JPS6029650A - Multi-function sensor - Google Patents
Multi-function sensorInfo
- Publication number
- JPS6029650A JPS6029650A JP13583683A JP13583683A JPS6029650A JP S6029650 A JPS6029650 A JP S6029650A JP 13583683 A JP13583683 A JP 13583683A JP 13583683 A JP13583683 A JP 13583683A JP S6029650 A JPS6029650 A JP S6029650A
- Authority
- JP
- Japan
- Prior art keywords
- sensor
- insulating substrate
- thick film
- sensors
- heater
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 238000010438 heat treatment Methods 0.000 claims description 14
- 238000001514 detection method Methods 0.000 claims description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract description 9
- 230000002093 peripheral effect Effects 0.000 abstract description 7
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 abstract description 6
- 230000005855 radiation Effects 0.000 abstract description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 2
- 239000004020 conductor Substances 0.000 abstract description 2
- 229910052697 platinum Inorganic materials 0.000 abstract description 2
- 239000011540 sensing material Substances 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 4
- 238000009413 insulation Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/0004—Gaseous mixtures, e.g. polluted air
- G01N33/0009—General constructional details of gas analysers, e.g. portable test equipment
- G01N33/0027—General constructional details of gas analysers, e.g. portable test equipment concerning the detector
- G01N33/0031—General constructional details of gas analysers, e.g. portable test equipment concerning the detector comprising two or more sensors, e.g. a sensor array
- G01N33/0032—General constructional details of gas analysers, e.g. portable test equipment concerning the detector comprising two or more sensors, e.g. a sensor array using two or more different physical functioning modes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01W—METEOROLOGY
- G01W1/00—Meteorology
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Food Science & Technology (AREA)
- General Physics & Mathematics (AREA)
- Medicinal Chemistry (AREA)
- Pathology (AREA)
- Combustion & Propulsion (AREA)
- Atmospheric Sciences (AREA)
- Biodiversity & Conservation Biology (AREA)
- Ecology (AREA)
- Environmental Sciences (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は、快適な居住性を向上するために、温度や湿度
などの雰囲気を検出するセンサに係り、特に２以上の雰
囲気を検出可能な多機能センサに関する。Detailed Description of the Invention [Field of Application of the Invention] The present invention relates to a sensor that detects atmospheres such as temperature and humidity in order to improve living comfort, and particularly relates to a sensor that can detect two or more atmospheres. Regarding functional sensors.
・〔発明の背景〕
居住空間等における温度や湿度或は壁面からの放射温等
を検出して快適な居住性を得るために、現在多機能セン
サの開発が進められている。- [Background of the Invention] Multifunctional sensors are currently being developed in order to obtain comfortable living by detecting the temperature and humidity in living spaces, the radiation temperature from walls, etc.
一方において、快適分居住性の追求に伴なって、上記温
度や湿度に加えて、安全性の向上に対する動きがあシ、
多機能センサの開発がますます要求されるようになって
きている。On the other hand, with the pursuit of comfortable living conditions, there has been a movement toward improving safety in addition to the above-mentioned temperature and humidity.
There is an increasing demand for the development of multifunctional sensors.
例えば、居住性に加えて、都市ガスやＬＰＧガス等のガ
ス漏れ警報とか、各種防犯警報器などの安全性に対する
動きが高まυつつある。For example, in addition to livability, there is a growing movement toward safety, such as gas leak alarms such as city gas and LPG gas, and various security alarms.
これらのうち、例えば雰囲気中の湿度を検出するだめの
湿度センサとか、或は、ガス漏れを検出するだめのガス
センサには、加熱機構が必要である。Among these, for example, a humidity sensor that detects the humidity in the atmosphere or a gas sensor that detects gas leakage requires a heating mechanism.
即チ湿度センサについて説明すると、湿度センサは、金
属酸化物を主原料として作られ、この金属酸化物半導体
の電気抵抗値の変化を利用して、相対温度を検出するよ
うになっている。To explain the humidity sensor first, the humidity sensor is made using a metal oxide as a main raw material, and detects relative temperature by utilizing changes in the electrical resistance value of this metal oxide semiconductor.
この湿度センサは、雰囲気中に直接露呈して使用される
。そのため雰囲気中の塵埃がセンサ素子の表面に付着し
、検出精度、検出感度に誤差を生じさせ、誤報等の悪影
響をもたらすことになる。This humidity sensor is used by being directly exposed to the atmosphere. Therefore, dust in the atmosphere adheres to the surface of the sensor element, causing errors in detection accuracy and detection sensitivity, resulting in negative effects such as false alarms.
