JPS6081572A - Sealing mechanism - Google Patents
Sealing mechanismInfo
- Publication number
- JPS6081572A JPS6081572A JP58186902A JP18690283A JPS6081572A JP S6081572 A JPS6081572 A JP S6081572A JP 58186902 A JP58186902 A JP 58186902A JP 18690283 A JP18690283 A JP 18690283A JP S6081572 A JPS6081572 A JP S6081572A
- Authority
- JP
- Japan
- Prior art keywords
- pipe
- seal body
- seal
- main pipe
- pipes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 title description 5
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims abstract description 8
- 230000002093 peripheral effect Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 3
- 230000009466 transformation Effects 0.000 abstract description 3
- 229910045601 alloy Inorganic materials 0.000 abstract description 2
- 239000000956 alloy Substances 0.000 abstract description 2
- 238000010276 construction Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 11
- 238000001312 dry etching Methods 0.000 description 8
- 238000011109 contamination Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000005304 joining Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/56—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using mechanical means or mechanical connections, e.g. form-fits
- B29C65/562—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using mechanical means or mechanical connections, e.g. form-fits using extra joining elements, i.e. which are not integral with the parts to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/34—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement"
- B29C65/36—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction
- B29C65/3604—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the type of elements heated by induction which remain in the joint
- B29C65/3644—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the type of elements heated by induction which remain in the joint being a ribbon, band or strip
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/112—Single lapped joints
- B29C66/1122—Single lap to lap joints, i.e. overlap joints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
- B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
- B29C66/52—Joining tubular articles, bars or profiled elements
- B29C66/522—Joining tubular articles
- B29C66/5221—Joining tubular articles for forming coaxial connections, i.e. the tubular articles to be joined forming a zero angle relative to each other
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
- B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
- B29C66/55—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles sealing elements being incorporated into the joints, e.g. gaskets
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
- F16L13/00—Non-disconnectible pipe-joints, e.g. soldered, adhesive or caulked joints
- F16L13/004—Shrunk pipe-joints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/303—Particular design of joint configurations the joint involving an anchoring effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B2200/00—Constructional details of connections not covered for in other groups of this subclass
- F16B2200/77—Use of a shape-memory material
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Gasket Seals (AREA)
Abstract
Description
【発明の詳細な説明】
〔技術分野〕
本発明はパイプとパイプとの結合構造にあって、気密的
に結合するシール構造、特に真空系、高圧系の１記管結
合に有効外シール構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a pipe-to-pipe joint structure, and relates to a seal structure for airtightly joining, particularly an outer seal structure effective for pipe joints in vacuum systems and high-pressure systems. .
半導体装置のα、Ｖ造における被膜形成、イオン打込み
、ドライエツチング等を行なう装置として広く真空装置
が使用されている。そして、この真空装置にあっては、
たとえば電子材料１９８１年８月号４１〜４５頁「真空
装置」にも記載されているように、半導体素子の信頼性
向上の面からも良好な排気が望まれる。Vacuum equipment is widely used as equipment for film formation, ion implantation, dry etching, etc. in α and V fabrication of semiconductor devices. And in this vacuum device,
For example, as described in "Vacuum Equipment" in the August 1981 issue of Electronic Materials, pages 41-45, good exhaust is desired from the perspective of improving the reliability of semiconductor devices.
ところで、本出願人は真空装置の一つであるドライエツ
チング装置における排気系にあって、ノくイブとパイプ
との結合は、第１図（ａ） 、 （ｂ）に示すように、
ゴムからなるＯ−リングあるいは金属シール（金属ガス
ケット）２を用いて気密化を図っている。すなわち、０
−リング１１ｆｒ：用いる構造は、第１図（ａ）で示す
ように、主パイプ３およびこの主パイプ３の一端に連結
される従パイプ４のそれぞれの結合端にフランジ５，６
を溶接にて気密的に固定した構造となっている。また、
一対のフランジ５．６間にはＯ−リングｌが介在されて
いる。By the way, the present applicant has developed an exhaust system for a dry etching device, which is one type of vacuum device, and the connection between the knob and the pipe is as shown in FIGS. 1(a) and 1(b).
Airtightness is achieved using a rubber O-ring or a metal seal (metal gasket) 2. That is, 0
-Ring 11fr: The structure used is as shown in FIG.
The structure is airtightly fixed by welding. Also,
An O-ring 1 is interposed between the pair of flanges 5.6.
