JPS6069524A - Infrared ray detecting element - Google Patents

Infrared ray detecting element

Info

Publication number
JPS6069524A
JPS6069524A JP59157849A JP15784984A JPS6069524A JP S6069524 A JPS6069524 A JP S6069524A JP 59157849 A JP59157849 A JP 59157849A JP 15784984 A JP15784984 A JP 15784984A JP S6069524 A JPS6069524 A JP S6069524A
Authority
JP
Japan
Prior art keywords
electrode
infrared
adhesive
pyroelectric
nicr
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59157849A
Other languages
Japanese (ja)
Other versions
JPH0311655B2 (en
Inventor
Takeo Ishigaki
石垣 武夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP59157849A priority Critical patent/JPS6069524A/en
Publication of JPS6069524A publication Critical patent/JPS6069524A/en
Publication of JPH0311655B2 publication Critical patent/JPH0311655B2/ja
Granted legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/34Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using capacitors, e.g. pyroelectric capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Radiation Pyrometers (AREA)

Abstract

PURPOSE:To improve a yield of connection and reliability by providing an infrared reflection electrode on an infrared absorption electrode formed on a surface of an infrared detecting element with leaving blank spaces at the end surface and the center part, and connecting the end surface blank space part and a connecting electrode formed on a supporting base with a conductive adhesive. CONSTITUTION:A pyroelectric material such as PbTiO3 ceramic is used to the infrared detecting element 1, NiCr is vapor deposited on the infrared absorption electrode 11, and NiCr is vapor deposited thickly on an electrode 12 of the rear side to prevent a transmission of infrared rays. Al is vapor deposited as the slender infrared reflection electrode 14 on the electrode 11 of the front surface with a little distance apart from the element end surface. Both ends of the pyroelectric element 1 are pasted to a supporting bases 2 made of Si having insulator layers with a conductive adhesive 3 and an insulating adhesive 5 respectively. Thereafter, an upper surface of the pyroelectric element and a connecting electrode 21 on the base 2 are connected with the adhesive 3. An ohmic contact of the adhesive 3 with the electrode 11 is good since the electrode 11 is made of NiCr, and the adhesion strength is high, since the electrode 14 is made of Al.

Description

【発明の詳細な説明】 産業上の利用分野 本発明はリード接続の簡単な赤外線検出素子に関する。[Detailed description of the invention] Industrial applications The present invention relates to an infrared detection element with simple lead connection.

従来例の構成とその問題点 赤外線検出素子のリード接続は通常、直接ボンディング
で行なわれている。しかし直接ボンディングは素子が小
さくなると、素子の破損等が生じてくる。特に、素子を
多数個列状に配列したりニアアレイ素子の如く多素子に
なると素子から直接ボンディング等でリードをとるのは
非常に難かしくなってくる。そこで第1図に示すように
支持台2の上に接続電極21.22を設け、その電極か
ら接続線4をとる方法が行なわれている。図において、
1は両面に赤外吸収電極11および裏面電極12が形成
された焦電素子で、焦電素子1の一端は焦電素子1上の
電極13を通して導電性接着剤3で支持台2の接続電極
21に接着し、他端は裏面電極12と接続電極22が電
気的に接続するように導電性接着剤3で接着される。4
はリード線、6は裏面電極12と接続電接21との電気
的接触を防ぎ、焦電素子1と支持台2とを接着するだめ
の絶縁性接着剤である。この方法においては、接続電極
21,22.13は導電性接着剤13とオーミック接触
がとれていなければならず、これらに例えばAtを用い
ると良い結果が得られない。
Conventional Structures and Problems The leads of the infrared detection element are usually connected by direct bonding. However, direct bonding causes damage to the element as the element becomes smaller. Particularly, when a large number of elements are arranged in rows or there are many elements such as a near array element, it becomes very difficult to take leads directly from the elements by bonding or the like. Therefore, as shown in FIG. 1, a method is used in which connection electrodes 21 and 22 are provided on the support base 2 and the connection wire 4 is taken from the electrodes. In the figure,
Reference numeral 1 denotes a pyroelectric element having an infrared absorbing electrode 11 and a back electrode 12 formed on both sides, and one end of the pyroelectric element 1 is connected to the connecting electrode of the support base 2 with a conductive adhesive 3 through an electrode 13 on the pyroelectric element 1. 21, and the other end is bonded with a conductive adhesive 3 so that the back electrode 12 and the connection electrode 22 are electrically connected. 4
1 is a lead wire, and 6 is an insulating adhesive for preventing electrical contact between the back electrode 12 and the connection terminal 21 and for bonding the pyroelectric element 1 and the support base 2 together. In this method, the connection electrodes 21, 22, 13 must be in ohmic contact with the conductive adhesive 13, and good results cannot be obtained if, for example, At is used for these.

