JPS61114154A - Method and device for detecting crack in joined member - Google Patents
Method and device for detecting crack in joined memberInfo
- Publication number
- JPS61114154A JPS61114154A JP23497084A JP23497084A JPS61114154A JP S61114154 A JPS61114154 A JP S61114154A JP 23497084 A JP23497084 A JP 23497084A JP 23497084 A JP23497084 A JP 23497084A JP S61114154 A JPS61114154 A JP S61114154A
- Authority
- JP
- Japan
- Prior art keywords
- joint
- terminal
- potential difference
- crack
- power supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/20—Investigating the presence of flaws
Abstract
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は、接合部材の亀裂検出方法およびその装置に係
り、特に、薄板をはさんで両側に厚板を置きサンドウィ
ッチ状に接合した接合部材の狭隘な接合部に発生する欠
陥や亀裂深さを精度良く測定するのに好適な接合部材の
亀裂検出方法およびその装置に関するものである。[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a method and apparatus for detecting cracks in bonded members, and in particular, to a crack detection method and device for detecting cracks in bonded members, and particularly for detecting cracks in bonded members in which thin plates are sandwiched and thick plates are placed on both sides of the bonded members. The present invention relates to a method and apparatus for detecting cracks in joined members suitable for accurately measuring defects and crack depths occurring in narrow joints.
部材に発生する欠陥や亀裂を検出する測定法として、亀
裂周辺のポテンシャル分布を測定する直流ポテンシャル
法が、「機械の研究」第３６巻、第１号、ｐ２７〜３２
における矢用元基他１名によるｒ破壊力学における電位
差法の適用」と題する文献に記載されている。As a measurement method for detecting defects and cracks that occur in parts, the DC potential method, which measures the potential distribution around cracks, is used in "Machine Research," Vol. 36, No. 1, p. 27-32.
Application of the Potential Difference Method in Fracture Mechanics by Motoki Yayo et al.
これによれば、従来の亀裂検出方法は、単一亀裂を想定
して、被測定体に一定の電流を印加し、亀裂のない場合
の測定端子間の電位差を基準電位差Ｖ。として、これと
亀裂のある場合の電位差Ｖ、とから電位差比Ｖ、／Ｖ、
を求めて、電位差比Ｖ、 ／Ｖ、と亀裂深さの較正曲線
を用いて亀裂深さを判定している。According to this, in the conventional crack detection method, assuming a single crack, a constant current is applied to the object to be measured, and the potential difference between the measurement terminals when there is no crack is set as the reference potential difference V. From this and the potential difference V when there is a crack, the potential difference ratio V, /V,
The crack depth is determined using the potential difference ratio V, /V and a crack depth calibration curve.
しかし、一般に接合部材は、前記文献記載のもののよう
に単純な形状のもののみではなく、単一亀裂のみではな
い。However, in general, the joining member does not have only a simple shape as described in the above-mentioned literature, nor does it have only a single crack.
第１３図は、検査対象となる一般的な接合部材の構成図
である。FIG. 13 is a configuration diagram of a general joining member to be inspected.
第１３図に示すように、薄板ＩＡをはさんで両面に厚板
２Ａをおき全体をサンドウィッチ状に複数段（第１３図
では２段）接合してなる接合部材は、形状が複雑で、か
つ異種材料の接着層３Ａがある。As shown in Fig. 13, the joint member is made by sandwiching a thin plate IA with thick plates 2A on both sides and joining the whole body in a sandwich-like manner in multiple stages (two stages in Fig. 13). There is an adhesive layer 3A made of different materials.
このような接合部材で、隣接して２つの亀裂が存在する
ような場合については、上述の亀裂検出法では適応が難
しかった。It is difficult to apply the crack detection method described above to a case where two cracks exist adjacent to each other in such a joining member.
本発明は、前述の従来技術の実状に鑑みなされたもので
、接合部材の狭隘な接合部に発生する欠陥および亀裂の
深さを精度よく検出しつる接合部材の亀裂検出方法およ
びその装置の提供を、その目的としている。The present invention has been made in view of the actual state of the prior art described above, and provides a method and apparatus for detecting cracks in tendon joint members that accurately detect defects and crack depths occurring in narrow joints of joint members. is its purpose.
本発明に係る接合部材の亀裂検出方法は、薄板をはさん
で両側に厚板を接合する形状のものを複数段接合してな
る接合部材の、接合部に発生する亀裂を検出する方法で
あって、一定の電流を印加する給電端子を、接合部ｋま
たいで接合部材の両部材面に当接させ、亀裂の大きさに
よって変化する電位差を測定する測定端子を、前記給電
端子の内側に、前記接合部をまたいで前記接合部材の両
部材面１０当接させ、前記給電端子に電流を流して前記
測定端子の電位差を測定し、その測定した電位差から演
算制御装置の演算により亀裂深さを自動的に判定する方
法である。The method for detecting cracks in a joined member according to the present invention is a method for detecting cracks that occur at the joint of a joined member formed by joining a plurality of thin plates with thick plates on both sides. A power supply terminal that applies a constant current is brought into contact with both surfaces of the joint member across the joint part k, and a measurement terminal that measures the potential difference that changes depending on the size of the crack is placed inside the power supply terminal, Both member surfaces 10 of the bonding member are brought into contact across the bonding portion, a current is passed through the power supply terminal to measure the potential difference between the measurement terminals, and a crack depth is determined from the measured potential difference by calculation by an arithmetic and control device. This is a method of automatic determination.