そして、両フランジ５，６はボルト７およびナツト８の
締付けによって連結されている。なお、一方のフランジ
６の結合面には溝９が設けられ、０−リング１をガイド
するようになっている。Both flanges 5 and 6 are connected by tightening bolts 7 and nuts 8. Note that a groove 9 is provided on the joining surface of one flange 6 to guide the O-ring 1.
一方、金属シール２を用いる構造は、第１図（ｂ）で示
すように、第１図（ａ）に示すと同様なフランジ５．６
を有する主パイプ３と従パイプ４のフランジ５．６間に
リング状の金属シール２を挾み、かつ両フランジ５，６
をボルト７およびナツト８の締付けによって連結固定し
た構造となっている。On the other hand, as shown in FIG. 1(b), the structure using the metal seal 2 has a flange 5.6 similar to that shown in FIG. 1(a).
A ring-shaped metal seal 2 is sandwiched between the flanges 5 and 6 of the main pipe 3 and the sub pipe 4 having
are connected and fixed by tightening bolts 7 and nuts 8.
なお、ボルト７およびナツト８の締付は時に金属シール
面に喰い込むような鋭利な頂端を有する突条１０．１１
がフランジ５．６に設けられている。In addition, when tightening the bolt 7 and nut 8, the protrusion 10.11 having a sharp apex that sometimes bites into the metal sealing surface is used.
is provided on the flange 5.6.
しかし、これらのシール構造ではつぎのように多くの問
題が生じることが本発明者によってあきらかとされた。However, the inventors have found that these seal structures cause many problems as described below.
（１）Ｏ−リングシール構造はＯ−リングがゴムである
ことから放出ガス方（リーク量）が多く （たとえば、
リーク量は２ Ｘ １０−３Ｐａｙ７／／５ｅＣ２７）
、排気系を放出ガスで汚染し易い。排気系の汚染は反応
室の汚染ともなる結果、微量のガスがエツチング特性に
悲影響を及ぼすドライエツチングでは好まＩ−＜ない。(1) Since the O-ring is made of rubber, the O-ring seal structure releases a large amount of gas (leakage amount) (for example,
Leak amount is 2 x 10-3Pay7//5eC27)
, the exhaust system is likely to be contaminated with emitted gas. Since contamination of the exhaust system also contaminates the reaction chamber, it is preferable that I-< not be used in dry etching where a trace amount of gas adversely affects the etching characteristics.
また、金属シール構造は前記Ｏ−リングシール構造に比
較ずれば放出ガス量は少ないが、シール効果を高めるた
めに軟かい金属、たとえば無酸素銅で今月シールを形成
しているため、Ｃ１等が放出され（たとえば、リーク量
−は５×１０−’ Ｐａ ｎ？ｌ ｓｅｅ ｔ＆ ）好
ましくない。In addition, the metal seal structure releases less gas than the O-ring seal structure, but in order to improve the sealing effect, the seal is formed with a soft metal, such as oxygen-free copper, so C1 etc. (for example, the amount of leakage is 5 x 10-'Pan?l seet&), which is undesirable.
（２）Ｏ−リングはゴムであるところから、経時変化が
起き易く、シールの寿命が短かい。この結果、０−リン
グの繰返し使用回数は少ない。これに対して金属シール
は経時変化は起き難いが、一度の使用で変形するため繰
返して使用できない欠点がある。(2) Since O-rings are made of rubber, they tend to change over time and the life of the seal is short. As a result, the number of times the 0-ring is used repeatedly is small. On the other hand, metal seals do not easily change over time, but they have the disadvantage that they cannot be used repeatedly because they deform after one use.
（３）０−ＩＪソング熱に弱いため、０−リングシール
構造は高温高熱箇所には使用できない難点がある。(3) The 0-ring seal structure cannot be used in high-temperature areas because it is susceptible to heat.
（４）０−ＩＪソングール構造および金属シール構造は
ボルト締めにて気密シールするため、ボルト締付は順序
、ボルト締付は荷車により気密度（Ｘ空′）
シール））の度合いが変動する欠点がある。特にＯ−リ
ングはゴムであることからＯ−リングとフランジとの接
触圧は小さく真空シール度としては高いとはいえなくな
る。(4) Since the 0-IJ song wheel structure and metal seal structure are airtightly sealed by tightening bolts, the order of tightening the bolts and the degree of airtightness (X') seal) vary depending on the cart. There is. In particular, since the O-ring is made of rubber, the contact pressure between the O-ring and the flange is small and the degree of vacuum seal cannot be said to be high.
