JPS6082289A - Working method of ceramics - Google Patents
Working method of ceramicsInfo
- Publication number
- JPS6082289A JPS6082289A JP58189768A JP18976883A JPS6082289A JP S6082289 A JPS6082289 A JP S6082289A JP 58189768 A JP58189768 A JP 58189768A JP 18976883 A JP18976883 A JP 18976883A JP S6082289 A JPS6082289 A JP S6082289A
- Authority
- JP
- Japan
- Prior art keywords
- ceramics
- processing
- laser
- energy density
- heat source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
- B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
- B23K26/147—Features outside the nozzle for feeding the fluid stream towards the workpiece
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明はセラミックスの加工方法に係り、特に、加工能
率が高くかつ後処理が不要若しくは容易になるセラミッ
クスの加工方法、とりわけレーザを用いるに適した加工
方法に関する。[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a method for processing ceramics, and in particular, a method for processing ceramics that has high processing efficiency and eliminates or facilitates post-processing, and is particularly suitable for using a laser. Regarding processing methods.
セラミックスの穴あけ、切断、溝堀り等の加工の方法の
一つとして、レーザ等の高エネルギー密度熱源を加工予
定部に照射して加熱し、被照射部のセラミックスを溶融
もしくは蒸発させ℃加工する方法がある。One of the methods of processing ceramics, such as drilling, cutting, and grooving, is by irradiating and heating the area to be processed with a high-energy density heat source such as a laser, and melting or evaporating the ceramic in the irradiated area to process it at ℃. There is a way.
このような加工方法は様々な利点を有し、例えばレーザ
加工は、
■ エネルギー密度が高いので融点の高い材料あるいは
硬くて脆い材料であり又も加工し易い、■ 非接触加工
のため、加工するに際し、被加工物に物理的な力が負荷
されない、
■ 加工部がよごれない（被加工物の母材以外の物質が
加工部に残留しない）、
■ 加工速度が速い、
■ 加工部周辺の加工ひずみや熱変形が極めて小さい、
■ 光の到達し得るところであれば、反射鏡等の利用に
より複雑な形状の一部、例えばパイプの内面、幅の狭い
溝のようなものの部分的な加工が可能である、
■ 適切な波長のレーザビームを用いることにより、透
明な物体の中にあるものを外から加工することもできる
、
■ オンライン処理が可能である、
等の特徴がある。These processing methods have various advantages; for example, laser processing has a high energy density, making it easy to process materials with high melting points or hard and brittle materials, and ■ non-contact processing, making it easier to process materials. During processing, no physical force is applied to the workpiece, ■ The workpiece is not contaminated (substances other than the workpiece's base material do not remain in the workpiece), ■ Machining speed is fast, ■ Machining around the workpiece Strain and thermal deformation are extremely small. ■ As long as light can reach, it is possible to partially process parts of complex shapes, such as the inner surface of pipes and narrow grooves, by using reflectors, etc. It has the following characteristics: (1) By using a laser beam with an appropriate wavelength, it is possible to process what is inside a transparent object from the outside, (2) Online processing is possible.
しかしながら、従来のレーザ加工法においては、レーザ
ビームによるセラミックスの溶融物がレーザ照射部に付
着し、加工能率を低下させると共に加工後の表面の品質
が劣ることがあり、被加工物の材質によっては上記レー
ザ加工法の長所を十分には生かしきれない場合があった
。However, in conventional laser processing methods, molten ceramics caused by the laser beam may adhere to the laser irradiated area, reducing processing efficiency and reducing the quality of the surface after processing, depending on the material of the workpiece. There were cases where the advantages of the above laser processing method could not be fully utilized.
本発明は上記実情に鑑みてなされたものであって、その
目的とするところは、加工能率が高く、加工部にセラミ
ックスの溶融付着物の生じることがほとんどないセラミ
ックスの加工方法を提供することにある。The present invention has been made in view of the above-mentioned circumstances, and its purpose is to provide a method for processing ceramics that has high processing efficiency and almost eliminates the formation of melted ceramic deposits on the processing area. be.
〔発明の構成〕
この目的を達成するために、本発明は高エネルギー密度
熱源が照射される加工部分に−・ロゲンガスを供給する
こと忙より、該加工部分に揮発し易い−・ロゲン化物を
形成して加工の効率等を向上させるようにしたものであ
り℃、
セラミックスの加工予定部に高エネルギー密度熱源のビ
ームを照射してセラミックスを加工するにあたり、加工
予定部に該ビームの照射と共に−・ロゲンガスを供給す
ることをＧ徴とするセラミックスの加工方法、
を要旨とするものである。[Structure of the Invention] In order to achieve this object, the present invention provides a method for supplying rogen gas to a processed portion irradiated with a high-energy density heat source, thereby forming a halogenide that is easily volatilized in the processed portion. When processing ceramics by irradiating a beam from a high energy density heat source onto the area to be processed, the beam is applied to the area to be processed. The gist of the present invention is a method for processing ceramics in which the G feature is the supply of rogen gas.