Auを用いれば接触としては良好であるが、小さな素子
に蒸着でつけられたAu電極(d接着強度が弱く、はが
れやすい。接着強度を増すために下地にCr等を蒸着し
たり、スパッタ等形成方法をかえても十分な強度が得ら
れず、機械的な力が加わると上記同様にはがれやすい。
If Au is used, the contact will be good, but if the Au electrode is attached to a small element by vapor deposition, the adhesion strength is weak and it easily peels off. Even if the method is changed, sufficient strength cannot be obtained, and when mechanical force is applied, it tends to peel off as described above.

発明の目的 本発明は以上のような欠点を解消するもので、接続電極
と導電性接着剤がオーミック接触をもち、かつ焦電素子
との接着強度も強くボンディングの可能な赤外線検出素
子を提供することを目的としたものである。
Purpose of the Invention The present invention solves the above-mentioned drawbacks, and provides an infrared detection element in which a connecting electrode and a conductive adhesive have ohmic contact, and also has strong adhesive strength with a pyroelectric element and can be bonded to the pyroelectric element. It is intended for this purpose.

発明の構成 本発明においては焦電素子の表面に赤外吸収電極を設け
、その上に素子端”面から少し離して赤外反射電極をつ
け、この赤外反射電極より素子端面側の赤外吸収電極と
支持台上の接続電極とを導電性接着剤で接続させるよう
にしたものである。
Structure of the Invention In the present invention, an infrared absorbing electrode is provided on the surface of the pyroelectric element, and an infrared reflecting electrode is attached on top of the infrared absorbing electrode at a distance from the end face of the element. The absorption electrode and the connection electrode on the support stand are connected using a conductive adhesive.

実施例の説明 以下本発明の実施例について図面とともに詳細に説明す
る。
DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

第2図において赤外線検出素子1にPi)Ti○3セラ
ミック等の焦電材料を用いる。赤外吸収電極11にはl
”J i Crを蒸着し、裏面の電極12は赤外線が透
過しない様にN i Crを厚く蒸着する。表面の赤外
吸収電極11上には素子端面より少しはなして細長い赤
外反射電極14としてAtを蒸着する。Atは接着強度
は強く、ボンディング電極としては良いが導電性接着剤
との接着性はよくない。
In FIG. 2, a pyroelectric material such as Pi)Ti○3 ceramic is used for the infrared detecting element 1. The infrared absorbing electrode 11 has l
"J i Cr is deposited, and N i Cr is deposited thickly on the back electrode 12 so that infrared rays do not pass therethrough. On the front infrared absorbing electrode 11, an elongated infrared reflecting electrode 14 is formed slightly away from the end face of the element. At is vapor-deposited. At has strong adhesive strength and is good as a bonding electrode, but its adhesion to conductive adhesives is poor.

焦電素子10両端は絶縁層をもったSi で作られた支
持台2に導電性接着剤3及び絶縁性接着剤5によってそ
れぞれはりつけられる。その後焦電素子上面と支持台2
上の接続電極21との間を導電性接着剤3で接続する。
Both ends of the pyroelectric element 10 are attached to a support base 2 made of Si with an insulating layer using a conductive adhesive 3 and an insulating adhesive 5, respectively. After that, the top surface of the pyroelectric element and the support base 2
A connection is made between the upper connection electrode 21 and the conductive adhesive 3.

リニアアレイ素子にする場合はこの素子をダイシング等
で支持台に切りこみを入れる位に切ってやれば良い。
When making a linear array element, this element may be cut by dicing or the like to the extent that notches are made in the support base.

この構成においては、赤外吸収電極11はNiCrであ
るので導電性接着剤3とオーミック接触は良好であり、
また、赤外反射電極14はAtなので接着強度は高い。
In this configuration, since the infrared absorbing electrode 11 is made of NiCr, the ohmic contact with the conductive adhesive 3 is good.
Furthermore, since the infrared reflective electrode 14 is made of At, its adhesive strength is high.

この場合、赤外吸収電極14は焦電素子1の赤外受光面
を規制する役割を果している。このようにして作製され
た赤外検出素子は接続電極21.22が81支持台2上
にあるため他と結線するにも半導体なみに扱うことがで
きるので非常に都合が良い。なおこのSi上の接続電極
21.22はポンディング可能にするためCr −P 
b−Auの3層蒸着を行なっているが、これでも強度的
に不十分な場合は、一部をオーバーラツプさせるように
してこのCr−Pd−Au−Alを蒸着でつけても良い
In this case, the infrared absorbing electrode 14 plays the role of regulating the infrared receiving surface of the pyroelectric element 1. The infrared detection element manufactured in this manner is very convenient because the connection electrodes 21 and 22 are on the support 81 and the element can be treated like a semiconductor when connecting to other devices. Note that the connection electrodes 21 and 22 on this Si are made of Cr-P to enable bonding.
Although three layers of b-Au are deposited, if this is still insufficient in terms of strength, Cr--Pd--Au--Al may be deposited by evaporating so as to partially overlap the layers.