（５）Ｏ−！Ｊングシール構造および金属シール構造は
フランジｔボルト、ナツト等部品点数が多ぐコスト高と
なるとともに、組立に時間が川り、使い離い欠点がある
。(5) O-! The J-ring seal structure and the metal seal structure have a large number of parts such as flanges, T-bolts, nuts, etc., resulting in high costs, and they also have the disadvantage of taking time to assemble and being difficult to use.
本発明の目的は放出ガス量が少なく管路系を汚染し難い
シール構造を提供することにある。An object of the present invention is to provide a seal structure that releases less gas and is less likely to contaminate the pipe system.
また、本発明の他の目的は気密性の高いシール構造を提
供することにある。Another object of the present invention is to provide a seal structure with high airtightness.
また、本発明の他の目的は構造が簡単でかつ繰返して使
用できるシール構造を提供することにある。Another object of the present invention is to provide a seal structure that is simple in structure and can be used repeatedly.
本発明の前記ならびにそのほかの目的と新規な特徴は、
本明細省の記述および添付図面からあきらかになるであ
ろう。The above and other objects and novel features of the present invention include:
It will become clear from the description of the present specification and the accompanying drawings.
本願において開示される発明のうち代表的なものの概要
を油単に説明すれば、下記のとおりである。A brief summary of typical inventions disclosed in this application is as follows.
すなわち、本発明は主パイプと従パイプとの嵌合部分に
形状合金からなるシール体を介在させ、シール体の強い
記憶形状復帰力によって気密的にシールする構造となっ
ているため、高い気密度が達成できる。また、このシー
ル構造はシール体が直接パイプ内にその表面を露出しな
い構造となっているため、シール体を構成する物質の放
出は起き難くなり管路系の汚染防止が達成できる。さら
に、このシール構造におけるシール体は形状記憶合金で
形成されているため、約返し使用が達成できる。In other words, the present invention has a structure in which a seal body made of a shape alloy is interposed in the fitting part between the main pipe and the slave pipe, and the seal body has a structure that provides an airtight seal by the strong memorized shape return force, resulting in a high airtightness. can be achieved. In addition, this seal structure has a structure in which the surface of the seal body is not exposed directly into the pipe, so that the substances constituting the seal body are less likely to be released, and contamination of the pipe system can be prevented. Furthermore, since the seal body in this seal structure is formed of a shape memory alloy, it can be used repeatedly.
第２図は本発明の一実施例によるドライエツチング装置
を示す模式図、第３図は同じく一部の拡大断面図、第４
図は同じくバイブ連結方法を示す拡大断面図である。FIG. 2 is a schematic diagram showing a dry etching apparatus according to an embodiment of the present invention, FIG. 3 is a partially enlarged sectional view, and FIG.
The figure is also an enlarged sectional view showing the method of connecting the vibrator.
ドライエツチング装置は、処理室１２内に１対の平行平
板電極１３．１４が配設された構造となっている。前記
平行平板１！極１３，１４には高周波電源１５によって
所望の電圧が印加され、平行平板電極１３．１４間にプ
ラズマが発生させられるようになっている。また、下方
の平行平板ｉ！極１４はその上面にシリコンウェハ等の
被処理物１６を載置するテーブルともなっている。また
、このドライエツチング装置は処理室１２に連通ずる主
パイプ３からなる排気口１７を有している。この排気口
１７は主パイプ３の先端に結合される従ノくイブ４を介
して図示しない真空排気系に接続されている。The dry etching apparatus has a structure in which a pair of parallel plate electrodes 13 and 14 are disposed within a processing chamber 12. Said parallel plate 1! A desired voltage is applied to the poles 13 and 14 by a high frequency power source 15, so that plasma is generated between the parallel plate electrodes 13 and 14. Also, the lower parallel plate i! The pole 14 also serves as a table on which a workpiece 16 such as a silicon wafer is placed. The dry etching apparatus also has an exhaust port 17 formed of a main pipe 3 communicating with the processing chamber 12. This exhaust port 17 is connected to a vacuum exhaust system (not shown) via a subordinate tube 4 connected to the tip of the main pipe 3.
