JPS6044194A - Laser marking device - Google Patents
Laser marking deviceInfo
- Publication number
- JPS6044194A JPS6044194A JP58151942A JP15194283A JPS6044194A JP S6044194 A JPS6044194 A JP S6044194A JP 58151942 A JP58151942 A JP 58151942A JP 15194283 A JP15194283 A JP 15194283A JP S6044194 A JPS6044194 A JP S6044194A
- Authority
- JP
- Japan
- Prior art keywords
- apertures
- mask
- pattern
- plates
- marking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
- B23K26/0661—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks disposed on the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/007—Marks, e.g. trade marks
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
この発明は型抜きしたマスクを透過させたレーザ光によ
って半導体装置などの対象物にマーキングラ行うレーザ
・マーキング装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a laser marking device for marking an object such as a semiconductor device using a laser beam transmitted through a die-cut mask.
第1図は従来のレーザ・マーキング装置の原理的構成を
示す斜視図で、(1)はレーザ発振装置のレーザ光発射
口、(2)はとのレーザ光発射口(1)から出たレーザ
光、(3a)は刻印すべきマークに対応した開孔(4)
が形成されたマスク、(5)はマーキングすべき対象物
、(6)はその表面に刻印されたマークである。Figure 1 is a perspective view showing the basic configuration of a conventional laser marking device, in which (1) shows the laser beam emitting port of the laser oscillation device, and (2) the laser beam emitted from the dovetail laser beam emitting port (1). Light, (3a) is the opening corresponding to the mark to be engraved (4)
(5) is the object to be marked, and (6) is the mark engraved on its surface.
従来のレーザ・マーキング装置は以上のように構成され
、レーザ光発射口(1)から発射されたレーザ光(2)
は、マスク(3a)に形成された開孔(4)を透過して
、対象物(5)に上記開孔(4)に対応したマーク(6
)を刻印する。The conventional laser marking device is configured as described above, and the laser beam (2) is emitted from the laser beam emitting port (1).
passes through the aperture (4) formed in the mask (3a) and marks (6) on the object (5) corresponding to the aperture (4).
) is engraved.
ところが、この従来装置では、マーク(6)のパターン
を変更するには、第1図に(3b)として示したような
マークパターン毎にマスクを準備して交換せねばならず
、マークパターンの種類が多い場合にはマスクの製作費
用がかさみ、また、マスクの数が増加すれば、マスクの
自動交換も困難になる。However, in this conventional device, in order to change the pattern of the mark (6), it is necessary to prepare and replace a mask for each mark pattern as shown as (3b) in FIG. If there are many masks, the manufacturing cost of the mask increases, and if the number of masks increases, it becomes difficult to automatically replace the masks.
この発明は以上のような点に鑑みてな。されたもので複
数種のマークパターンの要素をすべて含むパターンの開
孔を有するマスクを用い、そのうちの1つのマークパタ
ーンを刻印するには当該マークパターンに不必要な開孔
をふさいで用いるようにすることによって、準備すべき
マスクの数を減少させ、マスク製作費用4を節約し、マ
ークパターンの変更の自動化の可能なレーザ・マーキン
グ装置を提供するものである。This invention was developed in view of the above points. In order to engrave one of the mark patterns, use a mask that has apertures with a pattern that includes all the elements of multiple types of mark patterns. By doing so, it is possible to reduce the number of masks to be prepared, save mask manufacturing costs 4, and provide a laser marking device capable of automating mark pattern changes.
第3図はこの発明の一実施例の構成を示す斜視図で、第
1図の従来例と同一符号は同等部分を示す。(7)はマ
スク(3a)の開孔(4)の一部を遮る遮光板であシ、
遮光の必要のある開孔の数だけ設けられる。(8)はこ
の遮光板(7)の出し入れするために各遮光板(7)毎
に設けられた直線運動機構である0上記のように構成さ
れたレーザ・マーキング装置では、第2図に示しだよう
に、直線運動機構(8)を適宜駆動して、マスク(3a
)のマーキングに不用な開孔(4)を遮光板(7)で遮
光し、必要な開孔(4)のみレーザ光を透過させ、対象
物(5)の表面に所望のマーキングを行うことができる
。FIG. 3 is a perspective view showing the structure of an embodiment of the present invention, in which the same reference numerals as in the conventional example of FIG. 1 indicate equivalent parts. (7) is a light shielding plate that blocks a part of the opening (4) of the mask (3a);
The number of openings that need to be shielded from light is the same as the number of openings. (8) is a linear movement mechanism provided for each light shielding plate (7) to take in and out the light shielding plate (7). The linear motion mechanism (8) is appropriately driven so that the mask (3a
) The holes (4) that are not needed for marking are blocked by the light shielding plate (7), and only the necessary holes (4) are allowed to pass through the laser beam, thereby making it possible to mark the desired surface of the object (5). can.
以上説明したように、この発明になるレーザ・マーキン
グ装置では、複数種のマークパターンの要素をすべて含
むパターンの開孔を有するマスクを用い、そのうちの1
つのマークパターンの刻印には当該マークパターンに不
必要な開孔を遮光板でふさいで用いるようにしたので、
準備すべきマスクの数を減少させることができ、マーク
パターンの変更の自動化も極めて容易である0As explained above, the laser marking device according to the present invention uses a mask having apertures with a pattern including all of the elements of multiple types of mark patterns, and one of them
When engraving one mark pattern, we used a light-shielding plate to cover unnecessary holes in the mark pattern.
The number of masks to be prepared can be reduced, and it is extremely easy to automate changing mark patterns.
