々によって種々
に分類され、その用途も、電気、電子部品用、一般用、
食器用、銀器用、アルミニウム用等多岐に亘るものであ
った。In general, solder cream is made into a paste by adding flux such as chloride and resin to powdered solder, which is made into an alloy composition by mixing tin and lead as main components with appropriate amounts of silver, antimony, bismuth, etc. However, the above alloy composition, form, Fra Nox type, Franx content,
It is classified into various types depending on the mesh size or the shape of the solder particles, and its uses include electrical and electronic parts, general use,
They were used for a wide variety of purposes, including tableware, silverware, and aluminum.

而して、上記ハンダクリームの容器等には、通常、その
種類又は用途等が記載されているのであるが、文字や記
号の読取りが煩わしい上、誤読による作業のやり直しが
屡々発生していた他、使用のため一旦容器から取出した
ハンダクリームは、その種類、用途等を肉眼で判別する
ことが極めて困難で、誤使用のおそれが多分であり、又
はんだ付は後も、どの種類のハンダクリームを使用した
か判別できないなど、正常なはんだ付は作業を行う上で
種々の問題が見受けられたものである。Therefore, although the type or purpose of the solder cream is usually written on the solder cream containers, it is difficult to read the letters and symbols, and misreading often results in redoing work. Once the solder cream is taken out of the container for use, it is extremely difficult to tell its type and purpose with the naked eye, and there is a high risk of misuse. Various problems were observed when performing normal soldering work, such as not being able to tell whether a soldering device was used or not.

〔問題点を解決するための手段〕[Means for solving problems]

このような実情に鑑み、本発明は上記ハンダクリームに
適量の無機顔料を混合散在させ、その色彩により種類、
用途を一目で判断できるようにして上記の問題点を解決
したものである。In view of these circumstances, the present invention mixes and disperses an appropriate amount of inorganic pigment into the solder cream, and differentiates the type and color depending on the color.
This solves the above problem by making it possible to determine the application at a glance.

〔作　　　用〕[For production]

畝上の構成に係る本発明の着色ハンダクリームは、使用
する無機顔料が、ハンダクリーム中の溶剤等と化学変化
を起こすことなくハンダクリーム中に散在して着色でき
る一方、はんだ付後の顔料粒子は表面に浮上して随時除
去できるという作用を有するものである。The colored solder cream of the present invention, which has a ridged structure, can be colored by dispersing the inorganic pigment in the solder cream without causing a chemical change with the solvent in the solder cream, and the pigment particles after soldering. has the effect of floating to the surface and being able to be removed at any time.

〔実　施　例〕〔Example〕

以下、本願発明の着色ハンダクリームを１〜２の実施例
に基づいて更に具体的に述べると、（その１） ハンダクリームを赤色に着色する場合、錫５０％、鉛４
９．７％、アンチモン０．３％の合金組成を有する一般
用ハンダクリーム１００ｇに対して、ベンガラ（Ｆｅｚ
Ｏｓ）０．５ｇ　（重量比０．５％）を混合させれば、
薄赤色の着色ハンダクリームが得られた。Hereinafter, the colored solder cream of the present invention will be described in more detail based on Examples 1 and 2. (1) When coloring the solder cream red, 50% tin and 4 lead
For 100 g of general solder cream having an alloy composition of 9.7% antimony and 0.3% antimony,
Os) 0.5g (weight ratio 0.5%) is mixed,
A pale red colored solder cream was obtained.

（その２） 青色の着色ハンダクリームを得る場合、錫６２％、鉛３
５．７％、銀２％、アンチモン０．３％の合成組成を存
するエレクトリック厚膜用ハンダクリーム１００　ｇに
対し、紺青２０ｇ（重量比２０％）を混合させれば、濃
青色のハンダクリームが得られた。(Part 2) When obtaining blue colored solder cream, 62% tin and 3% lead
If you mix 20 g of dark blue (20% by weight) with 100 g of solder cream for electric thick films, which has a synthetic composition of 5.7% silver, 2% antimony, and 0.3% antimony, a dark blue solder cream will be produced. Obtained.

この他着色用顔料には、赤色乃至黄色用として朱（Ｈｇ
Ｓ）　、カドミウム（ＣｄＳ−ｎＣｄＳｅ）、カドミウ
ムイエロー（ＣｄＳ）　、黄鉛（ＰｂＣｒ０ｎ）等、又
青色乃至緑色顔料としては群青、フタロシアニンブルー
、クロムグリーン、酸化クロム（Ｃｒｔ（ｈ）等がある
が、更に上記単一色に限らず２種またはそれ以上の顔料
を混合することにより、任意の色相・彩度の着色ハンダ
クリームを得ることが出来るのである。Other coloring pigments include vermilion (Hg) for red to yellow colors.
S), cadmium (CdS-nCdSe), cadmium yellow (CdS), yellow lead (PbCr0n), etc. Blue to green pigments include ultramarine, phthalocyanine blue, chrome green, chromium oxide (Crt(h), etc.) Furthermore, by mixing not only the above-mentioned single color but also two or more pigments, colored solder cream of any hue and saturation can be obtained.

尚、本発明における上記顔料の混合量は、顔料の添加量
が０．１％以下であると着色によるハンダクリームの改
善効果が殆ど認められず、又それが３０％を越えても着
色濃度に大きな変化が認められないだけでなり、顔料の
不純物として働き、はんだ付性能の劣化を生ずる恐れが
見られるので、その量的範囲を０．１％〜３０％とした
ものである。It should be noted that if the amount of the pigment added in the present invention is less than 0.1%, little effect of improving the solder cream due to coloring will be observed, and if it exceeds 30%, the coloring density will be affected. Since there is a fear that no major change is observed and that the pigment acts as an impurity in the pigment and causes deterioration of soldering performance, its quantitative range is set at 0.1% to 30%.