ところで、前記主パイプ（主管）３と従ノくイブ（従管
）４とは第３図で示すような結合構造となっている。す
なわち、主パイプ３の先端内周部には嵌合孔１８が設け
られている。この嵌合孔Ｊ８は従パイプ４の外径よりは
数陥〜数の大きくなっている。そして、従パイプ４は外
周部に嵌合したリング状のシール体１９を介して主パイ
プ３の嵌合孔１８に嵌合されている。シール体１９はた
とえばＴＩ−ＮＩ系の形状記憶合金によって形成されて
いる。寸だ、シール体１９は内周側と外周側にリップ２
０．２１を突出させるように断面がＶ字状となる構造と
なっていて、その両リップ２０゜２１０先端部分が主パ
イプ３の嵌合孔１８の内周面および従バイブ４の外周面
に深く喰い込み、主パイプ３と従パイプ４との結合性お
よび気密性を維持している。なお、シール体１９の喰い
込み力はシール体１９の記憶形状復帰力によって生じて
いる。By the way, the main pipe (main pipe) 3 and the secondary pipe (secondary pipe) 4 have a coupling structure as shown in FIG. 3. That is, a fitting hole 18 is provided in the inner peripheral portion of the tip of the main pipe 3. This fitting hole J8 is several to several recesses larger than the outer diameter of the slave pipe 4. The slave pipe 4 is fitted into the fitting hole 18 of the main pipe 3 via a ring-shaped seal 19 fitted to the outer circumference. The seal body 19 is made of, for example, a TI-NI shape memory alloy. The seal body 19 has lips 2 on the inner and outer circumferential sides.
It has a V-shaped cross section so that 0.21 protrudes, and the tips of both lips 20°210 are attached to the inner circumferential surface of the fitting hole 18 of the main pipe 3 and the outer circumferential surface of the slave vibe 4. It bites deeply to maintain the connection and airtightness between the main pipe 3 and the secondary pipe 4. Note that the biting force of the seal body 19 is caused by the force of the seal body 19 to return to its memorized shape.
主パイプ３および従パイプ４の結合はつぎのような手順
によって行なわれる。リング状のシール体１９の記憶形
状は内径が従パイプ４の外径よりもたとえば数朔小さく
、外径が主パイプ３の嵌合孔１８の直径よりもたとえば
数胴大きくなるようにあらかじめ設定されている。The main pipe 3 and the sub pipe 4 are connected by the following procedure. The memorized shape of the ring-shaped seal body 19 is set in advance so that the inner diameter is, for example, several mm smaller than the outer diameter of the secondary pipe 4, and the outer diameter is, for example, several mm larger than the diameter of the fitting hole 18 of the main pipe 3. ing.
そこで、主パイプ３と従パイプ４との結合時には、低温
湯で前記シール体１９を変形させ、第４図に示すように
、シール体１９の内径が従パイプ４の外径よりもわずか
に大きくなるように、外径が主パイプ３の嵌合孔１８の
直径よりもわずかに小さくなるようにする。つぎに、従
パイプ４はシール体１９を介在された状態で主パイプ３
の嵌合孔１８に嵌合される。つぎに、嵌合状態の主・従
パイプ３，４およびシール体１９は、形状記憶合金が記
憶形状に復帰する逆変態温度よシも高い室温またはドラ
イエツチングを行なう温度に晒される。すると、シール
体１９はあらかじめ記憶されていた形状に変形するため
、内周側リップ２０の先端は深く従パイプ４の外周面に
喰い込む。また、シール体１９の外周側リップ２１の先
端部分は主パイプ３の嵌合孔１８内周面に深く喰い込む
。この結果、主パイプ３と従パイプ４は強固に結合され
るとともに、シール体１９によって全周に亘ってシール
されることから気密的にシールされることになる。Therefore, when connecting the main pipe 3 and the slave pipe 4, the seal body 19 is deformed with low-temperature hot water so that the inner diameter of the seal body 19 becomes slightly larger than the outer diameter of the slave pipe 4, as shown in FIG. The outer diameter should be slightly smaller than the diameter of the fitting hole 18 of the main pipe 3. Next, the slave pipe 4 is connected to the main pipe 3 with the seal body 19 interposed therebetween.
is fitted into the fitting hole 18 of. Next, the main and secondary pipes 3, 4 and the seal body 19 in the fitted state are exposed to room temperature or a temperature at which dry etching is performed, which is higher than the reverse transformation temperature at which the shape memory alloy returns to its memorized shape. Then, the seal body 19 is deformed into a pre-memorized shape, so that the tip of the inner lip 20 deeply bites into the outer circumferential surface of the slave pipe 4. Further, the tip portion of the outer peripheral lip 21 of the seal body 19 bites deeply into the inner peripheral surface of the fitting hole 18 of the main pipe 3. As a result, the main pipe 3 and the sub pipe 4 are firmly connected and are sealed all around by the seal body 19, so that they are airtightly sealed.
