JPS6071947A - Probe for eddy current flaw detection - Google Patents
Probe for eddy current flaw detectionInfo
- Publication number
- JPS6071947A JPS6071947A JP58181439A JP18143983A JPS6071947A JP S6071947 A JPS6071947 A JP S6071947A JP 58181439 A JP58181439 A JP 58181439A JP 18143983 A JP18143983 A JP 18143983A JP S6071947 A JPS6071947 A JP S6071947A
- Authority
- JP
- Japan
- Prior art keywords
- probe
- flaw detection
- flaw
- elements
- inspected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/72—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables
- G01N27/82—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws
- G01N27/90—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws using eddy currents
- G01N27/904—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws using eddy currents with two or more sensors
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Or Analyzing Materials By The Use Of Magnetic Means (AREA)
Abstract
Description
【発明の詳細な説明】
この発明は種々の金属材料の表面に存在する傷を検出す
る為の探傷用１０−プに関するものである。更に詳しく
は被検査材に対し相対移動させてその被検査材を渦流探
傷し、そこに存在する傷を検出するようにしているプロ
ーブに関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a flaw detection device for detecting flaws existing on the surfaces of various metal materials. More specifically, the present invention relates to a probe that is moved relative to a material to be inspected to perform eddy current flaw detection on the material to be inspected to detect flaws existing there.
従来の渦流探傷用プローブには探傷幅が比較的狭い欠点
がおる。そこで被検査材における広幅な領域を一度に探
傷する方法として、複数の１０−プを並設し、各々の１
０−プからの信号を大々個別の探傷回路に入力させて処
理を行なうことが試みられたが、上記探傷回路は極めて
高価な為それを複数台備えると設備費が極めて高くなっ
てしまう欠点があうた。またプローブを広幅に形成する
ことによって広幅な領域を探傷することも試みられたが
、そのようＫすると通常の大きさの傷を検知した場合に
おいてもそのときのＷ、信号のレベルが低くなってしま
い、８Ｎ比が低下して傷の検出性能が低くなってしまう
欠点があった。Conventional eddy current flaw detection probes have the disadvantage that the flaw detection width is relatively narrow. Therefore, as a method for detecting flaws in a wide area of the material to be inspected at once, multiple 10-poles are installed in parallel, and each
Attempts have been made to input the signals from the 0-p into individual flaw detection circuits for processing, but the flaw detection circuits described above are extremely expensive, and having multiple units of them would result in extremely high equipment costs. It struck me. Attempts have also been made to detect flaws in a wide area by making the probe wide, but this method results in low W and signal levels even when normal-sized flaws are detected. However, there was a drawback that the 8N ratio was lowered and the flaw detection performance was lowered.
そこで本発明は、上述の欠点を除くようにしたもので、
被検査材における広幅な範囲を８Ｎ比高くしか４安価な
設備費で探傷できるようＫした渦流探傷用１０−グを提
供しようとするものである。Therefore, the present invention aims to eliminate the above-mentioned drawbacks.
It is an object of the present invention to provide a 10-g for eddy current flaw detection which is capable of detecting flaws in a wide range of materials to be inspected at a cost higher than that of 8N and at a lower equipment cost.
以下本願の実施例を示す図面について説明する。The drawings showing the embodiments of the present application will be described below.
