JPS6099557U - Multicolor light emitting semiconductor device - Google Patents
Multicolor light emitting semiconductor deviceInfo
- Publication number
- JPS6099557U JPS6099557U JP19030383U JP19030383U JPS6099557U JP S6099557 U JPS6099557 U JP S6099557U JP 19030383 U JP19030383 U JP 19030383U JP 19030383 U JP19030383 U JP 19030383U JP S6099557 U JPS6099557 U JP S6099557U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- lead frame
- chips
- emitting semiconductor
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は、従来の二色発光半導体装置の側面図、第2図
は第1図の装置の結線回路図、第3図乃至第7図はいず
れもこの考案の一実施例を示し、第3図は発光チップを
マウントした第1、第2のリードフレームを2層に重ね
て4種類の発光色のチップ毎にレンズ部をモールドした
状態を示す一部側面図、第4図は同じくレンズ部を省略
した平面図、第5図は4色発光半導体装置を示す側 ゛
面図、第6図は同じく平面図、第7図は第5図の装置の
結線回路図である。
8・・・第1のリードフレーム、9・・・第2のリード
フレーム、10,11,12.13・・・リード端子、
10b、llb、12b、13b・・・先端台部、14
. 15. 16. 17・・・発光半導体チップ(発
光チップ)、14at 15a* 16a* 1
7a・・・表面電極、23・・・レンズ部。FIG. 1 is a side view of a conventional two-color light emitting semiconductor device, FIG. 2 is a wiring circuit diagram of the device shown in FIG. Figure 3 is a partial side view showing a state in which the first and second lead frames on which light-emitting chips are mounted are stacked in two layers, and lens parts are molded for each of the four types of chips with light-emitting colors, and Figure 4 is a side view of the same lenses. 5 is a side view showing a four-color light emitting semiconductor device, FIG. 6 is a plan view of the same, and FIG. 7 is a wiring circuit diagram of the device shown in FIG. 5. 8... First lead frame, 9... Second lead frame, 10, 11, 12.13... Lead terminal,
10b, llb, 12b, 13b...Tip stand part, 14
.. 15. 16. 17... Light emitting semiconductor chip (light emitting chip), 14at 15a* 16a* 1
7a...Surface electrode, 23...Lens portion.
Claims (1)
類のチップを、一対のリード端子の夫々に発光色の異な
るチップを逆並列となるようにマウントした第1のリー
ドフレームと、他の一対のリード端子の夫々に、前記第
1のリードフレーム・ に備えられるチップとは発光色
が異なる2種類のチップを、互に逆並列となるようにマ
ウントした第2のリードフレームと、前記第1のリード
フレームと、第2のリードフレームとを並列して、リー
ド端子上端部分を透光性樹脂にてモールド一体化したこ
とを特徴とする多色発光半導体装置。Out of four types of light emitting semiconductor chips with different light emitting colors, two types of chips are mounted on a first lead frame in which chips with different light emitting colors are mounted in antiparallel to each of a pair of lead terminals, and on the other pair of lead terminals. a second lead frame in which two types of chips having different emission colors from the chips provided in the first lead frame are mounted in antiparallel to each other on each of the lead terminals of the first lead frame; A multicolor light emitting semiconductor device characterized in that a lead frame and a second lead frame are arranged in parallel and the upper end portions of the lead terminals are integrally molded with a translucent resin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19030383U JPS6099557U (en) | 1983-12-12 | 1983-12-12 | Multicolor light emitting semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19030383U JPS6099557U (en) | 1983-12-12 | 1983-12-12 | Multicolor light emitting semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6099557U true JPS6099557U (en) | 1985-07-06 |
Family
ID=30410072
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19030383U Pending JPS6099557U (en) | 1983-12-12 | 1983-12-12 | Multicolor light emitting semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6099557U (en) |
-
1983
- 1983-12-12 JP JP19030383U patent/JPS6099557U/en active Pending
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