（１）本発明のシール構造は形状記憶合金のパイプとの
密着力は原子レベルの力が基準となるので、密着力はＱ
−ＩＪタングール構造、全屈シール（金ｈガスケット
シール）構造に比較して強く、超高真空のシールが可能
となる。特に、形状記憶合金は逆変態温度を越えた後も
温度が高くなるとわずかではあるが変形変位が大きくな
る傾向を示すので、高温度下でプラズマエツチングが行
なわれるような場合に主・従パイプおよびシール体相互
の熱膨張係数の違いによるゆるみをも吸収することにも
なり、気密性は有効に維持される。(1) In the seal structure of the present invention, the adhesion force with the shape memory alloy pipe is based on atomic level force, so the adhesion force is Q
- IJ tangour structure is stronger than the fully bent seal (gold h gasket seal) structure, and allows ultra-high vacuum sealing. In particular, shape memory alloys show a tendency for deformation to increase, albeit slightly, as the temperature increases even after the reverse transformation temperature has been exceeded. It also absorbs loosening due to differences in thermal expansion coefficients between the sealing bodies, and airtightness is effectively maintained.
（２）本発明のシール構造は温度を降下させるだけで真
空シールが解除させるだけでよいことから、シール体は
繰り返して使用でき、永久的に使用可能となる。(2) Since the seal structure of the present invention only requires lowering the temperature to release the vacuum seal, the seal body can be used repeatedly and can be used permanently.
（３）本発明のシール構造はシール体は直接・（イブ。(3) In the seal structure of the present invention, the seal body is directly
の内部にその表面を露出していない。この結果、パイプ
内にシール体を構成する物質は放出さｆｔ難＜ ｆｘ
！＋ （タトエＩｄ、リーク量は４ ｘ ｌ Ｏ−？Ｐ
ａｆｆ／／５ｅｃｙｙ／）、管路（排気）系の汚染防止
が達成でき、プラズマエツチング等の処理品質の低下２
歩留低下を引き起こさなくなる。Its surface inside is not exposed. As a result, the substance constituting the seal body is not released into the pipe.
! + (Tatoe Id, leakage amount is 4 x l O-?P
aff//5ecyy/), it can prevent contamination of the pipe (exhaust) system and reduce the quality of processing such as plasma etching2.
This will not cause a decrease in yield.
（４）本発明のシール構造は構造が簡卑であり、７５・
つシール化、シール解除が容易であるため使い易い。(4) The seal structure of the present invention is simple in structure, and 75.
It is easy to use because it is easy to seal and unseal.
（５）本発明のシール構造は部品点数が少ないことから
コストが安くなる。(5) Since the seal structure of the present invention has fewer parts, the cost is reduced.
（６）本発明のシール体は、熱にも強くかつ経時変化も
生じないことからシール体、すなわちシール構造の寿命
も長くなる。(6) Since the seal body of the present invention is resistant to heat and does not change over time, the life of the seal body, that is, the seal structure is extended.
以上本発明者によってなされた発明を実施例にもとづき
具体的に説明したが、本発明は上言己実施例に限定され
るものではなく、その要旨を逸脱しない範囲で種々変更
可能であることはいうまでもない。たとえば、シール体
の断面形状はＸ字形であっても前記実施例と同様な効果
が得られる。Although the invention made by the present inventor has been specifically explained based on the embodiments above, the present invention is not limited to the embodiments described above, and it is understood that various changes can be made without departing from the gist of the invention. Needless to say. For example, even if the cross-sectional shape of the seal body is X-shaped, the same effect as in the above embodiment can be obtained.
以上の説明では主として本発明者によってなされた発明
をその背景となった利用分野である真を装置技術に適用
した場合について説明したが、それに限定されるもので
はなく、たとえば、高圧装置における管結合技術にも適
用できる。In the above explanation, we have mainly explained the case where the invention made by the present inventor is applied to equipment technology, which is the field of application that is the background of the invention, but it is not limited thereto. It can also be applied to technology.