第１図乃至第７図において、１は被検査材で、丸棒状の
鋼材その他種々の金属材料があシ、また図において右方
（左方でも可）へ向けて移送されるものである。２は探
傷装置を示す。この装置において、３は回動装置、４は
回動枠で、回動装置３によって上記被検査材１の周囲を
回動し得る様になっている。５は枠４に取付けられたシ
リンダで、その進退杆５ａＫは１０−プ６が取付けられ
ておシ、進退杆５＆の進退によって１０−プ６を被検葺
材ＩＫ近づけたシ遠ざけたシできる様になっている。上
記プローブ６において、７ ’ ＋ ７ ｂ−７ｏ、７
ｄは大々１０−プ要素を示し、上記被検査材１の移送方
向に並べられている。即ち、回動枠４の回動によって１
０−プ６が被検査材１の回シを回動する時の被検査材１
と１０−プ６との相対移動の方向（被検査材１０局面に
沿った螺旋方向）と交差する方向に並べられている。８
はプローブ６における励振信号の入力端（独立端子の形
に構成される場合も、或いは単なるリード線の形で構成
される場合もある）で、前記各プローブ要素７ａ〜７ｄ
Ｋおける励振信号の入力点９８〜９ｄが直列に接続しで
ある。１０はプローブ６における傷信号の出力端で、前
記入力端８と同様に構成されておシ、前記多数の１０−
プ要素７ａ〜７ｄにおける傷信号の出力点１１Ｂ −１
１ｄが並列接続しである。次に上記プローブ要素７ａ〜
７ｄは特に第４図に明示される様に構成されている。尚
各１０−プ要素Ｉ／′ｉ総て均等の構成である為第４図
においては英文字の添字ａ −、−ｄを省略して説明す
る。１２゜肋は磁極、１４ 、１５はそれらに大々巻か
れた検出コイルで、相互に差動接続されておシ、それら
のコイルの一端及び他端が前記出力点■となっている。In FIGS. 1 to 7, reference numeral 1 denotes a material to be inspected, which is a round bar-shaped steel material and other various metal materials, and is transported toward the right (or left) in the drawings. 2 shows a flaw detection device. In this apparatus, 3 is a rotating device, and 4 is a rotating frame, which can be rotated around the object 1 to be inspected by the rotating device 3. Reference numeral 5 denotes a cylinder attached to the frame 4, and its advancing/retracting rod 5aK is attached with a 10-pipe 6, so that the 10-p.6 can be moved closer to or away from the roofing material to be inspected by moving the retractable rod 5& back. It has become. In the above probe 6, 7' + 7 b-7o, 7
d indicates roughly 10-p elements, which are arranged in the transport direction of the material 1 to be inspected. That is, by rotating the rotating frame 4, 1
Inspected material 1 when the 0-pu 6 rotates the rotating shaft of the inspected material 1
and 10-p 6 (the helical direction along the surface of the inspected material 10). 8
is the input end of the excitation signal in the probe 6 (which may be configured in the form of an independent terminal or in the form of a simple lead wire), and is connected to each of the probe elements 7a to 7d.
Input points 98 to 9d of excitation signals at K are connected in series. Reference numeral 10 denotes an output terminal for the flaw signal in the probe 6, which is constructed in the same manner as the input terminal 8.
Output point 11B-1 of flaw signal in pull elements 7a to 7d
1d is connected in parallel. Next, the probe elements 7a~
7d is particularly constructed as shown in FIG. Since all of the 10-p elements I/'i have the same structure, the alphabetical subscripts a- and -d will be omitted from the explanation in FIG. The 12° ribs are magnetic poles, and 14 and 15 are detection coils wound around them, which are differentially connected to each other, and one end and the other end of these coils serve as the output point (2).
論は励振コイｐで、その一端及び他端が前記入力点９と
なっている。尚上記検出コイル１４ 、１５の差動接続
は、励振コイル１６から発せられる磁束によって各検出
コイ／Ｌ’１４．１５が大々検出する信号が相互に打消
される様周知の如く行なわれている吃のである。次に１
７は周知の探傷回路で、前記１０−プ６の入力端８及び
出力端１０に大々接続されている。尚プローブ６は被検
査材１の周囲を回動し、（Ｂ１
又探傷回路１７はその近傍に固定的に設けられるもので
ある為、上記接続は例えば回転トランスの様な回転部分
と固定部分との間で信号の伝達を行ない得る信号伝達手
段を用いて行なわれる。１８ 、１９は大々周知のマー
カー制御回路及びマーカーを示す。The mechanism is an excited coil p, one end and the other end of which serve as the input point 9. The differential connection of the detection coils 14 and 15 is carried out in a well-known manner so that the signals detected by each detection coil/L'14.15 are largely canceled by the magnetic flux emitted from the excitation coil 16. I stutter. Next 1
Reference numeral 7 designates a well-known flaw detection circuit, which is connected to the input terminal 8 and output terminal 10 of the 10-p. Note that the probe 6 rotates around the inspected material 1 (B1). Also, since the flaw detection circuit 17 is fixedly installed in the vicinity, the above connection is made between a rotating part such as a rotating transformer and a fixed part. This is carried out using a signal transmission means capable of transmitting signals between the two.18 and 19 indicate a well-known marker control circuit and a marker.
