JPS6055207U - closed switchboard - Google Patents

closed switchboard

Info

Publication number
JPS6055207U
JPS6055207U JP1983146625U JP14662583U JPS6055207U JP S6055207 U JPS6055207 U JP S6055207U JP 1983146625 U JP1983146625 U JP 1983146625U JP 14662583 U JP14662583 U JP 14662583U JP S6055207 U JPS6055207 U JP S6055207U
Authority
JP
Japan
Prior art keywords
closed switchboard
utility
model registration
heat dissipation
resin body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983146625U
Other languages
Japanese (ja)
Inventor
増田　俊美
雅靖 竹内
Original Assignee
日新電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日新電機株式会社 filed Critical 日新電機株式会社
Priority to JP1983146625U priority Critical patent/JPS6055207U/en
Publication of JPS6055207U publication Critical patent/JPS6055207U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
    • H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
    • H02B1/56—Cooling; Ventilation

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Patch Boards (AREA)
  • Installation Of Bus-Bars (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの考案を適用した閉鎖配電盤の側面図、第２
図は放熱装置の一実施例を示す正面図、第３図は第２図
のＡ−Ａ’線で切断した断面図である。 １・・・・・・閉鎖配電盤本体、３・・・・・・母線導
体、４・・・・・・放熱装置、４１・・・・・十−トパ
イプ、４２・・・・・・ひだ、４３・・・・・・取付フ
ランジ。Figure 1 is a side view of a closed switchboard to which this invention is applied, Figure 2
The figure is a front view showing one embodiment of the heat dissipation device, and FIG. 3 is a sectional view taken along line AA' in FIG. 2. 1... Closed switchboard main body, 3... Bus conductor, 4... Heat dissipation device, 41... Tent pipe, 42... Folds, 43...Mounting flange.

Claims (1)

【実用新案登録請求の範囲】 １　高熱伝導性の樹脂体中にヒートパイプを埋設してな
る放熱装置の、その放熱部を盤外に導出するとともに前
記ヒートパイプの一端部を発熱体と接続した閉鎖配電盤
。 ２　樹脂体の放熱部に複数のひだを形成した実用新案登
録請求の範囲第１項記載の閉鎖配電盤。 ３　樹脂体の放熱部表面に導電性塗料を塗着した実用新
案登録請求の範囲第１項又は第２項記載の閉鎖配電盤。[Claims for Utility Model Registration] 1. A heat dissipation device comprising a heat pipe embedded in a highly thermally conductive resin body, the heat dissipation portion of which is led out of the board, and one end of the heat pipe is connected to a heating element. Closed switchboard. 2. The closed switchboard according to claim 1 of the utility model registration claim, in which a plurality of folds are formed in the heat dissipation part of the resin body. 3. The closed switchboard according to claim 1 or 2 of the utility model registration claim, in which a conductive paint is applied to the surface of the heat dissipating part of the resin body.
JP1983146625U 1983-09-20 1983-09-20 closed switchboard Pending JPS6055207U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983146625U JPS6055207U (en) 1983-09-20 1983-09-20 closed switchboard

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983146625U JPS6055207U (en) 1983-09-20 1983-09-20 closed switchboard

Publications (1)

Publication Number Publication Date
JPS6055207U true JPS6055207U (en) 1985-04-18

Family

ID=30326320

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983146625U Pending JPS6055207U (en) 1983-09-20 1983-09-20 closed switchboard

Country Status (1)

Country Link
JP (1) JPS6055207U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013509155A (en) * 2009-10-26 2013-03-07 アルストム・テクノロジー・リミテッド Cooling device for cooling medium voltage switchgear by using a heat pipe that is energized
WO2016027386A1 (en) * 2014-08-20 2016-02-25 株式会社 東芝 Heat releasing device for solid-insulated device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013509155A (en) * 2009-10-26 2013-03-07 アルストム・テクノロジー・リミテッド Cooling device for cooling medium voltage switchgear by using a heat pipe that is energized
WO2016027386A1 (en) * 2014-08-20 2016-02-25 株式会社 東芝 Heat releasing device for solid-insulated device
JPWO2016027386A1 (en) * 2014-08-20 2017-06-29 株式会社東芝 Heat dissipation device for solid insulation equipment

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