JPS61105854A - Wafer chuck - Google Patents
Wafer chuckInfo
- Publication number
- JPS61105854A JPS61105854A JP22838084A JP22838084A JPS61105854A JP S61105854 A JPS61105854 A JP S61105854A JP 22838084 A JP22838084 A JP 22838084A JP 22838084 A JP22838084 A JP 22838084A JP S61105854 A JPS61105854 A JP S61105854A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- chuck
- base
- positions
- lever
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manipulator (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、半導体製造装置においてウェハを保持するた
めに使用されるウェハチャックに関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a wafer chuck used for holding a wafer in semiconductor manufacturing equipment.
アライナ−、コーター、プローバー等の各種半導体製造
装置においては、露光、レジスト塗布。Exposure and resist coating in various semiconductor manufacturing equipment such as aligners, coaters, and probers.
プロービング等の作業をおこなうためにウェハをチャッ
クによって保持し、前述の種々の作業が終わった後ウェ
ハはチャックから搬出される。The wafer is held by a chuck for operations such as probing, and after the various operations described above are completed, the wafer is removed from the chuck.
従ってチャックはたんにウェハを吸着する機能を備える
だけでなく、ウェハを搬出し易い機構を有することが望
ましい。従来このようなウェハを搬出し易くする機構を
備えたチャックとしてベルヌーイ方式、エアー搬出方式
およびウェハーリフト方式の３つのものが知られている
。Therefore, it is desirable that the chuck not only have the function of simply adsorbing the wafer, but also have a mechanism that facilitates ejecting the wafer. Three types of chucks are conventionally known, including a Bernoulli type, an air unloading type, and a wafer lift type, as chucks equipped with a mechanism for facilitating the unloading of wafers.
ベルヌーイ方式のチャックはウェハの面上に空気を流し
負圧とすることによってウェハを浮上させるような構造
を有している。この場合空気をウェハの面上に大量に吹
き付けるためごみが付着するおそれがあり好ましくない
。The Bernoulli chuck has a structure in which the wafer is levitated by flowing air over the surface of the wafer to create a negative pressure. In this case, since a large amount of air is blown onto the surface of the wafer, there is a risk that dust will adhere to it, which is not preferable.
次にエアー搬出方式の場合には同じくウェハを空気によ
って浮上させ、更に別途設けられた空気放出装置から空
気を浮上したウェハに吹付けることにより、ウェハをチ
ャックから取出すものである。この場合ウェハの位置が
不安定となるためウェハカセットにウェハをもどす前に
再びウェハの位置決めを行なわなければならない。Next, in the case of the air carry-out method, the wafer is similarly levitated by air, and then air is blown onto the levitated wafer from a separately provided air release device to remove the wafer from the chuck. In this case, the position of the wafer becomes unstable, and the wafer must be positioned again before being returned to the wafer cassette.
最後にウェハーリフト方式のチャックは、リフｉ・によ
ってウェハをチャックから持上げた状態でウェハの裏面
にハンドを挿入してウェハを搬出する。この場合ウェハ
チャック内部にリフト機構を備える必要があり、チャッ
ク内部の構造が複雑になる。又チャックを外部と電気的
に絶縁する必要がある場合リフト機構が妨げとなる。更
にはチャックを温度制御する必要がある場合リフト機構
によって均一な温度制御が困難となってしまう。Finally, in the wafer lift type chuck, the wafer is lifted from the chuck by the lift i, and a hand is inserted into the back surface of the wafer to carry out the wafer. In this case, it is necessary to provide a lift mechanism inside the wafer chuck, which complicates the structure inside the chuck. Furthermore, the lift mechanism becomes an obstacle when it is necessary to electrically insulate the chuck from the outside. Furthermore, if it is necessary to control the temperature of the chuck, the lift mechanism makes uniform temperature control difficult.