第１図（ａ） 、 （ｂ）は本出願人が既に実施してい
る管結合状態を示す断面図、
第２図は本発明の一実施例によるドライエツチング装置
を示す模式図、
第３Ｍは同じく省結合状態を示す一部の拡大断面図、
第４図は同じく管結什方法を示す一部の拡大断面図であ
る。
■・・・０−’Ｊソング２・・・金属シール、３・・・
主バイブ、４・・従バイブ、５，６・・・ノフンジ、７
・・ボルト、８・・ナツト、９・・・溝、］、 ０ 、
１１・・・実売、１２・・・処理室、１３．１４・・平
行平板電極、１５・・・高周波電源、Ｊ６・・・被処理
物、１７・・・排気口、１８・・・嵌合孔、１９・・・
シール体、２０．２１・・・リップ。
第 １ 図
６グ）
第 ２ 図FIGS. 1(a) and (b) are cross-sectional views showing a state of pipe connection that has already been carried out by the applicant; FIG. 2 is a schematic view showing a dry etching apparatus according to an embodiment of the present invention; and FIG. FIG. 4 is an enlarged cross-sectional view of a portion showing a state in which the connection is not made, and FIG. ■...0-'J Song 2...Metal seal, 3...
Main vibrator, 4...Sub-vibrator, 5,6...Nofunji, 7
...Bolt, 8...Nut, 9...Groove,], 0,
11...Actual sale, 12...Processing chamber, 13.14...Parallel plate electrode, 15...High frequency power supply, J6...Workpiece, 17...Exhaust port, 18...Fitting Matching hole, 19...
Seal body, 20.21... lip. Figure 1 (6g) Figure 2
Claims (1)
、前記嵌合部分には形状記憶合金で形成されたシール体
が気密的に介在されていることを特徴とするシール構造
。1. A seal structure for a fitting portion between two pipes, characterized in that a seal body made of a shape memory alloy is airtightly interposed in the fitting portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58186902A JPS6081572A (en) | 1983-10-07 | 1983-10-07 | Sealing mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58186902A JPS6081572A (en) | 1983-10-07 | 1983-10-07 | Sealing mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6081572A true JPS6081572A (en) | 1985-05-09 |
Family
ID=16196676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58186902A Pending JPS6081572A (en) | 1983-10-07 | 1983-10-07 | Sealing mechanism |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6081572A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS624690U (en) * | 1985-06-25 | 1987-01-12 | ||
| FR2742691A1 (en) * | 1995-12-22 | 1997-06-27 | Etex De Rech Tech Soc | Joining element |
| FR2748415A1 (en) * | 1996-05-09 | 1997-11-14 | Etex De Rech Tech Soc | Joint part for joining thermoplastic pieces |
| EP1930605A1 (en) * | 2006-12-06 | 2008-06-11 | Uponor Innovation Ab | Fitting for a pipe, in particular a plastic pipe or a plastic / metal composite pipe |
| EP2372095A1 (en) * | 2010-03-26 | 2011-10-05 | Siemens Aktiengesellschaft | Method and device for fixing a blade to a rotor using a memory shape element |
| US8763231B2 (en) | 2009-04-10 | 2014-07-01 | 3M Innovative Properties Company | Blind fasteners |
| US8870236B2 (en) | 2009-11-16 | 2014-10-28 | 3M Innovative Properties Company | Pipe section joining |
| US9422964B2 (en) | 2009-04-10 | 2016-08-23 | 3M Innovative Properties Company | Blind fasteners |
-
1983
- 1983-10-07 JP JP58186902A patent/JPS6081572A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS624690U (en) * | 1985-06-25 | 1987-01-12 | ||
| FR2742691A1 (en) * | 1995-12-22 | 1997-06-27 | Etex De Rech Tech Soc | Joining element |
| FR2748415A1 (en) * | 1996-05-09 | 1997-11-14 | Etex De Rech Tech Soc | Joint part for joining thermoplastic pieces |
| EP1930605A1 (en) * | 2006-12-06 | 2008-06-11 | Uponor Innovation Ab | Fitting for a pipe, in particular a plastic pipe or a plastic / metal composite pipe |
| US8763231B2 (en) | 2009-04-10 | 2014-07-01 | 3M Innovative Properties Company | Blind fasteners |
| US9422964B2 (en) | 2009-04-10 | 2016-08-23 | 3M Innovative Properties Company | Blind fasteners |
| US8870236B2 (en) | 2009-11-16 | 2014-10-28 | 3M Innovative Properties Company | Pipe section joining |
| EP2372095A1 (en) * | 2010-03-26 | 2011-10-05 | Siemens Aktiengesellschaft | Method and device for fixing a blade to a rotor using a memory shape element |
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