次に上記構成のものの動作を説明する。まず被検査材１
は図示外の周知の移送装置によって矢印方向に移送され
ると共に１回動枠４がその回シを回動しプローブ６が被
検査材１の周囲を回動する。Next, the operation of the above configuration will be explained. First, inspected material 1
is transferred in the direction of the arrow by a well-known transfer device (not shown), and the rotating frame 4 rotates the rotation frame so that the probe 6 rotates around the material 1 to be inspected.
この過程において、探傷回路１７からは周知の如く励振
信号が入力端８に向けて出力され各１０−プ要素７ａ〜
７ｄの励振コイＶが作動して被検査材１に向けて磁束が
発せられる。そして各プローブ要素７ａ〜７ｄの何れか
と対向する位置に被検査材ｌに存在する傷が到来すると
、その傷と対向した１０−プ要素から発せられる磁束が
影響を受ける。するとその１０−プ要素の検出コイＡ／
１４ 、 Ｍｌによ如、上紀傷の存在による上記磁束の
変動が検出され、その検出信号が傷信号として出力点Ｕ
か（４）
ら出力端ｌＯに向けて送られる。その信号は出力端１０
から探傷回路１７に伝わり、回路１７においてはその信
号の判別が行なわれる。そして上記検出された傷が補修
（例えば研削）を要する傷である場合にはマーカー制御
回路１８に″信号が送られ、マーカー１９が作動して上
記検出された傷の存在する位置において被検葺材ＩＫマ
ークが付される。In this process, the flaw detection circuit 17 outputs an excitation signal to the input terminal 8 as is well known, and each of the 10-p elements 7a to
The excitation coil V 7d is activated and a magnetic flux is emitted toward the material 1 to be inspected. When a flaw existing in the inspected material 1 arrives at a position facing any of the probe elements 7a to 7d, the magnetic flux emitted from the 10-p element facing the flaw is affected. Then, the detection coil A/ of the 10-p element
14. According to Ml, the fluctuation in the magnetic flux due to the presence of a flaw is detected, and the detection signal is sent to the output point U as a flaw signal.
(4) and is sent toward the output terminal lO. The signal is at output terminal 10
The signal is then transmitted to the flaw detection circuit 17, where the signal is discriminated. If the detected flaw requires repair (for example, grinding), a signal is sent to the marker control circuit 18, and the marker 19 is activated to locate the detected flaw on the roofing material at the location where the detected flaw exists. IK mark will be attached.
次に上記の様に１０−プ要素７ａ〜７ｄＫよシ傷が検出
される場合の様子を第５図乃至第７図を用いて更に説明
する。尚第５図においてＷけ前記四つの１０−プ要素７
ａ〜７ｄＫよって探傷が行なわれる幅（被検査材１０局
面の一部）を示し、第５図においてはプローブ要素７ａ
〜７ｄの回動によって、それらの１０−プ要素に対し被
検査材１の周面が矢印Ｘ方向に相対移動するものとする
、この状態において被検査材ｌの表面に存在する傷りが
例えば１０−プ要素７ｂと対向する位置に来たものとす
る。するとそのプローブ要素７ｂは傷ツの到来を検出し
て第６図に示す如く傷信号加を出力する。一方傷２の到
来しなかった他のブローブ要素７＆ｅ７（３＠７ｄは第
６図に示す如く大々僅かなノイズ刀を出力しているのみ
である。各１０−プ要素７＆〜７ｄが上記のような信号
を出力すると、それらの出力点１１ Ｂ −１１ｄは出
力端１ｏに対して相互に並列接続しである為、出力端１
ｏからは第７図に示される如き信号が出方される。即ち
、傷信号加はプローブ要素７ｂから到来した高レベルの
ままで出力され、又ノイズ〃はそのレベルが増大するこ
となく出力される。即ちＳＮ比の良好な信号が探傷回路
１７に向けて出力される。Next, the situation in which scratches are detected in the 10-p elements 7a to 7dK as described above will be further explained with reference to FIGS. 5 to 7. In FIG. 5, the four 10-p elements 7 are
a to 7dK indicates the width (a part of the surface of the inspected material 10) where flaw detection is performed, and in FIG. 5, the probe element 7a
It is assumed that by rotation of ~7d, the circumferential surface of the inspected material 1 moves relative to these 10-p elements in the direction of the arrow X. In this state, the damage existing on the surface of the inspected material 1 is 10- It is assumed that the object has come to a position facing the element 7b. Then, the probe element 7b detects the arrival of a flaw and outputs a flaw signal as shown in FIG. On the other hand, the other probe elements 7&e7 (3@7d) to which the scratch 2 did not occur output only a very small amount of noise as shown in FIG. When such a signal is output, since those output points 11B-11d are connected in parallel with the output terminal 1o, the output terminal 1
A signal as shown in FIG. 7 is output from o. That is, the flaw signal is outputted as it is at the high level coming from the probe element 7b, and the noise is outputted without its level increasing. That is, a signal with a good signal to noise ratio is output to the flaw detection circuit 17.