本発明の目的は、上述の欠点のないウェハを搬出し易く
するための簡単な機構を備えたウェハチャックを提供す
ることにある。本発明のウェハチャックは、従来のウェ
ハリフト方式のチャックを改良したもので、簡単なレバ
ー構造のウェハーリフト機構を有するだけでウェハーを
チャックから搬出し易くすることができる。SUMMARY OF THE INVENTION An object of the present invention is to provide a wafer chuck that does not have the above-mentioned drawbacks and has a simple mechanism for facilitating wafer unloading. The wafer chuck of the present invention is an improved version of the conventional wafer lift type chuck, and can easily carry out the wafer from the chuck by simply having a wafer lift mechanism with a simple lever structure.
次に添付の図面を参照して本発明の好ましい実施例につ
いて説明する。第１図および第２図はそれぞれ、本発明
の好ましい実施例に従って構成されたウェハチャックｌ
の平面図および断面図である。チャック１はウェハ２を
載置させる面３を備えたベース部材４から構成され、こ
のベース部材４には中心角が１２０度をなすような位置
に貫通孔５が３つ形成されている。Preferred embodiments of the invention will now be described with reference to the accompanying drawings. FIGS. 1 and 2 each illustrate a wafer chuck l constructed in accordance with a preferred embodiment of the present invention.
FIG. The chuck 1 is composed of a base member 4 having a surface 3 on which a wafer 2 is placed, and three through holes 5 are formed in the base member 4 at positions having a central angle of 120 degrees.
ベース部材４の裏側には支点６を中心として回動するレ
バー部材７が３つ設置されている。レバー部材７は、ベ
ース−Ｌに載置されたウェハ２と当接する端部８と、不
図示のウェハハンドのレバー押し下げ部と当接する端部
９とを有している。端部８は通常ベース４の」−面３よ
り引込んだ位置にあるが、ハンドのレバー押し下げ部（
不図示）によって端部９が押し下げられるとレバー部材
７は支点６を中心として回動するため、ベース４の上面
３から突出する。このためウェハ２とベース部材４の上
面３との間に空間が形成され、ウェハ２をチャックｌか
ら搬出し易くなる。Three lever members 7 that rotate about a fulcrum 6 are installed on the back side of the base member 4. The lever member 7 has an end 8 that comes into contact with the wafer 2 placed on the base L, and an end 9 that comes into contact with a lever pressing part of a wafer hand (not shown). The end portion 8 is normally located at a recessed position from the − face 3 of the base 4, but it is
When the end portion 9 is pushed down by the lever member 7 (not shown), the lever member 7 rotates about the fulcrum 6, so that it protrudes from the upper surface 3 of the base 4. Therefore, a space is formed between the wafer 2 and the upper surface 3 of the base member 4, making it easier to carry out the wafer 2 from the chuck l.
第３図は本発明の他の実施例に従って構成されたウェハ
チャックの平面図である。第１図に示されたチャックと
同じく、ウェハ２を載置ぎせる面３を備えたベース部材
４から構成され、このベース部材４には中心角が１２０
度をなすような位置に貫通孔５が３つ形成されている。FIG. 3 is a plan view of a wafer chuck constructed in accordance with another embodiment of the invention. Like the chuck shown in FIG.
Three through holes 5 are formed at diagonal positions.
第１図のレバー部材７は中心角が１２０度をなすように
放射状に延びているが、第３図の場合レバー部材７は隣
接して位置するように、両側に位１ｉ￥したレバー部材
７の寸法は中央のレバー部材７の寸法より長い。又両側
のレバー部材の形状は屈曲している。The lever members 7 in FIG. 1 extend radially so that the central angle forms 120 degrees, but in FIG. is longer than that of the central lever member 7. Further, the shapes of the lever members on both sides are bent.
第３図の場合においてもレバー部材７は、ベースＩ−に
載置されたウェハ２と当接する端部８と、不図示のウェ
ハハンドのレバー押し下げ部と当接する端部９とを有し
ている。端部８は通常ベースの」二面３より引込んだ位
置にあるが、ハンドのレバー押し下げ部（不図示）によ
って端部９が押し下げられるとレバー部材７は支点６を
中心とじて回動するため、ベースの−１−面３から突出
する。このためウェハ２とベース部材の」二面３との間
に空間が形成され、ウェハ２をチャックｌから搬出し易
くなる。Also in the case of FIG. 3, the lever member 7 has an end 8 that comes into contact with the wafer 2 placed on the base I-, and an end 9 that comes into contact with the lever pressing part of the wafer hand (not shown). There is. The end portion 8 is normally in a retracted position from the second surface 3 of the base, but when the end portion 9 is pushed down by a lever depressing portion (not shown) of the hand, the lever member 7 rotates around the fulcrum 6. Therefore, it protrudes from the -1- plane 3 of the base. Therefore, a space is formed between the wafer 2 and the second surface 3 of the base member, making it easier to carry out the wafer 2 from the chuck l.
