JPS6037045U - double-sided adhesive tape - Google Patents

double-sided adhesive tape

Info

Publication number
JPS6037045U
JPS6037045U JP12734483U JP12734483U JPS6037045U JP S6037045 U JPS6037045 U JP S6037045U JP 12734483 U JP12734483 U JP 12734483U JP 12734483 U JP12734483 U JP 12734483U JP S6037045 U JPS6037045 U JP S6037045U
Authority
JP
Japan
Prior art keywords
double
sided adhesive
adhesive tape
adhesive
adhesive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12734483U
Other languages
Japanese (ja)
Inventor
中尾　正男
倉橋　由夫
Original Assignee
日本光ファイバ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本光ファイバ株式会社 filed Critical 日本光ファイバ株式会社
Priority to JP12734483U priority Critical patent/JPS6037045U/en
Publication of JPS6037045U publication Critical patent/JPS6037045U/en
Pending legal-status Critical Current

Links

Landscapes

  • Adhesive Tapes (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案による両面接着テープの一例を示す斜視
図、第２図はその■−■線断面図、第３図はその使用状
態を示す図、第４図及び第５図は夫々本考案による両面
接着テープの使用例を示す斜視図である。 符号の説明、１・・・両面接着テープ、２・・・セロフ
ァン基材、３・・・粘着層、４・・・接着層。Fig. 1 is a perspective view showing an example of the double-sided adhesive tape according to the present invention, Fig. 2 is a sectional view taken along the line ■-■, Fig. 3 is a view showing its usage state, and Figs. FIG. 2 is a perspective view showing an example of the use of the invented double-sided adhesive tape. Explanation of symbols: 1... Double-sided adhesive tape, 2... Cellophane base material, 3... Adhesive layer, 4... Adhesive layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] テープ状基材の片面に被着体に対して粘着する粘着層が
形成され、他面にゴムラテックス及び水溶性接着剤を０
．４８〜１．８０の範囲内の接着剤／ラテックス重量比
で均一に混合した水溶液が塗布及び乾燥されて成る接着
層が形成されたことを特徴とする両面接着テープ。An adhesive layer that adheres to the adherend is formed on one side of the tape-shaped base material, and rubber latex and water-soluble adhesive are coated on the other side.
．． A double-sided adhesive tape characterized in that an adhesive layer is formed by applying and drying an aqueous solution uniformly mixed with an adhesive/latex weight ratio in the range of 48 to 1.80.
JP12734483U 1983-08-19 1983-08-19 double-sided adhesive tape Pending JPS6037045U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12734483U JPS6037045U (en) 1983-08-19 1983-08-19 double-sided adhesive tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12734483U JPS6037045U (en) 1983-08-19 1983-08-19 double-sided adhesive tape

Publications (1)

Publication Number Publication Date
JPS6037045U true JPS6037045U (en) 1985-03-14

Family

ID=30289260

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12734483U Pending JPS6037045U (en) 1983-08-19 1983-08-19 double-sided adhesive tape

Country Status (1)

Country Link
JP (1) JPS6037045U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0324002U (en) * 1989-07-14 1991-03-13
JPH0535002U (en) * 1991-10-17 1993-05-14 有限会社和工芸 hair ornaments
JP2012009564A (en) * 2010-06-23 2012-01-12 Dowa Electronics Materials Co Ltd Thickness reduction processing method for wafer and method of manufacturing semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0324002U (en) * 1989-07-14 1991-03-13
JPH0535002U (en) * 1991-10-17 1993-05-14 有限会社和工芸 hair ornaments
JP2012009564A (en) * 2010-06-23 2012-01-12 Dowa Electronics Materials Co Ltd Thickness reduction processing method for wafer and method of manufacturing semiconductor device

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