発明の効果 以上のように、本発明は赤外検出素子の表面に形成した
赤外吸収電極上に端面および中央部に余白をとって赤外
反射電極を設け、赤外吸収電極の端面余白部と、支持台
上に形成した接続電極とを導電性接着剤で接続した赤外
線検出素子で、リニアアレイのように多素子の赤外検出
素子において、結線の歩留り、信頼性が向上し、使用に
耐えるものが作製できるようになる。
Effects of the Invention As described above, the present invention provides an infrared reflective electrode on an infrared absorbing electrode formed on the surface of an infrared detecting element, leaving a margin at the end face and the center, and the end face margin of the infrared absorbing electrode. This is an infrared detection element in which a conductive adhesive is used to connect a connection electrode formed on a support base with a conductive adhesive, which improves the yield and reliability of wiring in multi-element infrared detection elements such as linear arrays, making it suitable for use. You will be able to create things that will last.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来の赤外線検出素子の一例における断面図、
第2図は本、発明における赤外検出素子覧 の実施例を示す断面図である。 1・・・・・焦電材料、11・・・・・・赤外吸収電極
、12・・・・・・裏面電極、13・・・・・素子接続
電極、14・・・・・・赤外反射電液、2・・・・・・
支持台、21..22・・・・支持台接続電極、3・・
・・・・導電性接着剤、4・・・・l/ −ド線、5・
・・・・・絶縁性接着剤。
FIG. 1 is a cross-sectional view of an example of a conventional infrared detection element.
FIG. 2 is a sectional view showing an example of an infrared detection element according to the present invention. 1...Pyroelectric material, 11...Infrared absorption electrode, 12...Back electrode, 13...Element connection electrode, 14...Red External reflective electrolyte, 2...
Support stand, 21. .. 22... Support base connection electrode, 3...
... Conductive adhesive, 4...L/- wire, 5.
...Insulating adhesive.

Claims (1)

【特許請求の範囲】[Claims] 焦電素子の表面に赤外吸収電極を設け、この赤外吸収電
極上の中央部および端部を除いた領域に赤外反射電極を
形成し、支持台上の接続電極と上記赤外吸収電極の端部
とを導電性接着剤で接続したことを特徴とする赤外線検
出素子。
An infrared absorbing electrode is provided on the surface of the pyroelectric element, an infrared reflective electrode is formed on the infrared absorbing electrode except for the center and edges, and the connecting electrode on the support and the infrared absorbing electrode are formed on the infrared absorbing electrode. An infrared detection element characterized in that an end portion of the infrared detection element is connected with a conductive adhesive.
JP59157849A 1984-07-27 1984-07-27 Infrared ray detecting element Granted JPS6069524A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59157849A JPS6069524A (en) 1984-07-27 1984-07-27 Infrared ray detecting element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59157849A JPS6069524A (en) 1984-07-27 1984-07-27 Infrared ray detecting element

Publications (2)

Publication Number Publication Date
JPS6069524A true JPS6069524A (en) 1985-04-20
JPH0311655B2 JPH0311655B2 (en) 1991-02-18

Family

ID=15658704

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59157849A Granted JPS6069524A (en) 1984-07-27 1984-07-27 Infrared ray detecting element

Country Status (1)

Country Link
JP (1) JPS6069524A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0514860U (en) * 1991-07-31 1993-02-26 テイーデイーケイ株式会社 Pyroelectric infrared detector
JPH0579908A (en) * 1991-09-24 1993-03-30 Nohmi Bosai Ltd Pyroelectric element
US5625188A (en) * 1993-10-29 1997-04-29 Murata Manufacturing Co., Ltd. Pyroelectric infrared array sensor
US6175114B1 (en) 1993-10-29 2001-01-16 Murata Manufacturing Co., Ltd. Pyroelectric infrared array sensor

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0514860U (en) * 1991-07-31 1993-02-26 テイーデイーケイ株式会社 Pyroelectric infrared detector
JPH0579908A (en) * 1991-09-24 1993-03-30 Nohmi Bosai Ltd Pyroelectric element
US5625188A (en) * 1993-10-29 1997-04-29 Murata Manufacturing Co., Ltd. Pyroelectric infrared array sensor
US6175114B1 (en) 1993-10-29 2001-01-16 Murata Manufacturing Co., Ltd. Pyroelectric infrared array sensor

Also Published As

Publication number Publication date
JPH0311655B2 (en) 1991-02-18

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