以」−説明したとおり本発明においては従来のウェハー
リフト方式チャックで困難であったチャックの絶縁の問
題を、ウェハーリフトの駆動源をチャック外部に設ける
ことによって解決し、又チャック上面が均一な平面板で
構成可能なため均一な温度制御も容易に達成できる。As explained above, the present invention solves the problem of chuck insulation, which was difficult with conventional wafer lift type chucks, by providing the driving source for the wafer lift outside the chuck, and also makes the upper surface of the chuck uniform and flat. Since it can be configured with a face plate, uniform temperature control can be easily achieved.
第１図および第２図はそれぞれ本発明の第１の実施例に
従って構成されたウェハチャックの平面図および断面図
である。
第３図は本発明の第２の実施例に従って構成されたウェ
ハチャックの平面図である。
１−−−チャック ２−−−ウェハ３−−一面
４−−−ベース５−−一孔
６−−−支点７−一一レバー1 and 2 are a plan view and a cross-sectional view, respectively, of a wafer chuck constructed in accordance with a first embodiment of the present invention. FIG. 3 is a plan view of a wafer chuck constructed in accordance with a second embodiment of the present invention. 1---Chuck 2---Wafer 3---One side
4---Base 5---One hole
6---Fulcrum 7-11 Lever
Claims (1)
ベースの上面より引込んだ位置との間を移動可能な端部
を有するレバー部材とから構成されることを特徴とする
ウェハチャック。 ２、前記貫通孔およびレバー部材はそれぞれ３つ設けら
れることを特徴とする特許請求の範囲第１項記載のウェ
ハチャック。 ３、前記貫通孔はベースを均等に３分割した線上に位置
することを特徴とする特許請求の範囲第２項記載のウェ
ハチャック。[Claims] 1. A base configured to place a wafer; a through hole formed in the base; and a position protruding from the upper surface of the base through the through hole;
A wafer chuck comprising: a lever member having an end portion that is movable between a position retracted from the upper surface of the base and a position retracted from the upper surface of the base. 2. The wafer chuck according to claim 1, wherein three through holes and three lever members are provided. 3. The wafer chuck according to claim 2, wherein the through hole is located on a line that equally divides the base into three parts.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22838084A JPS61105854A (en) | 1984-10-30 | 1984-10-30 | Wafer chuck |
| US06/792,584 US4747608A (en) | 1984-10-30 | 1985-10-29 | Wafer chuck |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22838084A JPS61105854A (en) | 1984-10-30 | 1984-10-30 | Wafer chuck |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61105854A true JPS61105854A (en) | 1986-05-23 |
Family
ID=16875555
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22838084A Pending JPS61105854A (en) | 1984-10-30 | 1984-10-30 | Wafer chuck |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61105854A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5350427A (en) * | 1993-06-14 | 1994-09-27 | Varian Associates, Inc. | Wafer retaining platen having peripheral clamp and wafer lifting means |
| US5431700A (en) * | 1994-03-30 | 1995-07-11 | Fsi International, Inc. | Vertical multi-process bake/chill apparatus |
-
1984
- 1984-10-30 JP JP22838084A patent/JPS61105854A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5350427A (en) * | 1993-06-14 | 1994-09-27 | Varian Associates, Inc. | Wafer retaining platen having peripheral clamp and wafer lifting means |
| WO1994029036A1 (en) * | 1993-06-14 | 1994-12-22 | Varian Associates, Inc. | Wafer retaining platen and lifting means |
| US5431700A (en) * | 1994-03-30 | 1995-07-11 | Fsi International, Inc. | Vertical multi-process bake/chill apparatus |
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