また、本発明に係る接合部材の亀裂検出装置は、薄板を
はさんで両側に厚板を接合する形状のものを複数段接合
してなる接合部材の、接合部に発生する亀裂を検出する
装置であって、前記接合部材を測定位置に把持する手段
と、接合部をまたいで接合部材の両部材面に当接させ一
定の電流を印加する給電端子と、前記給電端子の内側に
位置にし接合部をまたいで前記接合部材の両部材面に当
接させ、亀裂の大きさによって変化する電位差を測定す
る測定端子とを、端子支持部材に装着してなるセンサと
、このセンサを測定位置に位置決めする手段と、測定し
た電位差から亀裂深さを自動的に判定する演算制御装置
とを備えたものである。Further, the crack detection device for a bonded member according to the present invention is a device for detecting cracks that occur in a bonded portion of a bonded member formed by joining multiple stages of thin plates and thick plates on both sides. means for holding the joining member at a measurement position; a power supply terminal for applying a constant current to both surfaces of the joining member across the joint; and a power supply terminal located inside the power supply terminal for joining. A sensor comprising a measurement terminal mounted on a terminal support member and a measurement terminal that is brought into contact with both member surfaces of the joining member across the part and measures a potential difference that changes depending on the size of the crack, and this sensor is positioned at a measurement position. and an arithmetic and control device that automatically determines the crack depth from the measured potential difference.
以下、本発明の各実施例を第１図ないし第１０図を参照
して説明する。Embodiments of the present invention will be described below with reference to FIGS. 1 to 10.
まず、第１図は、本発明の一実施例に係る接合部材の亀
裂検出装置の全体構成図、第２図は、第１図の装置のセ
ンサ部の詳細断面図であり、第１゜２図を用いて接合部
材の亀裂検出装置の構成を説明する。First, FIG. 1 is an overall configuration diagram of a crack detection device for bonded members according to an embodiment of the present invention, and FIG. 2 is a detailed sectional view of the sensor section of the device shown in FIG. The configuration of a crack detection device for bonded members will be explained using the drawings.
図において、１は複数の薄板の円板、２は複数の回転体
、３は接着層を示し、薄板円板１をはさんで両側に厚板
の回転体２を接合する形状のものをサンドウィッチ構造
に複数段接合して接合部材が形成されている。この接合
部材は、例えばターボ分子ポンプのＴ ｊ材の翼とＴ３
材のロータを。In the figure, 1 is a plurality of thin discs, 2 is a plurality of rotating bodies, and 3 is an adhesive layer. A sandwich is a sandwich in which the thin disc 1 is sandwiched and the thick rotating bodies 2 are joined on both sides. A joining member is formed by joining the structure in multiple stages. This joining member is, for example, a Tj material blade of a turbo molecular pump and a T3
Rotor of wood.
Ａｆｌのブレーシング材を用いて拡散接合したものなど
に相当する。そして、以下に説明する接合部材の亀裂検
出装置は、ターボ分子ポンプのロータ接合部の自動非破
壊検査に使用されて好適のものである。This corresponds to diffusion bonding using Afl bracing material. The apparatus for detecting cracks in a joint member described below is suitable for use in automatic non-destructive inspection of a rotor joint of a turbo-molecular pump.
第１図に示すように、回転体２はチャック１５に把持さ
れ、チャック］５は、割出し盤１６に固定されている。As shown in FIG. 1, the rotating body 2 is held by a chuck 15, and the chuck 5 is fixed to an indexing plate 16.
割出し盤１６には、ステッピングモータ等の駆動機構３
１が連結され、駆動機構３１は、位置決め制御装置３０
に接続しており、これらで接合部材を測定位置に把持す
る手段が構成されている。The indexing board 16 includes a driving mechanism 3 such as a stepping motor.
1 are connected, and the drive mechanism 31 is connected to the positioning control device 30.
These constitute a means for holding the joining member at the measurement position.
１１はセンサで、センサ１１は、−組の給電端子対１１
０（以下単に給電端子という）と−組の測定端子対１１
１ （以下単に測定端子という）とを端子支持部材に係
る基板１１２に装着したものである。11 is a sensor, and the sensor 11 is a negative power supply terminal pair 11.
0 (hereinafter simply referred to as power supply terminal) and - measurement terminal pair 11
1 (hereinafter simply referred to as a measurement terminal) is attached to a substrate 112 related to a terminal support member.
すなわち、第２図にその詳細を示すように、薄板円板１
と回転体２の接合部において、給電端子１、 ｌ Ｏは
、接着層３で示される接合部をまたいで薄板円板１と回
転体２の両面に当接するように配置され、測定端子１１
１は、給電端子の内側に位置して、同様に接合部をまた
いで薄板円板１と回転体２の両面に当接するように配置
されて、絶縁材料からなる基板１１２に支持さきている
。That is, as shown in detail in FIG.
At the joint between the thin disc 1 and the rotating body 2, the power supply terminal 1, lO is arranged so as to touch both surfaces of the thin disc 1 and the rotating body 2 across the joint indicated by the adhesive layer 3, and the measuring terminal 11
1 is located inside the power supply terminal, and is similarly disposed to abut both surfaces of the thin disc 1 and the rotating body 2 across the joint, and is supported by a substrate 112 made of an insulating material.
それぞれの端子１．１０および１１１は、基板１１２に
穿設されている端子取付穴１１５に差し込んであり、各
端子１１０，１．ｉｌの背後には弾性部材に係るばね１
１４が介在している。Each terminal 1.10 and 111 is inserted into a terminal mounting hole 115 drilled in the board 112, and each terminal 110,1. Behind il is a spring 1 related to an elastic member.
14 are intervening.
ばね１１４は、各端子１１０，１．１１を薄板円板１あ
るいは回転体２に均一に押し付ける力をあたえるもので
、測定時に各端子１．］、０．１１１が基板１１２から
不規則に突出することなく、正確な測定ができるよう、
各端子が基板１１２の端子取付穴１１５に埋設する構造
となっている。The spring 114 applies a force that uniformly presses each terminal 110, 1.11 against the thin disc 1 or the rotating body 2, so that each terminal 1. ], 0.111 does not protrude irregularly from the substrate 112 and allows accurate measurement.
Each terminal is embedded in a terminal mounting hole 115 of the board 112.
また、基板１１２は、センサ１１の給電端子１１０およ
び測定端子１１１を接合部材の両部材、すなわち薄板円
板１と回転体２の各面に正しく位置決めできるように、
接合部材の形状に合わせた形状に形成されている。Further, the substrate 112 is arranged so that the power supply terminal 110 and the measurement terminal 111 of the sensor 11 can be correctly positioned on each surface of both members of the joining member, that is, the thin disc 1 and the rotating body 2.