〔発明の効果〕〔Effect of the invention〕

叙述したように、本発明の着色ハンダクリームは、該ハ
ンダクリームの合金組成物、フラックスタイプ或いはメ
ツシュサイズ等々の相違に従って色別に着色したもので
あるから、その種類・用途などが肉眼的に識別できて誤
使用の恐れが全くなく、又実際の使用に当たって、その
塗布箇所や塗布状態等の確認が容易ではんだ付作業の能
率化が計れるという格別の効果が期待できる他、該ハン
ダクリーム中に散在する無機顔料は、はんだ付ンその表
面に浮き上がり、使用したはんだの種類が一見して判別
できる一方、後刻洗浄することによって完全に消去でき
るから、はんだ付置の洗浄度合が容易に確認できる等、
多岐にわたって優れた利益がＷらされるものである。As described above, the colored solder cream of the present invention is colored according to the alloy composition, flux type, mesh size, etc. of the solder cream, so that its type and use can be visually identified. There is no risk of misuse, and during actual use, it is easy to check the application location and application state, making it possible to improve the efficiency of soldering work. The inorganic pigment floats on the surface of the solder, making it possible to identify the type of solder used at a glance, but it can also be completely erased by cleaning afterwards, making it easy to check how well the solder has been cleaned.
It offers excellent benefits in a wide variety of ways.

以　　　上that's all

Claims (1)

【特許請求の範囲】[Claims] １、はんだ合金組成物とフラックスを混合し、ペースト
状としたハンダクリームにおいて、該ハンダクリームに
０．１〜３０％（重量比）の顔料を混合・散在せしめた
ことを特徴とする着色ハンダクリーム。1. A colored solder cream made by mixing a solder alloy composition and a flux into a paste, which is characterized in that 0.1 to 30% (by weight) of a pigment is mixed and scattered in the solder cream. .
JP59236937A 1984-11-09 1984-11-09 Coloring solder cream Pending JPS61115692A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59236937A JPS61115692A (en) 1984-11-09 1984-11-09 Coloring solder cream

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59236937A JPS61115692A (en) 1984-11-09 1984-11-09 Coloring solder cream

Publications (1)

Publication Number Publication Date
JPS61115692A true JPS61115692A (en) 1986-06-03

Family

ID=17007954

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59236937A Pending JPS61115692A (en) 1984-11-09 1984-11-09 Coloring solder cream

Country Status (1)

Country Link
JP (1) JPS61115692A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0292490A (en) * 1988-09-28 1990-04-03 Matsushita Electric Ind Co Ltd Cream solder
JPH04344888A (en) * 1991-05-23 1992-12-01 Nec Corp Dye containing solder
JPH0740078A (en) * 1993-07-28 1995-02-10 Nec Corp Particulate solder paste
JPH07323391A (en) * 1994-06-03 1995-12-12 Eastern:Kk Colored soldering material and method for forming colored film on soldered part
JP2007237212A (en) * 2006-03-07 2007-09-20 Alps Electric Co Ltd Solder adhesive and electronic component packaging structure using the solder adhesive
JP2009514683A (en) * 2005-11-08 2009-04-09 ヴェー ツェー ヘレーウス ゲゼルシャフト ミット ベシュレンクテル ハフツング Solder paste with non-resin flux
JP2017512654A (en) * 2014-03-14 2017-05-25 リンカーン グローバル， インコーポレイテッドＬｉｎｃｏｌｎ Ｇｌｏｂａｌ， Ｉｎｃ． Boric acid free flux
US10668576B2 (en) 2013-03-15 2020-06-02 Lincoln Global, Inc. Boric acid free flux

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS525013A (en) * 1975-06-28 1977-01-14 Kubota Ltd Clamper in a pipe separater
JPS6035573B2 (en) * 1976-04-26 1985-08-15 エムテイエス・システムス・コ−ポレ−シヨン linear air spring device
JPS60223695A (en) * 1984-04-19 1985-11-08 Matsushita Electric Ind Co Ltd Solder material

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS525013A (en) * 1975-06-28 1977-01-14 Kubota Ltd Clamper in a pipe separater
JPS6035573B2 (en) * 1976-04-26 1985-08-15 エムテイエス・システムス・コ−ポレ−シヨン linear air spring device
JPS60223695A (en) * 1984-04-19 1985-11-08 Matsushita Electric Ind Co Ltd Solder material

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0292490A (en) * 1988-09-28 1990-04-03 Matsushita Electric Ind Co Ltd Cream solder
JPH04344888A (en) * 1991-05-23 1992-12-01 Nec Corp Dye containing solder
JPH0740078A (en) * 1993-07-28 1995-02-10 Nec Corp Particulate solder paste
JPH07323391A (en) * 1994-06-03 1995-12-12 Eastern:Kk Colored soldering material and method for forming colored film on soldered part
JP2009514683A (en) * 2005-11-08 2009-04-09 ヴェー ツェー ヘレーウス ゲゼルシャフト ミット ベシュレンクテル ハフツング Solder paste with non-resin flux
JP2007237212A (en) * 2006-03-07 2007-09-20 Alps Electric Co Ltd Solder adhesive and electronic component packaging structure using the solder adhesive
US10668576B2 (en) 2013-03-15 2020-06-02 Lincoln Global, Inc. Boric acid free flux
US10682731B2 (en) 2013-03-15 2020-06-16 Lincoln Global, Inc. Process for making a boric acid free flux
JP2017512654A (en) * 2014-03-14 2017-05-25 リンカーン グローバル， インコーポレイテッドＬｉｎｃｏｌｎ Ｇｌｏｂａｌ， Ｉｎｃ． Boric acid free flux

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