JPS6054363U - wiring board - Google Patents

wiring board

Info

Publication number
JPS6054363U
JPS6054363U JP14507283U JP14507283U JPS6054363U JP S6054363 U JPS6054363 U JP S6054363U JP 14507283 U JP14507283 U JP 14507283U JP 14507283 U JP14507283 U JP 14507283U JP S6054363 U JPS6054363 U JP S6054363U
Authority
JP
Japan
Prior art keywords
wiring board
substrate
utility
model registration
hard
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14507283U
Other languages
Japanese (ja)
Inventor
冨田 常雄
Original Assignee
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東芝 filed Critical 株式会社東芝
Priority to JP14507283U priority Critical patent/JPS6054363U/en
Publication of JPS6054363U publication Critical patent/JPS6054363U/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の配線基板の平面図、第2図は従来の配線
基板の断面図、第3図は本考案の一実施例を示す平面図
、第4図は本考案の一実施例を示す断面図、第5図は本
考案の他の実施例を示す平面図、第6図は本考案の他の
実施例を示す断面図である。 31.51・・・・・・基板、32.52・・・・・・
フレキシブル基板、33.53・・・・・・シリコン充
填剤。
Fig. 1 is a plan view of a conventional wiring board, Fig. 2 is a sectional view of a conventional wiring board, Fig. 3 is a plan view showing an embodiment of the present invention, and Fig. 4 is a plan view of an embodiment of the present invention. 5 is a plan view showing another embodiment of the present invention, and FIG. 6 is a sectional view showing another embodiment of the present invention. 31.51... Board, 32.52...
Flexible substrate, 33.53...Silicon filler.

Claims (4)

【実用新案登録請求の範囲】[Scope of utility model registration request] (1)フレキシブル基板と、側端部の面積が基板面に垂
直に切断した場合の面積より大きくなるよう側端部を成
形して前記フレキシブル基板に貼着した硬質基板と、前
記フレキシブル基板と前記硬質基板の側端部とを糊着す
る緩衝物とを有してなることを特徴とする配線基板。
(1) A flexible substrate, a hard substrate whose side edges are shaped so that the area of the side edges is larger than the area when cut perpendicular to the substrate surface, and which is attached to the flexible substrate; 1. A wiring board comprising a cushioning material to which a side edge of a hard board is glued.
(2)硬質基板はその側端部が鋸歯状に成形されたもの
であることを特徴とする実用新案登録請求の範囲第(1
)項記載の配線基板。
(2) Utility model registration claim (1) characterized in that the hard substrate has a serrated side edge.
) Wiring board described in section.
(3)硬質基板はその側端部が波形状に成形されたもの
であることを特徴とする実用新案登録請求の範囲第(1
)項記載の配線基板。
(3) Utility model registration claim (1) characterized in that the rigid substrate has a wave-shaped side end.
) Wiring board described in section.
(4)硬質基板はその側端部の面がフレキシブル基板の
面に対して斜めになるよう成形されたものであることを
特徴とする実用新案登録請求の範囲第(1)項記載の配
線基板。
(4) The wiring board according to claim (1) of the utility model registration claim, wherein the hard board is formed so that the surface of the side end portion thereof is oblique to the surface of the flexible board. .
JP14507283U 1983-09-21 1983-09-21 wiring board Pending JPS6054363U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14507283U JPS6054363U (en) 1983-09-21 1983-09-21 wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14507283U JPS6054363U (en) 1983-09-21 1983-09-21 wiring board

Publications (1)

Publication Number Publication Date
JPS6054363U true JPS6054363U (en) 1985-04-16

Family

ID=30323337

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14507283U Pending JPS6054363U (en) 1983-09-21 1983-09-21 wiring board

Country Status (1)

Country Link
JP (1) JPS6054363U (en)

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