JPS6033888A - Laser light type groove engraving device - Google Patents
Laser light type groove engraving deviceInfo
- Publication number
- JPS6033888A JPS6033888A JP58139380A JP13938083A JPS6033888A JP S6033888 A JPS6033888 A JP S6033888A JP 58139380 A JP58139380 A JP 58139380A JP 13938083 A JP13938083 A JP 13938083A JP S6033888 A JPS6033888 A JP S6033888A
- Authority
- JP
- Japan
- Prior art keywords
- groove
- laser light
- laser beam
- work
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
- B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
- B23K26/147—Features outside the nozzle for feeding the fluid stream towards the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、ブレーキディスク等の板状ワークの表面にそ
の端縁から内方にのびる溝をレーザー光によって刻設す
るレーザー光式の溝刻設装置に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a laser beam type groove carving device that uses a laser beam to carve grooves extending inward from the edges of a plate-shaped workpiece such as a brake disc on the surface thereof.
従来この種装置として１例えば第１図に示す如くワーク
Ｗ表面にその端縁側から溝形状に沿ってレーザー光ａｉ
走査させる導光器（１）と、レーザー光ａの走査方向後
方からワークＷ表面にガスｂ２吹き団けるガスノズル（
２）とを設け、レーザー光ａで溶融された部分をガスｂ
で吹き飛ばして溝ｗａ’！に刻設する孟うにしたものは
知られるが、この場合レーザー光ａの走査をワークＷの
端縁から開始する際、当初は第１図入水の如くガスｂが
ワークＷ表面に当たらず、レーザー光ａの照射点が内方
に少許ずれて第１図Ｂ示の如くガスｂがワークＷ表面に
当たる工うＫなったときは既に端縁の溶融部分が凝固し
て、この部分が吹き飛ばされずに残り、第１図Ｃ示の如
く溝ｗａを刻設した後、端縁に開口する溝ｗａ！ｉｉ−
備えた所定の製品ヲ帰るべくワークＷの端縁全図中Ｘで
示す位置まで切削除去する必要を生じ、生産性や素は少
滴りが悪化し、又レーザー光で溶融凝固した部分は硬度
が上昇するため刃物寿命も短くな９．コスト上昇の原因
となる不都合を伴う。Conventionally, this type of device has a laser beam ai which is applied to the surface of a workpiece W along the groove shape from the edge side as shown in FIG. 1, for example.
A light guide (1) for scanning, and a gas nozzle (
2) and the part melted by laser beam a is exposed to gas b.
Blow it away and groove wa'! In this case, when the scanning of the laser beam a starts from the edge of the workpiece W, the gas b does not hit the surface of the workpiece W as shown in Figure 1, as shown in Figure 1. When the irradiation point of light a is slightly shifted inward and gas b hits the surface of workpiece W as shown in Figure 1 B, the molten part at the edge has already solidified and this part is not blown away. After carving a groove wa as shown in FIG. 1C, a groove wa opened at the end edge is formed. ii-
In order to return the predetermined product, it becomes necessary to cut and remove the edge of the workpiece W up to the position indicated by 9. The life of the knife is shortened because of the rise. It is accompanied by inconveniences that cause cost increases.
尚、レーザー光を溝の内端側から走査するととは、走査
開始部分の溝形状や深さが不揃いになり、！！品の体裁
が悪くなるため無理である。Note that if the laser beam is scanned from the inner end of the groove, the shape and depth of the groove at the start of scanning will be uneven! ! This is not possible as it would make the product look unsightly.
本発明は、上記の不都合を解消すべく、ワーク表面にそ
の端縁側から正確に溝を刻設し出るようにした装置を提
供すること？その目的とするもので、板状ワークの表面
にての端縁から内方にのびる溝４レーザー光に、ｃ９刻
設するレーザー光式溝刻設装置であって、ワーク表面に
その端縁側から溝形状に沿ってレーザー光を走査させる
導光器と、レーザー光の走査方向後方からワーク表面に
ガスを吹き吋けるガスノズルとを備えるものにおいて、
レーザー光の走査を開始するワーク端縁にワーク表面に
対し溝深さ分の段差を存して当て金を当接配置したこと
を特徴とする。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides an apparatus that can accurately carve grooves on the surface of a workpiece from the edge thereof. This is a laser beam type groove engraving device that inscribes grooves 4 and 9 with laser beams extending inward from the edge on the surface of a plate-shaped workpiece, and the device In a device equipped with a light guide that scans the laser beam along the groove shape and a gas nozzle that can blow gas onto the work surface from the rear in the scanning direction of the laser beam,
It is characterized in that a stopper is disposed in contact with the edge of the workpiece where scanning of the laser beam begins, with a step equal to the depth of the groove relative to the workpiece surface.
