JPS6041055U - Heat sink for semiconductor devices - Google Patents
Heat sink for semiconductor devicesInfo
- Publication number
- JPS6041055U JPS6041055U JP13537383U JP13537383U JPS6041055U JP S6041055 U JPS6041055 U JP S6041055U JP 13537383 U JP13537383 U JP 13537383U JP 13537383 U JP13537383 U JP 13537383U JP S6041055 U JPS6041055 U JP S6041055U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- main body
- semiconductor devices
- body member
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のヒートシンクの縦断面図、第２図は第１
図のヒートシンクと平形半導体素子を組み合わせた側面
図、第３図はこの考案の一実施例の縦断面図、第４図は
第３図の実施例の要部の温度分布を示す図、第５図はこ
の考案の他の実施例の縦断面図である。
図中、１０．２０はヒートシンク、１１．２１は本体部
材、１２．２２はフィン、ｌｌａ、２１ａは半導体素子
側の接触面である。なお、図中の同一符号は同一または
相当部分を示す。Figure 1 is a vertical cross-sectional view of a conventional heat sink, and Figure 2 is a vertical cross-sectional view of a conventional heat sink.
3 is a longitudinal sectional view of an embodiment of this invention; FIG. 4 is a diagram showing the temperature distribution of the main parts of the embodiment of FIG. 3; The figure is a longitudinal sectional view of another embodiment of this invention. In the figure, 10.20 is a heat sink, 11.21 is a main body member, 12.22 is a fin, and lla and 21a are contact surfaces on the semiconductor element side. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
材の外側周囲に軸方向に対し複数段のフィンが配設され
、放熱により前記半導体素子を冷却するヒートシンクに
おいて、前記本体部材の前記半導体素子の接触面側から
反対側に向けて前記本体部材の外径を連続的または段階
的に小さく形成したことを特徴とする半導体素子のヒー
トシンク。A heat sink in which a plurality of fins are disposed in the axial direction around the outside of a main body member that presses a semiconductor element against a contact surface formed at an end thereof, and cools the semiconductor element by heat radiation, the semiconductor element of the main body member 1. A heat sink for a semiconductor device, characterized in that the outer diameter of the main body member decreases continuously or stepwise from the contact surface side of the device toward the opposite side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13537383U JPS6041055U (en) | 1983-08-29 | 1983-08-29 | Heat sink for semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13537383U JPS6041055U (en) | 1983-08-29 | 1983-08-29 | Heat sink for semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6041055U true JPS6041055U (en) | 1985-03-23 |
Family
ID=30304725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13537383U Pending JPS6041055U (en) | 1983-08-29 | 1983-08-29 | Heat sink for semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6041055U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014045136A (en) * | 2012-08-28 | 2014-03-13 | Mitsubishi Electric Corp | Junction material between heating element and heat radiator |
| JP2015201427A (en) * | 2014-04-04 | 2015-11-12 | Ｈｏｙａ Ｃａｎｄｅｏ Ｏｐｔｒｏｎｉｃｓ株式会社 | light irradiation device |
-
1983
- 1983-08-29 JP JP13537383U patent/JPS6041055U/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014045136A (en) * | 2012-08-28 | 2014-03-13 | Mitsubishi Electric Corp | Junction material between heating element and heat radiator |
| JP2015201427A (en) * | 2014-04-04 | 2015-11-12 | Ｈｏｙａ Ｃａｎｄｅｏ Ｏｐｔｒｏｎｉｃｓ株式会社 | light irradiation device |
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