It is formed in a shape that matches the shape of the joining member.
各端子１．１０，１１．１にはリード線１］３が接続し
ており、給電端子１１０は直流電源４】に。A lead wire 1]3 is connected to each terminal 1.10, 11.1, and the power supply terminal 110 is connected to a DC power source 4].
測定端子１１１は微少電圧計４２に接続している。The measurement terminal 111 is connected to a microvoltmeter 42.
直流電源４１には、極性を反転させ、熱起電力等を取り
除くための極性反転装置４０が設けられている。The DC power supply 41 is provided with a polarity reversing device 40 for reversing the polarity and removing thermal electromotive force and the like.
前記センサ１１は、第】図に示すように、薄板円板１を
基準に、その両側の接合部に対称的に設けてあり、これ
ら対をなすセンサ１１はバー１２に固定され、そのバー
１２はストッパー１７に支持されている。As shown in FIG. is supported by a stopper 17.
センサ】１の薄板円板１への押し付は力は、す−ボモー
タ等の駆動機構３２で、また、回転体２への押し付は力
は、駆動機構３３によって与えられる。The force for pressing the sensor 1 against the thin disc 1 is applied by a drive mechanism 32 such as a turbo motor, and the force for pressing the sensor 1 against the rotating body 2 is applied by a drive mechanism 33.
ストッパー１７は、ボール１３−トに移動可能であり、
そのストッパー１７の移動は、駆動機構３４によって行
われる。The stopper 17 is movable to the ball 13-t,
Movement of the stopper 17 is performed by a drive mechanism 34.
これら駆動機構３２，３３．３４は１位置決め制御袋［
１３０に接続され、当該位置決め制御装置３０に制御さ
れて作動するものである。These drive mechanisms 32, 33, 34 have one positioning control bag [
130 and operates under the control of the positioning control device 30.
また、前記ポール１３は、割出し盤１６を設置している
ベース１４に固定されている。Further, the pole 13 is fixed to a base 14 on which an indexing board 16 is installed.
以（１説明したセンサ１１の給電端子１１０は、接合部
材の両部材、すなわち薄板円板］および回転体２の面に
一定の電流を印加するもので、測定端子１１１は、給電
端子１１０で電流を流したときに接合部の亀裂の大きさ
によって変化する電位差を測定するものである。The power supply terminal 110 of the sensor 11 described in 1 applies a constant current to both members of the joining member, that is, the thin plate disc] and the surface of the rotating body 2, and the measurement terminal 111 applies a current at the power supply terminal 110. This method measures the potential difference that changes depending on the size of the crack in the joint when flowing.
測定端子１１１は、前述のとおり微少電圧側４２に接続
されており、第１図に示すように微少電圧計４２の測定
結果は、インターフェイスを介して演算制御装置に係る
コンピュータ４３に取り込まれる。The measurement terminal 111 is connected to the microvoltage side 42 as described above, and as shown in FIG. 1, the measurement results of the microvoltmeter 42 are taken into the computer 43, which is an arithmetic and control device, via an interface.
位置決め制御装置３０もまたインターフェイスを介して
前記コンピュータ４３に接続されており、測定位置が取
り込まれるように構成されている。The positioning control device 30 is also connected to the computer 43 via an interface and is configured to receive measured positions.
コンピュータ４３には、測定結果を記憶する外部記憶装
置４４が接続されている。An external storage device 44 that stores measurement results is connected to the computer 43.
コンピュータ４３に取り込まれた測定データは、亀裂判
定プログラムにより亀裂深さに変換され。The measurement data taken into the computer 43 is converted into a crack depth by a crack determination program.
ディスプレー４５、プロッタ４６およびプリンタ４７に
出力されるように構成されている。It is configured to be output to a display 45, a plotter 46, and a printer 47.
次に、このような接合部材の亀裂検出装置による接合部
材の亀裂検出方法を、先の第１，２図に合わせて第３図
ないし第８図を参照して説明する。Next, a method for detecting cracks in a joining member using such a crack detection device for joining members will be described with reference to FIGS. 3 to 8 in conjunction with FIGS. 1 and 2 above.
ここに第３図ないし第６図は、センサ部の測定回路図で
、第３，４図は、接合部に接着層がなく。3 to 6 are measurement circuit diagrams of the sensor section, and FIGS. 3 and 4 show no adhesive layer at the joint.
第５，６図は接着層のある接合部材に対する測定回路を
示している。5 and 6 show measurement circuits for bonded members with an adhesive layer.
また、第７図および第８図は、電位差比と亀裂深さの較
正曲線の線図で、第７図は、第３図および第４図の測定
回路で電位差を求めた場合、第８図は、第５図および第
６図の測定回路で電位差を求めた場合に用いる較正曲線
線図である。In addition, Figures 7 and 8 are diagrams of calibration curves of potential difference ratio and crack depth. 6 is a calibration curve diagram used when determining a potential difference using the measurement circuits of FIGS. 5 and 6. FIG.
先の第１，２図は、回転体２の２段目の薄板円板１接合
部の亀裂検出を行っている状況を示している。Figures 1 and 2 above show a situation where crack detection is being performed at the joint of the second-stage thin plate disc 1 of the rotating body 2.
位置決め制御装置３０により、駆動機構３１を作動させ
割出し盤１６の位置決めを行う。ストッパー１７も同様
に位置決め制御装置３０により、２段目の薄板円板の高
さに駆動機構３４で調節されて固定する。バー１２は、
一対のセンサー１１が回転体２に接し、かつ、一定の押
し付は力を得る状態に位置決め制御装置３０により駆動
機構３３で制御される。また、前記センサー１１は、さ
らに薄板円板１の両面に対しても一定の押し付は力を得
るために、位置決め制御袋［１３０により、駆動機構３
２で制御される。このときのセンサー１１の測定位置は
、インターフェイスを介してコンピュータ４３に読み込
まれる。The positioning control device 30 operates the drive mechanism 31 to position the indexing board 16. Similarly, the stopper 17 is adjusted and fixed by the drive mechanism 34 to the height of the second-stage thin disk by the positioning control device 30. The bar 12 is
A pair of sensors 11 are in contact with the rotating body 2, and a constant pressing force is controlled by a drive mechanism 33 by a positioning control device 30. In addition, the sensor 11 is connected to the driving mechanism 3 by the positioning control bag [130] in order to obtain a certain pressing force on both sides of the thin disc 1.