次いで本発明を第２図以下に示す実施例に付説明する。Next, the present invention will be explained with reference to embodiments shown in FIG. 2 and below.
図面はブレーキディスクから成るワークＷにその外周端
縁からこれに予め形成し几内周のりフグ溝ｗｂに向って
のびる溝ｗａを刻設する装置に本発明を適用した実施例
を示し、（１）は導光器％（２）はガスノズルであり、
該導光器（１）と該ガスノズル（２）とをワークＷを載
置するインデックステーブル（３）の上方に配置した共
通の加工ヘラＰ（４）に組付け、該加工ヘッド（４）ヲ
ワークＷの外周端縁側から溝ｗａの形状に沿って内方に
酌進自在とし。The drawings show an embodiment in which the present invention is applied to an apparatus for carving a groove wa that is preformed on a workpiece W consisting of a brake disc from its outer peripheral edge and extends toward the inner circumferential groove wb. ) is the light guide% (2) is the gas nozzle,
The light guide (1) and the gas nozzle (2) are assembled to a common processing spatula P (4) placed above the index table (3) on which the workpiece W is placed, and the processing head (4) is placed on the workpiece. The cup can be freely advanced inward from the outer peripheral edge side of W along the shape of the groove wa.
その前進に工り該導光器（１）を介して照射するレーザ
ー光ａｆ該導光器（１）に内蔵する適宜の光軸振動機構
にエフ第３図にＣ線で示す如く溝巾方向に振動させつつ
溝ｗａの形状に沿ってワークＷの表面に走査させ、更に
該ガスノズル（２）からのガスｂｌレーザー光ａの走査
方向後方からワークＷの表面に吹きけけるＬうにした。The laser beam irradiated through the light guide (1) in the direction of the groove width as shown by line C in Fig. The surface of the workpiece W was scanned along the shape of the groove wa while being vibrated, and the gas bl laser beam a from the gas nozzle (2) was sprayed onto the surface of the workpiece W from the rear in the scanning direction.
ここで該ガスノズル（２）は、その軸線がワークＷの表
面の法線に対し７〜１５°程度後傾し、且つワークＷの
表面にレー−Ｊ’ −光ａの照射点の２〜３雪後方で交
わるように配置することが好ましく、又ガスｂは過度の
酸化反応を防止すべく酸素と空気とを１ ： １．５〜
２０割合で混合したものを用いる。Here, the axis of the gas nozzle (2) is inclined backward by about 7 to 15 degrees with respect to the normal to the surface of the workpiece W, and the gas nozzle (2) has an axis line that is tilted backward by about 7 to 15 degrees with respect to the normal to the surface of the workpiece W. It is preferable to arrange them so that they intersect behind the snow, and gas b has a ratio of oxygen and air of 1:1.5 to 1.5 to prevent excessive oxidation reaction.
A mixture of 20 parts is used.
ここで本発明によれば、レーザー光ａの走査を開始する
ワークＷの端縁に、ワークＷの表面に対し溝ｗａの深さ
分の段差を存して当て金１５） Ｔｈ 尚接装置するも
ので、図示のｄのでは該当て金（５）をインデックステ
ーブル（３）の外側のホルダ（６）に取付けて、該テー
ブル（３）の回動に工９ワークＷの外周端縁の溝ｗａｅ
刻設すべき部分ＨＩて金（５）に合致させるようにし、
更に該ホルダ（６）に冷媒通路（６ａ）ｆｔ形我して該
当て金（５）全冷却し、そのレーザー光ａによる加熱溶
融を防止し得るようにした。Here, according to the present invention, a step corresponding to the depth of the groove wa with respect to the surface of the workpiece W is provided at the edge of the workpiece W at which scanning of the laser beam a is started, and the contacting device 15) is provided. In the case of d shown in the figure, the gold (5) is attached to the holder (6) on the outside of the index table (3), and when the table (3) is rotated, the groove on the outer peripheral edge of the work W is used. wae
Make sure that the part to be engraved matches the gold (5),
Furthermore, a refrigerant passage (6a) ft-shaped was provided in the holder (6) to completely cool the gold (5) to prevent it from being heated and melted by the laser beam (a).
図面で＋７） ＃′ｉ溝ｗａの内端のリング溝Ｗ一部分
にレーザー光ａが照射されないようインデックステーブ
ル（３）上に設けたカバーリングを示す。In the drawing, +7) #'i shows a cover ring provided on the index table (3) so that a part of the ring groove W at the inner end of the groove wa is not irradiated with the laser beam a.
