JPS61112650U - - Google Patents
Info
- Publication number
- JPS61112650U JPS61112650U JP19639784U JP19639784U JPS61112650U JP S61112650 U JPS61112650 U JP S61112650U JP 19639784 U JP19639784 U JP 19639784U JP 19639784 U JP19639784 U JP 19639784U JP S61112650 U JPS61112650 U JP S61112650U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- bending portion
- lead bending
- reducing
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims 2
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案ＩＣのリード構造の一実施例を
示す斜視図、第２図、第３図はそれぞれ本考案リ
ード構造の他の実施例を示す斜視図、第４図は従
来のリード付きチツプキヤリアのＩＣパツケージ
を示しａは平面図、ｂは側面図、第５図は第４図
ｂのＡ部拡大図、第６図、第７図は従来のＩＣの
リード構造を示す斜視図である。
１……モールドパツケージ、２……リード、３
ａ……凹部。
Fig. 1 is a perspective view showing one embodiment of the lead structure of the IC of the present invention, Figs. 2 and 3 are perspective views showing other embodiments of the lead structure of the invention, and Fig. 4 is a conventional IC with leads. 5 is an enlarged view of part A in FIG. 4b, and FIGS. 6 and 7 are perspective views showing the lead structure of a conventional IC. . 1...Mold package, 2...Lead, 3
a... Concavity.
Claims (1)
の板厚を薄くした凹部を設けたことを特徴とする
ＩＣのリード構造。 A lead structure for an IC, characterized in that a concave portion is provided in the lead bending portion of the IC by reducing the plate thickness of the lead bending portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19639784U JPS61112650U (en) | 1984-12-27 | 1984-12-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19639784U JPS61112650U (en) | 1984-12-27 | 1984-12-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61112650U true JPS61112650U (en) | 1986-07-16 |
Family
ID=30754150
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19639784U Pending JPS61112650U (en) | 1984-12-27 | 1984-12-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61112650U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011018933A (en) * | 2010-09-16 | 2011-01-27 | Mitsubishi Electric Corp | Semiconductor device, and method of manufacturing the same |
| JP2019197777A (en) * | 2018-05-08 | 2019-11-14 | 富士電機株式会社 | Terminal structure and semiconductor module |
-
1984
- 1984-12-27 JP JP19639784U patent/JPS61112650U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011018933A (en) * | 2010-09-16 | 2011-01-27 | Mitsubishi Electric Corp | Semiconductor device, and method of manufacturing the same |
| JP2019197777A (en) * | 2018-05-08 | 2019-11-14 | 富士電機株式会社 | Terminal structure and semiconductor module |