以下に本発明をさらに詳細に説明する。The present invention will be explained in more detail below.
本発明方法においては、セラミックスの加工予定部にレ
ーザビーム等の高エネルギー密度熱源を照射すると共に
−・ロゲンガスを供給する。In the method of the present invention, a high energy density heat source such as a laser beam is irradiated onto a portion of ceramics to be processed, and -.logen gas is supplied.
供給するハロゲンガスとしては、取り扱いが他の−・ロ
ゲンガスに比べ容易であること、反応速度が適度である
こと、あるいは低価格であること等から、塩素ガスが最
も有利である。As the halogen gas to be supplied, chlorine gas is most advantageous because it is easier to handle than other halogen gases, has a moderate reaction rate, and is inexpensive.
本発明の方法はセラミックス一般に適用可能であるが、
特に・・ロゲンガスと揮発性の高い化合物を作り得る金
属元素を含むセラミックス、例えばＡＡ’、Ｏ，，８１
０，、ＺｒＯ，等の酸化物系セラミックス；Ｓｉ、Ｎ、
等の窒化物系セラミックス； ＳｉＣ，ＴｉＣ等の炭化
物系セラミックス；ホウ化物系セラミックス等に有効で
ある。Although the method of the present invention is applicable to ceramics in general,
In particular...ceramics containing metal elements that can form highly volatile compounds with rogens gas, such as AA', O,,81
0, ZrO, etc.; Si, N,
It is effective for nitride ceramics such as; carbide ceramics such as SiC and TiC; boride ceramics, etc.
また、高エネルギー密度熱源としては、レーザ、プラズ
マジェット、電子ビーム等が挙げられ、特にレーザが好
適である。Further, examples of the high energy density heat source include a laser, a plasma jet, an electron beam, etc., and a laser is particularly suitable.
本発明の加工方法による加工は、密閉チャンバー等の内
部で行ない、加工により発生するノ・ロゲン化物を含有
する排ガスは適当な処理を施した後排出させる。The processing according to the processing method of the present invention is carried out inside a closed chamber or the like, and the exhaust gas containing norogenides generated by the processing is discharged after being subjected to appropriate treatment.
以下に本発明の実施例を図面を参照して説明する。 Embodiments of the present invention will be described below with reference to the drawings.
第１図及び第２図は本発明によるセラミックスの加工方
法の実施例を説明する概略断面図である。FIGS. 1 and 2 are schematic cross-sectional views illustrating an embodiment of the method for processing ceramics according to the present invention.
第１図の実施例においては、レーザ加工光学装置１のノ
ズル４の先端近傍部分にハロゲンガス供給用の側管１１
を設け、集光レンズ２により集光されたレーザビーム３
を照射しながら、ノ・ロゲンガスＩ３をこのτＩＱ管Ｉ
Ｉよりセラミックス５の加工部Ａに供給している。In the embodiment shown in FIG. 1, a side pipe 11 for supplying halogen gas is provided near the tip of the nozzle 4 of the laser processing optical device 1.
A laser beam 3 focused by a condensing lens 2 is provided.
While irradiating the
It is supplied to the processing section A of the ceramics 5 from I.
また第２図の実施例においては、レーザ加工光学装置ｌ
とは別体の補助ノズルＩ２を用いて、ノ・ロゲンガス１
３を加工部Ａに供給している。In addition, in the embodiment shown in FIG. 2, the laser processing optical device l
Using the auxiliary nozzle I2, which is separate from the
3 is supplied to processing section A.
第３図及び第４図はさらに異なる実施例を説明するもの
であり、本発明の加工方法により、セラミックスの表面
に幅の広い溝２Ｉを形成している状態を示す。FIGS. 3 and 4 are for explaining a further different embodiment, and show a state in which wide grooves 2I are formed on the surface of ceramics by the processing method of the present invention.
第３図の実施例においては、レーザビーム３を、レンズ
２の焦点からずれた位置で（即ち、あまり絞らない状態
で）セラミックス５に照射すると共に、セラミックス５
又はビーム３を相対移動させている。また第４図の実施
例においてはレーザビーム３を絞り込んでセラミックス
５に照射すると共に矢印Ｂの如くオシレートさせ℃いる
。セしてｖＪ３図及び第４図において、共に、補助ノズ
ルＩ２からハロゲンガス１３をレーザビーム照射部に供
給し、セラミックスを蒸発させ幅の広い溝２１を形成し
ている。In the embodiment shown in FIG. 3, the laser beam 3 is irradiated onto the ceramic 5 at a position shifted from the focal point of the lens 2 (that is, without narrowing down the lens 2), and the ceramic 5 is
Or the beam 3 is moved relatively. In the embodiment shown in FIG. 4, the laser beam 3 is narrowed down and irradiated onto the ceramics 5, and is oscillated as indicated by arrow B. In both Figures vJ3 and 4, halogen gas 13 is supplied from the auxiliary nozzle I2 to the laser beam irradiation section to evaporate the ceramic and form wide grooves 21.