次いでその作動を説明するに、レーザー光ａはワークＷ
の外周端縁側の第３図にＡで示す位置からリング溝ｗｂ
［の仝図にＢで示す位置に亘って走査するもので、この
場合当て金（５）が無いとワークＷの端縁にレーザー光
ａが照射される走査開始位１ｉＡにおいてガスノズル（
２）からのガスｂはワークＷの外周を下方に逃げてしま
い、溶融部を吹き飛ばせなくなるが１本発明によればワ
ークＷの端縁にその表面に対し溝Ｗａの深さ分の段差を
存して当て金（５）が当接されるため、端縁外方に予め
溝を延長して形成したと同様の状態となり、ガスノズル
（２）からのガスｂＶｉ該当て金（５）上ではね返って
端縁の溶融部を前方に吹き飛ばし、端縁にもワークＷの
中間部におけると同様に溝ｗａが刻設される。この様に
本発明によるときは、ワークの端縁にその表面に対し溝
深さ分の段差を存して当て金を癲接配置するもので、端
縁から所定深さで溝を確來に創設出来、従来例の如くワ
ーク端１＃、ヲ後加工で除去する必要がなく、生産性及
び素材少滴りを向上してコストを低減出来る効果を有す
る。Next, to explain its operation, the laser beam a is directed to the workpiece W.
From the position indicated by A in FIG. 3 on the outer peripheral edge side of the ring groove wb
In this case, if there is no dowel (5), the gas nozzle (
2) The gas b from 2) escapes downward along the outer periphery of the workpiece W, making it impossible to blow away the molten part, but 1) According to the present invention, the edge of the workpiece W is provided with a step equal to the depth of the groove Wa from its surface. Since the metal plate (5) is in contact with the metal plate (5), the condition is the same as if a groove had been formed by extending the groove outward from the edge. It rebounds and blows the molten part on the edge forward, and a groove wa is carved on the edge as well as in the middle part of the workpiece W. As described above, according to the present invention, the pad is placed on the edge of the workpiece with a step corresponding to the depth of the groove from the surface of the workpiece, thereby ensuring that the groove is formed at a predetermined depth from the edge. This eliminates the need to remove the workpiece edge 1# in post-processing as in the conventional example, which has the effect of improving productivity and reducing material dripping and reducing costs.
ｉｉ図人、Ｂ、０は従来装置による加工工程１ を説明
する線図、第２図は木兄８Ａ装置の１例の裁断側面図、
第３図はその加工ヘッド？取外した状態の平面図である
。
（１）・・・導光器 （２）・・・ガスノズルａ・・・
レーｆ−光 ｂ・・・カス
Ｗ・・・ワーク ｗａ中・・溝
外２名ii Figures B and 0 are diagrams explaining processing step 1 using conventional equipment; Figure 2 is a cut side view of an example of the Kinoe 8A equipment;
Is the processing head in Figure 3? FIG. 3 is a plan view of the removed state. (1)...Light guide (2)...Gas nozzle a...
Ray f-light b...scrap W...work wa middle...2 people outside the groove
Claims (1)
ザー光に工り刻設するレーザー光式溝刻設装置であって
、ワーク表面にその端縁側から溝形状に沿ってレーザー
光を走査させる導光器と、レーザー光の走査方向後方か
らワーク表面にガスを吹き付けるガスノズルとを備える
ものＶＣおいて、レーザー光の走査？開始するワーク端
縁にワーク表面に対し溝深さ分の段差を存して当て金を
当接配置したことを特徴とするレーザー光式溝刻設装置
。This is a laser beam groove engraving device that uses a laser beam to carve a groove extending inward from the edge of a plate-shaped workpiece surface using a laser beam. In a VC that includes a light guide for scanning and a gas nozzle that sprays gas onto the workpiece surface from behind in the scanning direction of the laser beam, scanning of the laser beam? A laser beam groove engraving device characterized in that a stopper is placed in contact with the starting edge of the workpiece with a step equal to the depth of the groove relative to the workpiece surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58139380A JPS6033888A (en) | 1983-08-01 | 1983-08-01 | Laser light type groove engraving device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58139380A JPS6033888A (en) | 1983-08-01 | 1983-08-01 | Laser light type groove engraving device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6033888A true JPS6033888A (en) | 1985-02-21 |
Family
ID=15243968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58139380A Pending JPS6033888A (en) | 1983-08-01 | 1983-08-01 | Laser light type groove engraving device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6033888A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5662762A (en) * | 1995-07-07 | 1997-09-02 | Clover Industries, Inc. | Laser-based system and method for stripping coatings from substrates |
| JP2015066581A (en) * | 2013-09-30 | 2015-04-13 | 日本電気株式会社 | Laser processing apparatus and laser processing method |
-
1983
- 1983-08-01 JP JP58139380A patent/JPS6033888A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5662762A (en) * | 1995-07-07 | 1997-09-02 | Clover Industries, Inc. | Laser-based system and method for stripping coatings from substrates |
| JP2015066581A (en) * | 2013-09-30 | 2015-04-13 | 日本電気株式会社 | Laser processing apparatus and laser processing method |
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