尚上記実施例においては各１０−プ要素の励振コイル１
６が入力端８に対して直列接続しである為、各１０−プ
要素７ａ〜７ｄの各々の特性に製作上のばらつきがあっ
ても、それらの１０−プ要素における各励振コイル１６
には総て同位相の励振信号が与えられる。従って、各１
０−プ要素７ａ〜７ｄの各々の出力点１１ Ｂ −１１
ｄから出力された信号は一つの探傷回路１７でもって同
一の処理を行なうととができる。尚上記各１０−プ要素
７ａ〜７ｄの特性が総て同一の場合にはそれらの入方点
は上記入力端８に並列接続してもよい。In the above embodiment, the excitation coil 1 of each 10-p element is
6 is connected in series to the input end 8, even if there are manufacturing variations in the characteristics of each of the 10-p elements 7a to 7d, each excitation coil 16 in those 10-p elements
are all given excitation signals of the same phase. Therefore, each 1
Output point 11B-11 of each of the 0-p elements 7a to 7d
The signal output from d can be subjected to the same processing by one flaw detection circuit 17. Incidentally, if the characteristics of each of the 10-p elements 7a to 7d are the same, their input points may be connected in parallel to the input terminal 8.
次に第８図は本願の異なる実施例を示すもので、複数の
１０−プ要索７ ａｅ 、 ７ ｂｅ 、 ７ ａｓを
相互間に間隔をおいて配設した例を示すものである。Next, FIG. 8 shows a different embodiment of the present application, and shows an example in which a plurality of 10-pipelines 7 ae , 7 be , and 7 as are arranged at intervals.
尚それらの１０−プ要素の配設間隔は、検出を必要とす
る程度の大きさの傷が到来した場合にその傷が何れかの
１０−プ要素によって検出され得る様に定めるとよい。The spacing between the 10-p elements is preferably determined so that when a flaw large enough to require detection arrives, the flaw can be detected by any of the 10-p elements.
なお、機能上前図のものと同−又は均等構成と考えられ
る部分には、前回と同一の符号にアルファベットのｅを
付して重複する説明を省略した。（また次回以降のもの
においても順次同様の考えでアＶファベットのｆ、ｇ、
ｈを順に付して重複する説明を省略する。）
次に第９図は本願の更に異なる実施例を示すもので、複
数の１０−プ要素７ａｆ〜７ｅｆを千鳥状に配設した例
を示すものである。尚この第９図においてプローブと被
検査材との相対移動の方向は矢印Ｘｆで示す方向である
。It should be noted that parts that are considered to have the same or equivalent structure as those in the previous figure in terms of function are given the same reference numerals as in the previous figure with the letter e, and redundant explanations are omitted. (Also, in the next time and subsequent ones, using the same idea, the alphabet f, g,
h are attached in order and redundant explanation will be omitted. ) Next, FIG. 9 shows a further different embodiment of the present application, and shows an example in which a plurality of 10-p elements 7af to 7ef are arranged in a staggered manner. In this FIG. 9, the direction of relative movement between the probe and the material to be inspected is the direction indicated by arrow Xf.
この構成の場合、複数の１０−プ要素の縁部が符（ｌ）
号幻で示す様に上記相対移動の方向Ｘｆに対して重合す
る様に配列するととｋよシ、その重合部分においては二
つの１０−プ要素によって被検査材の探傷が行なわれる
。その為、各プローブ要素がその縁部においては傷の検
出感度が低下する性質があって本、傷を見落すことなく
検出することが可能となる。In this configuration, if the edges of the plurality of 10-p elements are arranged so as to overlap with each other in the direction of relative movement Flaw detection of the inspected material is carried out by two 10-p elements. Therefore, each probe element has a property that the detection sensitivity for scratches decreases at the edges thereof, so that it is possible to detect a book without overlooking any scratches.
