JPS6059559U - External lead lead structure of electrode board - Google Patents
External lead lead structure of electrode boardInfo
- Publication number
- JPS6059559U JPS6059559U JP1983149886U JP14988683U JPS6059559U JP S6059559 U JPS6059559 U JP S6059559U JP 1983149886 U JP1983149886 U JP 1983149886U JP 14988683 U JP14988683 U JP 14988683U JP S6059559 U JPS6059559 U JP S6059559U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- external lead
- external
- electrode substrate
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Multi-Conductor Connections (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来例を示す要部断面図、第2図は本考案の一
実施例を示す断面図、第3図は本考案の他の実施例を示
す断面図である。
2.2′・・・絶縁基板、3,3′・・・導電体層、3
b・・・外部リード導出部、4,4′・・・電極基板、
8・・・外部リード、8a・・・絶縁被覆、8b・・・
導体、10・・・絶縁性固定部材、11・・・補強板。FIG. 1 is a sectional view of a main part showing a conventional example, FIG. 2 is a sectional view showing one embodiment of the present invention, and FIG. 3 is a sectional view showing another embodiment of the present invention. 2.2'...Insulating substrate, 3,3'...Conductor layer, 3
b...External lead lead-out part, 4, 4'... Electrode board,
8...External lead, 8a...Insulation coating, 8b...
Conductor, 10... Insulating fixing member, 11... Reinforcement plate.
Claims (2)
板の外部リード導出部に絶縁被覆リードより成る外部リ
ードの露出導体部を接続し、該接続部及びその周辺を絶
縁性固定部材によって被覆固定して成る電極基板の外部
リード導出構造に於いて、外部リードを電極基板端面に
沿って配置すると共に、電極基板と外部リードとの接続
部、外部リード導出部、外部リードの露出導体部及び外
部リードの電極基板端面に沿って配された部分を絶縁性
固定部材によって被覆して電極基板に固定したことを特
徴とする電極基板の外部リード導出構造。(1) Connect the exposed conductor portion of the external lead made of the insulated lead to the external lead lead-out portion of the electrode substrate formed by depositing a conductive layer on the insulating substrate, and insulate and fix the connecting portion and its surroundings. In the external lead lead-out structure of an electrode substrate covered and fixed by a member, the external leads are arranged along the end surface of the electrode substrate, and the connection part between the electrode board and the external lead, the external lead lead-out part, and the external lead are exposed. 1. An external lead lead-out structure for an electrode substrate, characterized in that a conductor portion and a portion of the external lead arranged along an end surface of the electrode substrate are covered with an insulating fixing member and fixed to the electrode substrate.
徴とする実用新案登録請求の範囲第1項に記載の電極板
の外部リード導出構造。(2) An external lead lead-out structure for an electrode plate according to claim 1, which is characterized in that a reinforcing plate is disposed on the surface of the insulating fixing member.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983149886U JPS6059559U (en) | 1983-09-28 | 1983-09-28 | External lead lead structure of electrode board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983149886U JPS6059559U (en) | 1983-09-28 | 1983-09-28 | External lead lead structure of electrode board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6059559U true JPS6059559U (en) | 1985-04-25 |
Family
ID=30332591
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1983149886U Pending JPS6059559U (en) | 1983-09-28 | 1983-09-28 | External lead lead structure of electrode board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6059559U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04312772A (en) * | 1991-04-09 | 1992-11-04 | Hitachi Cable Ltd | Terminal processing part of coaxial cable |
JP2019062112A (en) * | 2017-09-27 | 2019-04-18 | 京セラ株式会社 | Thermoelectric module |
JP2019138255A (en) * | 2018-02-14 | 2019-08-22 | 日本電産サンキョー株式会社 | Pump device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4840914U (en) * | 1971-09-16 | 1973-05-24 | ||
JPS57103421A (en) * | 1981-11-02 | 1982-06-28 | Kenji Machida | Band pass filter circuit |
-
1983
- 1983-09-28 JP JP1983149886U patent/JPS6059559U/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4840914U (en) * | 1971-09-16 | 1973-05-24 | ||
JPS57103421A (en) * | 1981-11-02 | 1982-06-28 | Kenji Machida | Band pass filter circuit |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04312772A (en) * | 1991-04-09 | 1992-11-04 | Hitachi Cable Ltd | Terminal processing part of coaxial cable |
JP2019062112A (en) * | 2017-09-27 | 2019-04-18 | 京セラ株式会社 | Thermoelectric module |
JP2019138255A (en) * | 2018-02-14 | 2019-08-22 | 日本電産サンキョー株式会社 | Pump device |
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