JPS6041053U - Icソケツト - Google Patents

Icソケツト

Info

Publication number
JPS6041053U
JPS6041053U JP13328883U JP13328883U JPS6041053U JP S6041053 U JPS6041053 U JP S6041053U JP 13328883 U JP13328883 U JP 13328883U JP 13328883 U JP13328883 U JP 13328883U JP S6041053 U JPS6041053 U JP S6041053U
Authority
JP
Japan
Prior art keywords
socket
semiconductor element
coefficient
holding
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13328883U
Other languages
English (en)
Other versions
JPH0432759Y2 (ja
Inventor
池浦 保
阿久津 利一
須磨 達美
敏弘 草谷
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP13328883U priority Critical patent/JPS6041053U/ja
Publication of JPS6041053U publication Critical patent/JPS6041053U/ja
Application granted granted Critical
Publication of JPH0432759Y2 publication Critical patent/JPH0432759Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Connecting Device With Holders (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第1図は半導体素子の実装を示すa図は斜視図、b図は
断面図、第2図はICソケットの外観を示すa図は斜視
図、b図は説明図、第3図は本考案によるICソケット
の熱膨張係数を示すグラフ、第4図は接触抵抗と温度サ
イクルの関係グラフを示す。 図中において、1は半導体素子、IAはリード端子、2
はICソケット、2Aは接触片、2B。 2Cは部材、3は基板、3Aはスルホールを示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子のリード端子が挿脱される複数の接触片と、
    該接触片を保持する部材とを備えたICソケットであっ
    て、前記部材の熱膨張係数はセラミック材とエポキシ樹
    脂材とのほぼ中間の値に形成されたことを特徴とするI
    Cソケット。
JP13328883U 1983-08-29 1983-08-29 Icソケツト Granted JPS6041053U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13328883U JPS6041053U (ja) 1983-08-29 1983-08-29 Icソケツト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13328883U JPS6041053U (ja) 1983-08-29 1983-08-29 Icソケツト

Publications (2)

Publication Number Publication Date
JPS6041053U true JPS6041053U (ja) 1985-03-23
JPH0432759Y2 JPH0432759Y2 (ja) 1992-08-06

Family

ID=30300721

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13328883U Granted JPS6041053U (ja) 1983-08-29 1983-08-29 Icソケツト

Country Status (1)

Country Link
JP (1) JPS6041053U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5677201U (ja) * 1979-11-20 1981-06-23
JPS63138004U (ja) * 1987-03-03 1988-09-12

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4727764U (ja) * 1971-04-16 1972-11-29

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4727764U (ja) * 1971-04-16 1972-11-29

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5677201U (ja) * 1979-11-20 1981-06-23
JPS6041053Y2 (ja) * 1979-11-20 1985-12-12 三菱農機株式会社 ロ−タリ耕耘装置の後部カバ−
JPS63138004U (ja) * 1987-03-03 1988-09-12
JPH0448651Y2 (ja) * 1987-03-03 1992-11-17

Also Published As

Publication number Publication date
JPH0432759Y2 (ja) 1992-08-06

Similar Documents

Publication Publication Date Title
JPS6041053U (ja) Icソケツト
JPS60118932U (ja) 端子付端子板
JPS6122359U (ja) 半導体装置
JPS61134039U (ja)
JPS5937747U (ja) 半導体装置
JPS60106375U (ja) 外部リ−ド端子の取付構造
JPS6114486U (ja) Icソケツト
JPS5822742U (ja) 半導体装置
JPS59192850U (ja) 半導体装置
JPS619849U (ja) 回路基板
JPS6083249U (ja) 集積回路部品
JPS5815349U (ja) 回路基板
JPS5869907U (ja) 複合部品
JPS587346U (ja) 半導体装置
JPS6142837U (ja) 半導体素子
JPS6033456U (ja) 半導体装置
JPS60130584U (ja) Icソケツト
JPS59107146U (ja) 絶縁型半導体素子
JPS58132838U (ja) 温度検出器
JPS5887339U (ja) 半導体装置
JPS6094836U (ja) 半導体装置
JPS60935U (ja) 高電力混成集積回路
JPS5881937U (ja) 半導体装置
JPS5814137U (ja) 半導体感圧装置
JPS60172367U (ja) 電気部品の取付け構造