次に第１０図及び第１１図は本願の更に異なる実施例を
示すもので、複数の１０−プロｇ、ａｈを被検査材の周
囲を取如囲むよう大々固定的に設け、それらの１０−プ
に対して被検査材１ｇ、ｌｈを夫々の軸線方向（図にお
いて紙面と垂直な方向）Ｋ移動させることによって、そ
れらの被検査材の局面全域での傷の検出を行ない得る様
にした例を示すものである。尚ツは通常の単独構成のプ
ローブを示す。Next, FIG. 10 and FIG. 11 show still another embodiment of the present application, in which a plurality of 10-pro g, ah are fixedly provided in a large scale so as to surround the inspected material. - By moving the inspected materials 1g and lh in their respective axial directions (in the direction perpendicular to the plane of the paper in the figure) K relative to the surface, it was possible to detect flaws over the entire surface area of the inspected materials. This is an example. The figure shows a normal single-configuration probe.
以上のようにこの発明にあっては、
Ｕ）被検査材１を探傷する場合、被検査材１に対し相対
移動してその表面を渦流探傷し、傷の有無を１０−プ６
で検知して傷のあったときには傷信号（８）
を出力できる特長がある。As described above, in this invention, U) When inspecting the material 1 to be inspected, the surface is subjected to eddy current flaw detection by moving relative to the material 1 to be inspected, and the presence or absence of flaws is detected by 10-p6.
It has the feature that it can output a flaw signal (8) when it detects a flaw.
（ロ）しかも上記１０−プ６は上記相対移動の方向と交
差する方向に並設された複数の１０−プ要素７８〜７ｄ
を有するから、上記探傷の場合、一度の相対移動でその
移動方向に対して広幅な範囲を探傷でき、能率良く探傷
作業を行ない得る効果がある。(B) Moreover, the 10-p 6 has a plurality of 10-p elements 78 to 7d arranged in parallel in a direction intersecting the direction of relative movement.
Therefore, in the case of the flaw detection described above, a wide range can be detected in the direction of movement by one relative movement, and the flaw detection work can be carried out efficiently.
（ハ）その上上記複数のプローブ要素７ａ〜７ｄによっ
て広幅な範囲を探傷できるようにしたものであっても、
それらの１０−プ要素の各出力点は並列接続しているか
ら、それらのうちのいずわが１または複数の１０−プ要
紫が傷を検出した場合、それらが夫々傷を検出して得た
傷信号は単一の１０−プ要素の場合と同等の高レベルで
取シ出すことができる一方、各１０−プ要素７ａ〜７ｄ
がら生ずるノイズ４単−の１０−プ要素の場合と同程度
の低いレベルで取郵出すことのできる特長がある。(c) Furthermore, even if a wide range can be detected by the plurality of probe elements 7a to 7d,
Since the respective output points of these 10-p elements are connected in parallel, if one or more of them detects a flaw, each of them detects a flaw and obtains a result. While the flaw signal can be extracted at a level as high as with a single 10-p element, each 10-p element 7a-7d
It has the advantage of being able to produce noise at a level as low as that of a 4-channel or 10-channel element.
とのことは、広幅な範囲を８Ｎ比高く探傷できる効果が
あるその上に、複数の１０−プ要素を備えていても、極
めて高価な探傷回路は単一１０−プの場合と同じ１台で
良く、設備費用を安価なものにし得る効果もある。This means that it is effective in detecting flaws over a wide range at a higher rate than 8N.Furthermore, even if it is equipped with multiple 10-pole elements, the extremely expensive flaw detection circuit is the same as in the case of a single 10-pole. This has the effect of reducing equipment costs.