第1図は従来のレーザ・マーキング装置の原理的構成を
示す斜視図、第2図はこの発明の一実施例の構成を示す
斜視図である。
図において、(1)はレーザ光発射口、(2)はレーザ
光、(3a)はマスク、(4)は開孔、(5)は対象物
、(6)はマーク、(7)は遮光板、(8)は遮光板駆
動用の直線運動装置である0
なお、図中同一符号は同一または相当部分を示す。
代理人大岩増雄FIG. 1 is a perspective view showing the basic structure of a conventional laser marking device, and FIG. 2 is a perspective view showing the structure of an embodiment of the present invention. In the figure, (1) is a laser beam emission aperture, (2) is a laser beam, (3a) is a mask, (4) is an opening, (5) is an object, (6) is a mark, and (7) is a light shield. The plate (8) is a linear motion device for driving the light-shielding plate.In addition, the same reference numerals in the drawings indicate the same or corresponding parts. Agent Masuo Oiwa
Claims (1)
て対象物に照射させ、上記対象物表面に上記開孔パター
ン対応したマークを刻印するものにおいて、1枚のマス
クに複数種のマークパターンの要素のすべてを含むパタ
ーンの開孔を形成したものを用い、上記開孔のすべてを
選択的に遮蔽できる遮光板によって所望のマークのパタ
ーンに不要の上記開孔を遮蔽して上記対象物の表面に上
記所望のマークを刻印できるようにしたことを特徴とす
るレーザーマーキング装置。(1) A laser beam is transmitted through an aperture formed in a mask and irradiated onto an object, and a mark corresponding to the aperture pattern is imprinted on the surface of the object, in which multiple types of marks are formed on one mask. Using a patterned aperture that includes all of the pattern elements, a light-shielding plate capable of selectively blocking all of the apertures is used to cover the apertures that are unnecessary for the desired mark pattern, and then the target object is A laser marking device characterized in that the desired mark can be engraved on the surface of the laser marking device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58151942A JPS6044194A (en) | 1983-08-20 | 1983-08-20 | Laser marking device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58151942A JPS6044194A (en) | 1983-08-20 | 1983-08-20 | Laser marking device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6044194A true JPS6044194A (en) | 1985-03-09 |
Family
ID=15529575
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58151942A Pending JPS6044194A (en) | 1983-08-20 | 1983-08-20 | Laser marking device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6044194A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6453278A (en) * | 1987-05-06 | 1989-03-01 | Estee Lauder Inc | System and method for encoding object |
US5491319A (en) * | 1994-12-19 | 1996-02-13 | International Business Machines Corporation | Laser ablation apparatus and method |
US7482552B2 (en) * | 2003-06-30 | 2009-01-27 | Lg Display Co., Ltd. | Laser crystallizing device and method for crystallizing silicon |
US8525075B2 (en) * | 2004-05-06 | 2013-09-03 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation apparatus |
US20150202716A1 (en) * | 2014-01-22 | 2015-07-23 | Siemens Energy, Inc. | Method for processing a part with an energy beam |
-
1983
- 1983-08-20 JP JP58151942A patent/JPS6044194A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6453278A (en) * | 1987-05-06 | 1989-03-01 | Estee Lauder Inc | System and method for encoding object |
US5491319A (en) * | 1994-12-19 | 1996-02-13 | International Business Machines Corporation | Laser ablation apparatus and method |
US7482552B2 (en) * | 2003-06-30 | 2009-01-27 | Lg Display Co., Ltd. | Laser crystallizing device and method for crystallizing silicon |
US8525075B2 (en) * | 2004-05-06 | 2013-09-03 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation apparatus |
US20150202716A1 (en) * | 2014-01-22 | 2015-07-23 | Siemens Energy, Inc. | Method for processing a part with an energy beam |
US9815139B2 (en) * | 2014-01-22 | 2017-11-14 | Siemens Energy, Inc. | Method for processing a part with an energy beam |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR960010026B1 (en) | Pattern exposing method using phase shift and mask used therefor | |
KR950009365A (en) | Exposure apparatus and exposure method | |
KR930006840A (en) | Photomask and Resistor Pattern Formation Method Using the Same | |
KR900007062A (en) | CHARGED PARTICLE BEAM EXPOSURE METHOD | |
KR940016868A (en) | Photolithographic apparatus of large die and method thereof | |
KR20060048815A (en) | Projection exposure apparatus and method for producing a printed circuit board | |
JPS6044194A (en) | Laser marking device | |
US5598250A (en) | Prefabricated modified illumination apparatus for forming fine patterns in a semiconductor device | |
DE2948646A1 (en) | AUTOMATIC WORKING DEVICE FOR ALIGNING A PHOTOMASK | |
KR920017180A (en) | Projection Exposure Method and Optical Mask for Projection Exposure | |
EP0215532A3 (en) | An electron emissive mask for an electron beam image projector, its manufacture, and the manufacture of a solid state device using such a mask | |
JPH0241423B2 (en) | ||
JPS5722240A (en) | Photomask for proximity exposure | |
JPH0322904Y2 (en) | ||
JPS6155106B2 (en) | ||
JPH0513303A (en) | Reduction projection aligner | |
JPH04178286A (en) | Laser beam marking device | |
JP2522810Y2 (en) | Exposure equipment for printed wiring boards | |
US6335125B2 (en) | Photomask and method of manufacturing same | |
JPS57132008A (en) | Measuring method for pattern size | |
DE365862C (en) | Process for the production of patterns similar to engraving | |
JPH07253652A (en) | Halftone phase shift mask | |
JP5709495B2 (en) | Exposure equipment | |
JPH05216207A (en) | Exposing mask | |
KR20050065159A (en) | Photomask |