Controlled by 2. The measured position of the sensor 11 at this time is read into the computer 43 via the interface.
第２図に示すように被測定部の薄板円板１の接合部には
、直流電源４１から、給電端子］】１を介して一定の電
流を印加し、極性及転装［１４０を用いて一定周期ごと
に極性を反転する。As shown in FIG. 2, a constant current is applied from a DC power source 41 to the joint of the thin disc 1 of the part to be measured through the power supply terminal 1], and the polarity and reversing terminal 140 Reverses the polarity at regular intervals.
このような第１．２図におけるセンサー１］の測定状態
を測定回路図に示したのが第３図である。FIG. 3 is a measurement circuit diagram showing the measurement state of the sensor 1 in FIG. 1.2.
ただし、第３図の例は、薄板円板１と回転体２との間に
接着層３のない接合部材を示している。図中に示した符
号は、第１，２図の符号に合わせてあり、５は接合部に
存在する亀裂を示している。However, the example in FIG. 3 shows a joining member without the adhesive layer 3 between the thin disc 1 and the rotating body 2. The numerals shown in the figure correspond to the numerals in FIGS. 1 and 2, and 5 indicates a crack existing in the joint.
この測定回路によれば、薄板円板１から入力した電流が
すべて薄板円板１と回転体２の接合部を通過するため、
比較的大きな電流密度が確保でき、亀裂深さの変化に対
する電位差変化の感度が大きくとれる。According to this measurement circuit, all the current input from the thin disk 1 passes through the joint between the thin disk 1 and the rotating body 2, so that
A relatively large current density can be secured, and the sensitivity of potential difference changes to changes in crack depth can be increased.
また、回転体１の板厚の影響を受けにくいという特徴が
ある。Further, it has the characteristic that it is not easily affected by the plate thickness of the rotating body 1.
さて、第１図で、測定端子１１１の間に発生する電位差
を微小電圧計４２で測定し、この値をインターフェイス
を介してコンピュータ４３に取り込む。Now, in FIG. 1, the potential difference generated between the measurement terminals 111 is measured with a microvoltmeter 42, and this value is input into the computer 43 via the interface.
コンピュータ４３に取り込まれた測定位置と電位差のデ
ータは、いったん外部記憶装置４４に記憶される。The measurement position and potential difference data taken into the computer 43 are temporarily stored in the external storage device 44.
次に、位置決め制御装置３０により駆動機構３１を制御
し、割出し盤１６の位置を移動して、同様に測定を行い
、これを全周にわたって逐次行う。一つの薄板円板につ
いて測定が終了したのち、センサ１１を位置決め制御装
置３０により自動的に次の薄板円板に移動する。Next, the positioning control device 30 controls the drive mechanism 31 to move the position of the indexing board 16 and perform measurements in the same manner, successively over the entire circumference. After the measurement of one thin disk is completed, the sensor 11 is automatically moved to the next thin disk by the positioning control device 30.
測定終了後、外部記憶装置４４からデータをコンピュー
タ４３に戻し、亀裂深さの演算を行う。After the measurement is completed, the data is returned from the external storage device 44 to the computer 43, and the crack depth is calculated.
このとき、第７図に示すように、予め既知の亀裂から求
めておいた電位差と亀裂深さの較正曲線を用いて亀裂深
さを判定する。At this time, as shown in FIG. 7, the crack depth is determined using a calibration curve of potential difference and crack depth that has been determined in advance from known cracks.
第７図は、横軸に亀裂深さａ （ｗ＋） 、縦軸に電位
差比Ｖｔ ／ｖｏ をとり、測定した電位差比に対する
亀裂深さを較正曲線で判定する線図である。FIG. 7 is a diagram in which the horizontal axis is the crack depth a (w+) and the vertical axis is the potential difference ratio Vt /vo, and the crack depth with respect to the measured potential difference ratio is determined using a calibration curve.
図中の各線は、各線の近くに図示した形状の接合部の亀
裂状態に関する較正曲線である。Each line in the figure is a calibration curve for the crack condition of a joint of the shape illustrated near each line.
実線は、薄板をはさむ接合部の両側に亀裂のある場合で
、薄板の左側の亀裂深さをａｌ、右側の亀裂深さを８２
とし、両側の亀裂深さが等しい、すなわち、ａ、＝＝ａ
ｔ ｒａのときの較正曲線である。The solid line shows the case where there are cracks on both sides of the joint between the thin plates, and the crack depth on the left side of the thin plate is al, and the crack depth on the right side is 82.
and the crack depths on both sides are equal, i.e., a, == a
This is a calibration curve when tra.
また、一点鎖線は、片側亀裂の場合、すなわちａ、＝Ｏ
，ａ２：ａのときの較正曲線である。In addition, the dashed-dotted line indicates the case of a one-sided crack, that is, a, = O
, a2: This is a calibration curve when a2:a.
実線と一点鎖線との間に破線で示したものは、両側亀裂
の場合のデータと片側亀裂の場合のデータとから内挿法
により求めたａ、＝ａ／２、ａ２＝ａのときの較正曲線
である。The dashed line between the solid line and the dashed-dotted line is the calibration when a, = a/2, a2 = a, obtained by interpolation from the data for both-sided cracks and the data for one-sided cracks. It is a curve.
較正曲線には、実験等の実測データのほか数値解析等に
より求めたデータも用いられている。The calibration curve uses not only actual measurement data such as experiments but also data obtained through numerical analysis and the like.