図面は本願の実施例を示すもので、第１図は探傷装置の
側面図、第２図は探傷装置のブロック回路図、第８図は
グローブ要素と探傷回路との接続関係を示す回路図（プ
ローブ要素に関しては第２図と同方向から見た状態を示
した）、第４図は１０−プ要素の正面図（被検査材と対
向する面の側から見た状態を示す図）、第５図は複数の
１０−プ要素による被検査材の傷の検出状態を説明する
為の平面図、第６図はプローブ要素の出力信号波形図、
第７図はプローブの出力端における出力信号波形図、第
８図はプローブ要素の配列状態の異なる例を示す図（第
８図と同方向から見た図）、第９図はプローブ要素の配
列状態の更に異なる例を示す図（第５図と同方向から見
た状態を示す図）、第１０図及び第１１図は１０−プ要
素の配列状態の更に異なる例を示す図。
１・・・被検査材、６°°°プローブ・７ａ・７ｂ、７
０ ＠７ｄ−−・７０−７”要素、１０−−−出力端、
ｕａ、ｌｌｂ、１１１．１１ａ、 ・−出力点。
（１１）The drawings show an embodiment of the present application, and FIG. 1 is a side view of the flaw detection device, FIG. 2 is a block circuit diagram of the flaw detection device, and FIG. 8 is a circuit diagram showing the connection relationship between the glove element and the flaw detection circuit ( The probe element is shown as seen from the same direction as in Fig. 2), Fig. 4 is a front view of the 10-probe element (as seen from the side facing the surface to be inspected), FIG. 5 is a plan view for explaining the state of detection of flaws on the inspected material by a plurality of 10-probe elements, and FIG. 6 is an output signal waveform diagram of the probe elements.
Figure 7 is a diagram of the output signal waveform at the output end of the probe, Figure 8 is a diagram showing different examples of the arrangement of probe elements (viewed from the same direction as Figure 8), and Figure 9 is the arrangement of probe elements. FIGS. 10 and 11 are diagrams showing further different examples of the state (viewed from the same direction as FIG. 5), and FIGS. 10 and 11 are diagrams showing still different examples of the arrangement of the 10-p elements. 1... Material to be inspected, 6°°° probe 7a, 7b, 7
0 @7d---・70-7" element, 10---output end,
ua, llb, 111.11a, - Output point. (11)
Claims (1)
傷を渦流探傷すると共に、探傷して得た傷信号を出力端
から探傷回路に向は出方するようにしている渦流探傷用
プローブにおいて、上記渦流探傷用１０−プは、大々被
検査材を個々に渦流探傷すると共和その探傷によル得た
傷信号を各々の出力点から出力するようＫした複数の１
０−プ要素を有し、しかもそれらの１０−プ要素は上記
相対移動の方向と交差する方向に並設しであると共ｋ、
各々の１０−プ要素の出力点は上記出方端に並列接続し
であることを特徴とする渦流探傷用プローブ。For eddy current flaw detection, the flaws on the surface of the inspected material are detected by moving relative to the inspected material, and the flaw signal obtained from the flaw detection is output from the output end to the flaw detection circuit. In the probe, the above-mentioned eddy current flaw detection device 10 has a plurality of probes configured to perform eddy current flaw detection on the inspected material individually and output flaw signals obtained by the flaw detection from respective output points.
0-p elements, and these 10-p elements are arranged in parallel in a direction intersecting the direction of the relative movement, and
An eddy current flaw detection probe characterized in that an output point of each 10-p element is connected in parallel to the output end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58181439A JPS6071947A (en) | 1983-09-29 | 1983-09-29 | Probe for eddy current flaw detection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58181439A JPS6071947A (en) | 1983-09-29 | 1983-09-29 | Probe for eddy current flaw detection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6071947A true JPS6071947A (en) | 1985-04-23 |
Family
ID=16100786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58181439A Pending JPS6071947A (en) | 1983-09-29 | 1983-09-29 | Probe for eddy current flaw detection |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6071947A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2681430A1 (en) * | 1991-09-12 | 1993-03-19 | Valtubes | NON - DESTRUCTIVE CONTROL DEVICE FOR LONG - TERM REVOLUTION METAL PRODUCTS AND METHOD FOR ITS IMPLEMENTATION. |
| JPH05232087A (en) * | 1992-02-21 | 1993-09-07 | Nkk Corp | Magnetic damage detecting device |
-
1983
- 1983-09-29 JP JP58181439A patent/JPS6071947A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2681430A1 (en) * | 1991-09-12 | 1993-03-19 | Valtubes | NON - DESTRUCTIVE CONTROL DEVICE FOR LONG - TERM REVOLUTION METAL PRODUCTS AND METHOD FOR ITS IMPLEMENTATION. |
| JPH05232087A (en) * | 1992-02-21 | 1993-09-07 | Nkk Corp | Magnetic damage detecting device |
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