この悪影響を解消するだめに、この種のセンサには、加
熱ヒータを一体成形し、付着した塵埃を焼き切り除去す
る。いわゆる加熱クリーニング法が採用される。In order to eliminate this adverse effect, a heater is integrally molded into this type of sensor, and the attached dust is burned off and removed. A so-called heating cleaning method is employed.
又ガスセンサにあっては、検知感度の向上を計るために
、加熱ヒータが一体成形され、ガスセンサを常に昇温状
態に保持するようにしている。Furthermore, in order to improve detection sensitivity, a heater is integrally molded in the gas sensor, and the gas sensor is always maintained at an elevated temperature.
これら加熱を必要とするセンサにあっては、加熱ヒータ
への供給電力の低減及び熱効率向上の観点から、断熱性
を考慮した実装が必要となる。These sensors that require heating need to be mounted with insulation in mind from the viewpoint of reducing power supplied to the heater and improving thermal efficiency.
発明者等は、この断熱実装を具現化するために、第１図
に示すような断熱実装の仕方を案出した。In order to realize this heat-insulating mounting, the inventors devised a method of heat-insulating mounting as shown in FIG.
図において、絶縁基板２に加熱用ヒータ３を一体成形し
たセンサ１を、Ｐｔ等の細いリード線４を用いて、ステ
ム５に立設したピン６に宙吊シ状にして断熱実装した。In the figure, a sensor 1 in which a heater 3 is integrally molded on an insulating substrate 2 is suspended and heat-insulated mounted on a pin 6 erected on a stem 5 using a thin lead wire 4 made of Pt or the like.
然しなから、この断熱実装を応用して、多機能センサの
基板上に実°装した場合、第２図に示すように、加熱を
必要とするセンサ７と加熱を必吸としない各種センサ８
．８−８＃及び熱を嫌う各種回路構成部９とを熱的に隔
絶し且つ加熱を必要とするセンサ７を断熱実装するため
にステム１０が必要となる。However, when this adiabatic mounting is applied and mounted on a multifunctional sensor board, as shown in Fig. 2, the sensor 7 that requires heating and the various sensors 8 that do not require heating will be separated.
．． The stem 10 is necessary to thermally isolate the sensor 8-8# and various circuit components 9 that dislike heat, and to heat-insulate the sensor 7 that requires heating.
そのため、湿度センサやガスセンサ等の加熱を必要とす
るセンサを多数実装する場合、これら各センサに対して
ステムが必要となり・犬きｌなスペースを必要とし、捷
すます多機能化の傾向にある実情を満足できないという
欠点がある。Therefore, when installing a large number of sensors that require heating, such as humidity sensors and gas sensors, a stem is required for each sensor, which requires a large amount of space, and there is a tendency for devices to become more multifunctional. The drawback is that it cannot satisfy the actual situation.
又センサ部と絶縁基板との接続に耐震性を考慮する必要
があることから、必然的に接続端子を大きくせねばなら
ず、特に多数のセンサを実ｌ装した場合、接続部端子か
ら放熱されるば耐熱量が大となって、その分加熱に要す
る電力が増加するという欠点がある。Furthermore, since it is necessary to take earthquake resistance into consideration when connecting the sensor section and the insulating substrate, the connection terminals must necessarily be made larger, and especially when a large number of sensors are mounted, heat is dissipated from the connection terminals. The disadvantage is that the heat resistance increases, and the power required for heating increases accordingly.
このように断熱実装するためのスペースの問題及び加熱
用電力の問題から、多機能センサの２゜実用化が困難で
あり、小型化、耐震実装、断熱実装及び省電力化を満足
した多機能センサの開発が要求されているのが実情であ
る。As described above, it is difficult to put a multi-functional sensor into practical use due to the problem of space for heat-insulating mounting and power for heating. The reality is that the development of
本発明は、上記実情に鑑みなされたものであり、小型化
、耐震性、断熱性及び省電力化を満足した多機能センサ
を提供せんとするものである。The present invention has been made in view of the above circumstances, and aims to provide a multifunctional sensor that satisfies the requirements of miniaturization, earthquake resistance, heat insulation, and power saving.