亀裂深さの判定は、一対のセンサ１１により求めた一方
の電位差をｖｌ、他方の電位差を■８、亀裂のないとき
の基準電位差を■。とじたとき、Ｖ、 ／Ｖ、とＶ、
／Ｖ、 （７）大きさカラ第７図に示す較正曲線を内挿
する方法を用いて、コンピュータ４３により演算し、薄
板円板】を回転体２ではさむ接合部の両側に、どの程度
の亀裂が存在するかを求める。To determine the crack depth, the potential difference of one obtained by a pair of sensors 11 is vl, the potential difference of the other is 8, and the reference potential difference when there is no crack is 2. When closed, V, /V, and V,
/V, (7) Calculate by computer 43 using the method of interpolating the calibration curve shown in FIG. Determine whether cracks exist.
このようにして、本実施例によれば、薄板円板１と厚板
の回転体２とを多段に接合した接合部材、例えばターボ
分子ポンプロータのように狭隘な接合部に発生する欠陥
および亀裂の寸法を精度よく検出できる。In this way, according to the present embodiment, defects and cracks that occur in a joint member where a thin disc 1 and a thick rotating body 2 are joined in multiple stages, such as a narrow joint such as a turbo molecular pump rotor, can be avoided. The dimensions of can be detected with high accuracy.
次に、本発明の他の実施例に係る亀裂検出方法を第４図
を参照して説明する。Next, a crack detection method according to another embodiment of the present invention will be explained with reference to FIG.
第４図は、本発明の他の実施例に係る亀裂検出方法の測
定回路図である。FIG. 4 is a measurement circuit diagram of a crack detection method according to another embodiment of the present invention.
第４図の測定回路では、給電端子による直流電流の印加
は、薄板円板１をまたいで両側の回転体２の面へ行って
いる。In the measurement circuit shown in FIG. 4, direct current is applied by the power supply terminal to the surfaces of the rotating body 2 on both sides across the thin disc 1.
また、測定端子は、前記給電端子の内側に、薄板円板１
および接合部をまたいで両側の回転体２の面に当接させ
るものと、一方の回転体２と薄板円板１、他方の回転体
２と薄板円板１に当接させるようにしている。Further, the measurement terminal is provided with a thin disc 1 inside the power supply terminal.
The rotating body 2 and the thin disc 1 on one side are brought into contact with each other, and the rotating body 2 and the thin disc 1 on the other side are brought into contact with each other across the joint.
図に示すように、一方の接合部の回転体２と薄板円板１
との電位差をＶ、とし、他方の接合部の回転体２と薄板
円板１との電位差をｖ２とし、両側の回転体２間の電位
差をＶ、として、この電位差ｖ３から較正曲線を用いて
全体の亀裂深さをコンピュータ４３の演算により求め、
電位差Ｖ、とｖ２の比から前記全体の亀裂を一方の接合
部と他方の接合部との亀裂深さに分配することで、薄板
円板接合部の両側に発生した亀裂深さを判定できる。As shown in the figure, the rotating body 2 and the thin disk 1 at one joint
Let the potential difference between the rotating body 2 and the thin disk 1 at the other joint be V2, and the potential difference between the rotating bodies 2 on both sides as V, and use the calibration curve from this potential difference v3. The total crack depth is calculated by the computer 43,
By distributing the overall crack to the crack depth between one joint and the other joint from the ratio of the potential differences V and v2, the depth of the crack occurring on both sides of the thin plate disc joint can be determined.
第４図の測定回路によれば、直流電流は亀裂５の亀裂面
に直角方向に流れるため、亀裂の検出精度が向上する。According to the measurement circuit shown in FIG. 4, since the direct current flows in a direction perpendicular to the crack surface of the crack 5, the crack detection accuracy is improved.
次に、本発明のさらに他の実施例を第５図ないし第８図
を参照して説明する。Next, still another embodiment of the present invention will be described with reference to FIGS. 5 to 8.
第５図および第６図は、本発明のさらに他の実施例に係
る亀裂検出方法の測定回路図である。5 and 6 are measurement circuit diagrams of a crack detection method according to still another embodiment of the present invention.
第５，６図では、薄板円板１と両側の回転体２との間に
それぞれ接着層３があり、一方の接合部の回転体２と接
着層３との接着面に亀裂５１、接着層３と薄板円板１と
の接着面に亀裂５２．他方の接合部の薄板円板］と接着
層３との接着面に亀裂５３、接着層３と回転体２との接
着面に亀裂５４が発生している接合部材を示しており、
これに対し、第５図は、次の第３図に示した測定回路、
第６図は、先の第４図に示した測定回路を適用したもの
である。In FIGS. 5 and 6, there is an adhesive layer 3 between the thin disc 1 and the rotating body 2 on both sides, and there is a crack 51 on the adhesive surface between the rotating body 2 and the adhesive layer 3 at one joint, and the adhesive layer A crack 52. The figure shows a bonded member in which a crack 53 has occurred on the bonding surface between the thin plate disc of the other bonded portion and the adhesive layer 3, and a crack 54 has occurred on the bonding surface between the adhesive layer 3 and the rotating body 2,
On the other hand, FIG. 5 shows the measurement circuit shown in FIG.
FIG. 6 shows an application of the measurement circuit shown in FIG. 4 above.
第８図は、横軸に亀裂深さａ （ｉａ） 、縦軸に電位
差比Ｖ、 ／Ｖ、をとり、第５，６図の測定回路で、接
合部に接着層のある接合部材の電位差を求めた場合の、
測定した電位差比に対する亀裂深さを較正曲線で判定す
る線図である。Figure 8 shows the crack depth a (ia) on the horizontal axis and the potential difference ratio V, /V on the vertical axis. If you ask for
FIG. 4 is a diagram for determining the crack depth with respect to the measured potential difference ratio using a calibration curve.
図中の各線は、各線の近くに図示した形状の接合部の亀
裂状態に関する較正曲線である。Each line in the figure is a calibration curve for the crack condition of a joint of the shape illustrated near each line.
実線には、第５，６図に示す亀裂５２．５３の存在する
場合の較正曲線、実線Ｉ、は、その亀裂が片側にのみあ
る場合の較正曲線、実ｆｉＭは、第５゜６図に示す亀裂
５１．５４の存在する場合の較正曲線である。The solid line shows the calibration curve in the case where cracks 52 and 53 shown in Figs. 5 is a calibration curve in the presence of cracks 51 and 54 shown in FIG.