以上詳述した如く、本発明のセラミックスの加工方法に
よれば、加工予定部にアシストガスとして−・ロゲンガ
スを供給することにより、■ セラミックスの構成成分
が揮発性の高い−・ロゲン化合物となって蒸発するため
、加工速度が著しく増加する、
■ 加工部に溶融付着物がほとんど残らない、■ 従っ
て、加工表面がなめらかになり後処理が不要又は軽減さ
れる、
■ さらに、表面をなめらかにすることができることか
ら、本発明の加工方法を表面処理とし℃応用することが
できる、
等の効果をあげることができ、高い加工能率で工業的に
極めて有利なセラミックスの加工を行なうことができる
。As described in detail above, according to the ceramic processing method of the present invention, by supplying -.logen gas as an assist gas to the area to be processed, (1) the constituent components of the ceramics become highly volatile -.logen compounds. Due to evaporation, the processing speed increases significantly; ■ Virtually no molten deposits remain on the processed part; ■ Therefore, the processed surface becomes smooth and post-processing is unnecessary or reduced; ■ Furthermore, the surface is made smoother. As a result, the processing method of the present invention can be applied to surface treatment at ℃, etc., and it is possible to process ceramics with high processing efficiency, which is extremely advantageous industrially.
第１図及び第２図は本発明の詳細な説明する概略断面図
、第３図及びＷＪ４図は本発明によりセラミックスに幅
の広い溝を形成１−る方法を説明する概略図である。
し・・レーザ加工光学装置、
２・・・集光レンズ、 ３・・・レーザビーム４・・・
ノズル ５・・・セラミックス、１１・・・（ＩＩＩＩ
Ｗ、＋２・・・補助ノズル、Ｉ３…ハロゲンガス。
代理人 弁理士 重 野 剛
第１図
第３図
第２図
第４図1 and 2 are schematic cross-sectional views explaining the present invention in detail, and FIGS. 3 and 4 are schematic views explaining the method of forming wide grooves in ceramics according to the present invention. ... Laser processing optical device, 2... Condensing lens, 3... Laser beam 4...
Nozzle 5...Ceramics, 11...(III
W, +2...Auxiliary nozzle, I3...Halogen gas. Agent Patent Attorney Tsuyoshi Shigeno Figure 1 Figure 3 Figure 2 Figure 4
Claims (1)
熱源のビームを照射してセラミックスを加工するにあた
り、加工予定部に該ビームの照射と共にハロゲンガスな
供給することを特徴とするセラミックスの加工方法。 （２）高エネルギー密度熱源がレーザであることを特徴
とする特許請求の範囲第１項に記載の加工方法。 （３） ハロゲンガスが塩素ガスであることを特徴とす
る特許請求の範囲第１項又は第２項に記載の加工方法。[Scope of Claims] +11 A ceramic material, characterized in that when processing the ceramic by irradiating the part to be processed with a beam of a high energy density heat source, a halogen gas is supplied to the part to be processed along with the irradiation of the beam. Processing method. (2) The processing method according to claim 1, wherein the high energy density heat source is a laser. (3) The processing method according to claim 1 or 2, wherein the halogen gas is chlorine gas.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58189768A JPS6082289A (en) | 1983-10-11 | 1983-10-11 | Working method of ceramics |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58189768A JPS6082289A (en) | 1983-10-11 | 1983-10-11 | Working method of ceramics |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6082289A true JPS6082289A (en) | 1985-05-10 |
Family
ID=16246861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58189768A Pending JPS6082289A (en) | 1983-10-11 | 1983-10-11 | Working method of ceramics |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6082289A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USRE43370E1 (en) | 1995-11-24 | 2012-05-08 | Nokia Corporation | Communication device with two modes of operation |
| CN103394805A (en) * | 2013-08-05 | 2013-11-20 | 深圳市大族激光科技股份有限公司 | Laser cutting and punching device and method |
-
1983
- 1983-10-11 JP JP58189768A patent/JPS6082289A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USRE43370E1 (en) | 1995-11-24 | 2012-05-08 | Nokia Corporation | Communication device with two modes of operation |
| CN103394805A (en) * | 2013-08-05 | 2013-11-20 | 深圳市大族激光科技股份有限公司 | Laser cutting and punching device and method |
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