JPS6078198U

JPS6078198U - Magazine for semiconductor device packaging

Info

Publication number: JPS6078198U
Application number: JP16933383U
Authority: JP
Inventors: 平山　心一
Original assignee: 株式会社東芝
Priority date: 1983-11-02
Filing date: 1983-11-02
Publication date: 1985-05-31

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図はＴｏ−２２０型の半導体装置の斜視図、第２図
は従来のマガジンに関し、図ａは一部断面側面図、図す
は断面図、第３図は１実施例のマガジンに関し、図ａは
一部断面側面図、図すは図ａの結線に沿う断面図、図Ｃ
は図ａのＢＢ線に沿う断面図、第４図は別の１実施例の
マガジンに関し、図ａは一部断面側面図、図すは開放端
側からみた側面図である。１・・・半導体装置、２・・・半導体装置の外囲器、２
ａ・・・外囲器のリード突出側面、１１．２１・・・マ
ガジン、１１ａ、５ａ・・・マガジンの角筒体、１１ｂ
、５ｂ・・・マガジンの開放端、１１ｃ・・・マガジン
の仕切板。FIG. 1 is a perspective view of a To-220 type semiconductor device, FIG. 2 is a conventional magazine, FIG. a is a partially sectional side view, FIG. Figure a is a partially sectional side view, figure a is a cross-sectional view along the connection in figure a, figure C
FIG. 4 is a sectional view taken along line BB in FIG. DESCRIPTION OF SYMBOLS 1... Semiconductor device, 2... Envelope of semiconductor device, 2
a... Lead protruding side surface of the envelope, 11.21... Magazine, 11a, 5a... Rectangular cylinder of the magazine, 11b
, 5b... Open end of the magazine, 11c... Magazine partition plate.

Claims

【実用新案登録請求の範囲】[Scope of utility model registration request]

外囲器の側面からリードを突出させた半導体装置を、マ
ガジン筒体内に、この筒体の長手方向に対しリードを直
角に整列させて収納するとともに、外囲器の前記側面に
沿ってリードを挾むように上下内壁から対向して延びそ
の先端でリードを摺動自在に挾持する対の仕切板を有す
る半導体装置包装用マガジンにおいて、筒体の開端にお
ける仕切板の端縁が非垂直であることを特徴とする半導
体装置包装用マガジン。A semiconductor device with leads protruding from the side surface of the envelope is stored in a magazine cylinder with the leads aligned at right angles to the longitudinal direction of the cylinder, and the leads are arranged along the side surface of the envelope. In a magazine for semiconductor device packaging that has a pair of partition plates that extend oppositely from the upper and lower inner walls and slidably sandwich the leads at their tips, the edges of the partition plates at the open end of the cylindrical body are non-perpendicular. Features of a magazine for packaging semiconductor devices.