第５，６図に示す接着層３の電気的性質は、薄板円板１
と接着層３との接着部と、回転体２と接着層３との接着
部とで異なっている。そこで、第５図の測定回路を用い
て亀裂の検出を行った場合には、亀裂深さと電位差との
関係は第８図のようになり、亀裂５２および５３につい
ては大きな感度を持つことがわかる。The electrical properties of the adhesive layer 3 shown in FIGS.
and the adhesive layer 3, and the adhesive portion between the rotating body 2 and the adhesive layer 3 are different. Therefore, when cracks are detected using the measurement circuit shown in Fig. 5, the relationship between crack depth and potential difference becomes as shown in Fig. 8, and it can be seen that cracks 52 and 53 have high sensitivity. .
このことから、薄板円板１と両側の回転体２との間にそ
れぞれ接着層３がある接合部材の亀裂検出方法としては
、次の２段階の測定を行ろ。From this, as a method for detecting cracks in a bonded member in which adhesive layers 3 are provided between the thin disc 1 and the rotating bodies 2 on both sides, the following two steps of measurement should be performed.
まず、第５図の測定回路を用いて、一方の電位差をｖ１
′、他方の電位差をｖ２′、亀裂のないときの基準電位
差をＶ。′ としたとき、■、′／Ｖ 、 ｒ とＶ
、’ ／Ｖｏ’ １７）大キサカラ、亀裂５２およ
び５３の寸法を判定する。First, using the measurement circuit shown in Figure 5, measure the potential difference of one side by v1.
', the other potential difference is v2', and the reference potential difference when there is no crack is V. ′, ■, ′/V, r and V
, '/Vo' 17) Determine the dimensions of the large cracks, cracks 52 and 53.
次に、この結果を考慮して、第６図の測定回路を用い、
一方の接合部の回転体２と薄板円板１との電位差をＶ
、 Ｉ とし、他方の接合部の回転体２と薄板円板１
との電位差をＶ 、ｌ とし、両側の間中
転体２間の電位差をＶ ３ ’ として、この電位差
ｖ３′ から亀裂５１．５４の全体の亀１裂深さを求
め、電位差Ｖ 、 Ｉ とｖ２′ の比から前記全
体の亀裂深さを亀裂５１．５４の各深さに分配して、亀
裂５１および５４の寸法が判定できる。Next, considering this result, using the measurement circuit shown in Figure 6,
The potential difference between the rotating body 2 and the thin disk 1 at one joint is V
, I, and the rotating body 2 and the thin disk 1 at the other joint
Assuming that the potential difference between V and I is V3', and the potential difference between the intermediate rollers 2 on both sides as V3', the entire crack depth of the crack 51.54 is determined from this potential difference v3', and the potential difference V, I and From the ratio of v2', the dimensions of cracks 51 and 54 can be determined by distributing the total crack depth to each depth of cracks 51,54.
次に、他のセンサ構造について第９図を参照して説明す
る。Next, another sensor structure will be explained with reference to FIG. 9.
第９図〜第１１図は、本発明のさらに他の実施例に係る
亀裂検出装置のセンサ部の軸承構成図で、第９図は正面
図、第１０図は第９図のＸ−Ｘ断面図、第１１図は第９
図の」二面図である。9 to 11 are shaft bearing configuration diagrams of a sensor section of a crack detection device according to still another embodiment of the present invention, in which FIG. 9 is a front view and FIG. 10 is a cross section taken along the line X-X in FIG. 9. Figure 11 is the 9th
This is a two-sided view of the figure.
このセンサ１１′は、給電端子１１０′を３個、基板１
１２′に周方向に沿って配置したものである。This sensor 11' has three power supply terminals 110' and a board 1.
12' along the circumferential direction.
基板１１２′は、接合部材の回転体２の外周に合わせた
形状に形成されている。The substrate 112' is formed in a shape that matches the outer periphery of the rotating body 2 of the joining member.
このように、給電端子を複数個設けることにより、測定
領域に均一な電流場が形成できるため、隣接した部分の
欠陥の影響を受けにくく精度の良い亀裂検出が可能であ
る。By providing a plurality of power supply terminals in this way, a uniform current field can be formed in the measurement area, making it possible to detect cracks with high precision without being easily affected by defects in adjacent parts.
次に、第１２図は、実際に第１．２図に示した接合部材
の亀裂検出方法およびその装置を用いて亀裂検出を行っ
た結果の一例を示した線図である。Next, FIG. 12 is a diagram showing an example of the results of actually performing crack detection using the method and apparatus for detecting cracks in bonded members shown in FIG. 1.2.
横軸に実際の亀裂寸法ａ（ｍ）、縦軸に本実施例の直流
ポテンシャル法により判定された寸法ａｐ（ｍ＝）をと
り、各データをプロワ１〜したもので、本システ１１の
亀裂検出精度は±０．３ｍｍの高精度であることが確か
められた。The horizontal axis is the actual crack size a (m), and the vertical axis is the dimension ap (m=) determined by the DC potential method of this example. It was confirmed that the detection accuracy was as high as ±0.3 mm.
なお、前記の各実施例では、接合部材としてターボ分子
ポンプロータに代表される。薄板円板を回転体ではさん
で多段に接合したものを測定対象として説明したが、本
発明の適用対象はこれに限るものでなく、同等の効果が
期待される。薄板をはさんで両側に厚板を接合する形状
のものを複数段接合してなる接合部材の、狭隘な接合部
の亀裂検出に汎用的に適用できるものである。In each of the above embodiments, the joining member is represented by a turbo molecular pump rotor. Although the object to be measured is described as a measurement object in which thin disks are sandwiched between rotating bodies and joined in multiple stages, the object to which the present invention is applied is not limited to this, and similar effects are expected. The present invention can be generally applied to detecting cracks in narrow joints of joint members formed by joining multiple stages of thin plates with thick plates on both sides.
