JPS6071169U - Mounting structure of chip parts - Google Patents
Mounting structure of chip partsInfo
- Publication number
- JPS6071169U JPS6071169U JP16210883U JP16210883U JPS6071169U JP S6071169 U JPS6071169 U JP S6071169U JP 16210883 U JP16210883 U JP 16210883U JP 16210883 U JP16210883 U JP 16210883U JP S6071169 U JPS6071169 U JP S6071169U
- Authority
- JP
- Japan
- Prior art keywords
- mounting structure
- chip parts
- chip component
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図および第２図はそれぞれ従来のチップ部品の取り
付は構造を説明する図、第３図はこの考案の二実施例に
係るチップ部品の取り付は構造を示す図でＡは断面図、
ＢはＡ図のｂ−ｂ線断面図、Ｃは取り付は部を平面から
見た図である。
２０・・・・・・プリント基板、２１・・曲スリット、
２２・・・・・・チップ部品、２３．２４・・曲プリン
ト配線部、２５．２６・・・・・・半田。Figures 1 and 2 are diagrams each explaining the structure of the conventional chip component installation, and Figure 3 is a diagram showing the structure of the chip component installation according to two embodiments of this invention, and A is a cross-sectional view. ,
B is a cross-sectional view taken along line bb of Figure A, and C is a plan view of the mounting section. 20... Printed circuit board, 21... Curved slit,
22... Chip parts, 23.24... Song printed wiring section, 25.26... Solder.
Claims (1)
、且つ上記チップ部品の直径よりもやや小さくしたスリ
ットをプリント基板に形成してなり、上記スリットに対
して上記チップ部品を嵌め込み設定し、このチップ部品
の両端部でプリント基板上の配線部に半田付は接続し得
るようにしてなるチップ部品の取り付は構造。A slit that is slightly longer than the length of the columnar chip component to be attached and slightly smaller than the diameter of the chip component is formed on the printed circuit board, and the chip component is fitted into the slit and set. The mounting structure for chip components is such that they can be soldered to the wiring on the printed circuit board at both ends.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16210883U JPS6071169U (en) | 1983-10-20 | 1983-10-20 | Mounting structure of chip parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16210883U JPS6071169U (en) | 1983-10-20 | 1983-10-20 | Mounting structure of chip parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6071169U true JPS6071169U (en) | 1985-05-20 |
Family
ID=30356074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16210883U Pending JPS6071169U (en) | 1983-10-20 | 1983-10-20 | Mounting structure of chip parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6071169U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5527663A (en) * | 1978-08-18 | 1980-02-27 | Matsushita Electric Ind Co Ltd | Method of mounting leadless part |
| JPS58138089A (en) * | 1982-02-12 | 1983-08-16 | 株式会社日立製作所 | Circuit board |
-
1983
- 1983-10-20 JP JP16210883U patent/JPS6071169U/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5527663A (en) * | 1978-08-18 | 1980-02-27 | Matsushita Electric Ind Co Ltd | Method of mounting leadless part |
| JPS58138089A (en) * | 1982-02-12 | 1983-08-16 | 株式会社日立製作所 | Circuit board |
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