また１本発明の亀裂検出装置の名部の構造、例えば接合
部材を測定泣言に把持する手段、センサの形状、センサ
の位置決め手段等は前記の実施例の機構、構造に限るも
のではなく、同等の効果が期待される他の機構、構造の
採用を妨げない。Furthermore, the structure of the main parts of the crack detection device of the present invention, such as the means for gripping the joining member for measurement, the shape of the sensor, the means for positioning the sensor, etc., is not limited to the mechanism and structure of the above-mentioned embodiments. This does not preclude the adoption of other mechanisms or structures that are expected to have equivalent effects.
以上説明したように、本発明によれば、接合部材の狭隘
な接合部に発生する欠陥および亀裂の深さを精度よく検
出しうる接合部材の亀裂検出方法およびその装置を提供
することができる。As described above, according to the present invention, it is possible to provide a method and apparatus for detecting cracks in bonded members that can accurately detect defects and crack depths occurring in narrow joints of bonded members.
第１図は、本発明の一実施例に係る接合部材の亀裂検出
装置の全体構成図、第２図は、第１図の装置のセンサ部
の詳細断面図、第３図は、第２図のセンサ部の測定回路
図、第４図は、本発明の他の実施例に係る亀裂検出方法
の測定回路図、第５図および第６図は５本発明のさらに
他の実施例に係る亀裂検出方法の測定回路図、第７図は
、第３図および第４図の測定回路で電位差を求めた場合
の較正曲線線図、第８図は、第５図および第６図の測定
回路で電位差を求めた場合の較正曲線線図、第９図〜第
１１図は、本発明のさらに他の実施例に係る亀裂検出装
置のセンサ部の軸承構成図で、第９図は正面図、第１０
図は第９図のＸ−Ｘ断面図５第１１図は第９図の上面図
、第１２図は、第１．２図の接合部材の亀裂検出方法お
よびその装置を用いて亀裂検出を行った結果の一例を示
す線図、第１３図は、検査対象となる一般的な接合部材
の構成図である。
１・・・薄板円板、２・・・回転体、３・・・接着層、
５゜５１．５２，５３．５４・・・亀裂、１１，１．１
’・・・センサ、１１．０．１１０’・・・給電端子、
１１１゜１１１′・・・測定端子、１１２，１．１．２
’・・・基板、１１３・・・リード線、１】４・・・ば
ね、１４・・・ベース、１５・・・チャック、１６・・
・割出し盤、１７・・・ストッパ、３０・・・位置決め
制御装置、３］、３２，３３゜３４・・・駆動機構、４
１・・・直流電源、４２・・・微少電圧計、４３・・・
コンピュータ、４４・・・外部記憶装置、４５・・・テ
ィスプレー、４６・・・プロッタ、４７・・・プ舅 １
図
第 Ｚ 図
第 ３ 図
！
第 ５ 図
）夕 乙 図
万７図
θ ／ ２ ３
１裂５子２久（Ｑ９ジ
第 ３ 図
ρ ｌ ２ ．３
Ｎ裂ｊ１久（、ｒｒＬゎジ
・・Ｃへｉ
第 １２ 図
？
θ １２ ３FIG. 1 is an overall configuration diagram of a crack detection device for joining members according to an embodiment of the present invention, FIG. 2 is a detailed cross-sectional view of the sensor section of the device in FIG. 1, and FIG. 3 is a diagram in FIG. FIG. 4 is a measurement circuit diagram of a crack detection method according to another embodiment of the present invention, and FIGS. The measurement circuit diagram of the detection method, Figure 7 is a calibration curve diagram when the potential difference is determined with the measurement circuits of Figures 3 and 4, and Figure 8 is the measurement circuit diagram of the measurement circuits of Figures 5 and 6. 9 to 11 are diagrams of the calibration curve when determining the potential difference, and FIGS. 10
Figure 11 is a top view of Figure 9, and Figure 12 is a crack detection method using the method and device for detecting cracks in joint members as shown in Figure 1.2. FIG. 13, a diagram showing an example of the results, is a configuration diagram of a general joint member to be inspected. 1... Thin disc, 2... Rotating body, 3... Adhesive layer,
5゜51.52,53.54...crack, 11,1.1
'...sensor, 11.0.110'...power supply terminal,
111゜111'...Measuring terminal, 112, 1.1.2
'...Substrate, 113...Lead wire, 1]4...Spring, 14...Base, 15...Chuck, 16...
- Indexing board, 17... Stopper, 30... Positioning control device, 3], 32, 33° 34... Drive mechanism, 4
1... DC power supply, 42... Micro voltmeter, 43...
Computer, 44...External storage device, 45...Display, 46...Plotter, 47...Princess 1
Figure Z Figure 3! Fig. 5) Evening Otsu Fig. Man 7 Fig. θ / 2 3 1 split 5 child 2 Ku (Q9 Ji 3rd Fig. ρ l 2 .3 N split j 1 Ku (, rrLゎji... to C i Fig. 12? θ 12 3
Claims (1)
複数段接合してなる接合部材の、接合部に発生する亀裂
を検出する方法であつて、一定の電流を印加する給電端
子を、接合部をまたいで接合部材の両部材面に当接させ
、亀裂の大きさによつて変化する電位差を測定する測定
端子を、前記給電端子の内側に、前記接合部をまたいで
前記接合部材の両部材面に当接させ、前記給電端子に電
流を流して前記測定端子の電位差を測定し、その測定し
た電位差から演算制御装置の演算により亀裂深さを自動
的に判定することを特徴とする接合部材の亀裂検出方法
。 ２、特許請求の範囲第１項記載の方法において、給電端
子は、接合部をまたいで薄板と厚板の両面に当接させ、
測定端子は、前記給電端子の内側に、同様に接合部をま
たいで薄板と厚板の両面に当接させ、これらと同じもの
を薄板を基準にして反対側の接合部にも対称的に設け、
同時に両側の給電端子に電流を流して各測定端子の電位
差を測定するようにした接合部材の亀裂検出方法。 ３、特許請求の範囲第１項記載の方法において、給電端
子は、薄板および接合部をまたいで両側の厚板面に当接
させ、測定端子は、前記給電端子の内側に、接合部をま
たいで両側の厚板面に当接させるものと、一方の厚板と
薄板、他方の厚板と薄板に当設させるようにし、一方の
接合部の厚板と薄板との電位差をＶ＿１とし、他方の接
合部の厚板と薄板との電位差をＶ＿２とし、両側の厚板
面間の電位差をＶ＿３として、この電位差Ｖ＿３から全
体の亀裂深さを判定し、前記電位差Ｖ＿１とＶ＿２の比
から前記全体の亀裂深さを一方の接合部と他方の接合部
との亀裂深さに分配して判定するようにした接合部材の
亀裂検出方法。 ４、薄板をはさんで両側に厚板を接合する形状のものを
複数段接合してなる接合部材の、接合部に発生する亀裂
を検出する装置であつて、前記接合部材を測定位置に把
持する手段と、接合部をまたいで接合部材の両部材面に
当接させ一定の電流を印加する給電端子と、前記給電端
子の内側に位置にし接合部をまたいで前記接合部材の両
部材面に当接させ、亀裂の大きさによつて変化する電位
差を測定する測定端子とを、端子支持部材に装着してな
るセンサと、このセンサを測定位置に位置決めする手段
と、測定した電位差から亀裂深さを自動的に判定する演
算制御装置とを備えたことを特徴とする接合部材の亀裂
検出装置。 ５、特許請求の範囲第４項記載のものにおいて、センサ
の給電端子および測定端子を、接合部材の各面に均一な
力で当接せしめ、かつ測定時に各端子が端子支持部材か
ら不規則に突出しないように、端子支持部材に端子取付
け穴を設け、前記各端子を弾性部材を介して前記端子支
持部材の端子取付け穴に装着したものである接合部材の
亀裂検出装置。 ６、特許請求の範囲第４項または第５項記載のもののい
ずれかにおいて、センサの給電端子および測定端子を、
接合部材の両部材面に正しく位置決めしうるように、端
子支持部材を接合部材の形状に合わせた形状に形成した
ものである接合部材の亀裂検出装置。[Claims] 1. A method for detecting cracks that occur at the joint of a joint member formed by joining a plurality of thin plates and thick plates on both sides, the method comprising: A power supply terminal that applies a current is brought into contact with both surfaces of the joint members across the joint, and a measurement terminal that measures the potential difference that changes depending on the size of the crack is placed inside the power supply terminal of the joint. The crack depth is automatically calculated by a calculation by an arithmetic and control device based on the measured potential difference. 1. A method for detecting cracks in a joined member, the method comprising determining: 2. In the method described in claim 1, the power supply terminal is brought into contact with both sides of the thin plate and the thick plate across the joint,
The measurement terminals are placed inside the power supply terminal in contact with both sides of the thin plate and the thick plate similarly across the joint, and the same terminals are provided symmetrically at the joint on the opposite side with respect to the thin plate. ,
A method for detecting cracks in bonded members in which a current is simultaneously passed through the power supply terminals on both sides and the potential difference between each measurement terminal is measured. 3. In the method described in claim 1, the power supply terminal is placed in contact with the thick plate surfaces on both sides, straddling the thin plate and the joint, and the measurement terminal is placed inside the power supply terminal, straddling the joint. The one that comes into contact with the thick plate surfaces on both sides, the one thick plate and the thin plate, and the other thick plate and the thin plate, and the potential difference between the thick plate and the thin plate at one joint is V_1, and the other The potential difference between the thick plate and the thin plate at the joint of is V_2, the potential difference between the thick plate surfaces on both sides is V_3, the overall crack depth is determined from this potential difference V_3, and the overall crack depth is determined from the ratio of the potential differences V_1 and V_2. A method for detecting cracks in a joint member, in which the crack depth of a joint member is determined by dividing the crack depth between one joint part and the other joint part. 4. A device for detecting cracks occurring in the joint of a joint member formed by joining a plurality of thin plates with thick plates on both sides, the apparatus gripping the joint member at a measurement position. a power supply terminal that is placed inside the power supply terminal and is placed in contact with both surfaces of the joint member across the joint and applies a constant current; A sensor is provided with a measuring terminal attached to a terminal support member, which measures a potential difference that changes depending on the size of a crack, a means for positioning the sensor at a measuring position, and a means for determining the crack depth from the measured potential difference. 1. A crack detection device for a bonded member, comprising: a calculation control device that automatically determines the crack size. 5. In the device described in claim 4, the power supply terminal and the measurement terminal of the sensor are brought into contact with each surface of the joining member with uniform force, and each terminal is irregularly separated from the terminal support member during measurement. 1. A crack detection device for a joining member, wherein terminal mounting holes are provided in a terminal support member so as not to protrude, and each terminal is mounted in the terminal mounting hole of the terminal support member via an elastic member. 6. In either of claims 4 or 5, the power supply terminal and measurement terminal of the sensor are
A crack detection device for a joining member, in which a terminal support member is formed in a shape that matches the shape of the joining member so that it can be correctly positioned on both member surfaces of the joining member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23497084A JPS61114154A (en) | 1984-11-09 | 1984-11-09 | Method and device for detecting crack in joined member |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23497084A JPS61114154A (en) | 1984-11-09 | 1984-11-09 | Method and device for detecting crack in joined member |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61114154A true JPS61114154A (en) | 1986-05-31 |
| JPH0582548B2 JPH0582548B2 (en) | 1993-11-19 |
Family
ID=16979102
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23497084A Granted JPS61114154A (en) | 1984-11-09 | 1984-11-09 | Method and device for detecting crack in joined member |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61114154A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010145375A (en) * | 2008-12-22 | 2010-07-01 | Chubu Electric Power Co Inc | Method and apparatus for measuring crack in corner section |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4322945Y1 (en) * | 1965-06-10 | 1968-09-27 | ||
| JPS50112093A (en) * | 1974-02-12 | 1975-09-03 |
-
1984
- 1984-11-09 JP JP23497084A patent/JPS61114154A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4322945Y1 (en) * | 1965-06-10 | 1968-09-27 | ||
| JPS50112093A (en) * | 1974-02-12 | 1975-09-03 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0582548B2 (en) | 1993-11-19 |
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