即ち本発明は、従来のようにステムを用いることなく、
加熱機構を有するセンサを他のセンサ及び周辺回路と共
に、絶縁性基板に一体的に形成したものであり、絶縁性
基板に開口部を設け、この開口部内に加熱機構を有する
センサを断熱実装すると共に、上記開口部以外の絶縁性
基板上に他のセンサな実装し、これら複数のセンサを駆
動するだめの電源回路、センサ出力を検出する検出回路
、各センサからの出力を演算する演算回路等の周辺回路
を同じ絶縁性基板に一体化形成したものである。That is, the present invention does not use a stem as in the past,
A sensor with a heating mechanism is integrally formed with other sensors and peripheral circuits on an insulating substrate, and an opening is provided in the insulating substrate, and the sensor with a heating mechanism is mounted inside the opening in adiabatic manner. , other sensors are mounted on the insulating substrate other than the above opening, and a power supply circuit for driving these multiple sensors, a detection circuit for detecting the sensor output, an arithmetic circuit for calculating the output from each sensor, etc. Peripheral circuits are integrally formed on the same insulating substrate.
以下本発明の一実施例について詳細に説明する。第３図
は、厚膜湿度センサ１１、温度センサ１３、放射温セン
サ１４．１４’の各種センサを備えだ多機能七けである
。１５は、周辺回路である。An embodiment of the present invention will be described in detail below. FIG. 3 shows a multifunctional seven-piece device equipped with various sensors such as a thick film humidity sensor 11, a temperature sensor 13, and a radiation temperature sensor 14, 14'. 15 is a peripheral circuit.
絶縁性基板１６には、開口部１２が設けられ、仁の開口
部１２内に、上記厚膜湿度センサ１１が断熱実装されて
いる。The insulating substrate 16 is provided with an opening 12, and the thick film humidity sensor 11 is mounted in adiabatic manner within the opening 12.
このようにして各種センサ１１．１３．１４．１４ ’
及び周辺回路１５が、絶縁性基板１６に一体形成されて
いる。In this way, various sensors 11.13.14.14'
and a peripheral circuit 15 are integrally formed on an insulating substrate 16.
第４図は、上記厚膜湿度センサ１１の断熱実装を更に詳
しく示しだものである。FIG. 4 shows the adiabatic mounting of the thick film humidity sensor 11 in more detail.
図において、厚膜湿度センサ１１の裏面には、加熱用ヒ
ータ２０が一体成形されている。この厚膜湿度センサ１
１は、開口部１２にｐｔテープのリード腕２２によって
宙吊りの状態で断熱実装されている。In the figure, a heater 20 is integrally molded on the back surface of the thick film humidity sensor 11. This thick film humidity sensor 1
1 is mounted in an adiabatic manner in the opening 12 in a suspended state by a lead arm 22 of PT tape.
と肚を更に詳しく説明する。先ず厚膜ＩＭ度七セン１１
の構造について説明する。I will explain in more detail. First, thick film IM degree 7sen 11
We will explain the structure of
第４図において、アルミナ等よ構成る絶縁基板１９の上
面に、白金等の導電材料を主成分とする厚膜層で下部電
極２４を形成する。この下部電極２４の上面に、センシ
ング材料層によってセンサ部２５を形成し、更にこのセ
ンサ部２５の上面−に、下部電極２４と同称の上部電極
２６を形成する。又絶縁基板１９の裏面には、センサ部
２５訃加熱するだめの加熱用ヒータ２０を形成する。In FIG. 4, a lower electrode 24 is formed on the upper surface of an insulating substrate 19 made of alumina or the like using a thick film layer mainly composed of a conductive material such as platinum. A sensor section 25 is formed using a sensing material layer on the upper surface of this lower electrode 24, and an upper electrode 26 having the same name as the lower electrode 24 is further formed on the upper surface of this sensor section 25. Further, a heater 20 for heating the sensor section 25 is formed on the back surface of the insulating substrate 19.
厚膜湿にセンサ１１は、このようにセンサ部２５の両面
に設けた上下電極２６．２４と、絶縁基板１９の裏面に
設けた加熱用ヒータ２０によって構成されている。The thick film moisture sensor 11 is constructed of the upper and lower electrodes 26 and 24 provided on both sides of the sensor section 25 and the heater 20 provided on the back surface of the insulating substrate 19.
このように構成した厚膜湿度センサ１１を、開口部１２
内に位置させ、上下電極２６２４と、加熱ヒータ２０の
端子２７．２８を、ｐｔを主成分としたリード線２２に
て、溶接し、厚膜湿度センサ１１を開口部１２に宙吊り
状に実装した。The thick film humidity sensor 11 configured as described above is inserted into the opening 12.
The upper and lower electrodes 2624 and the terminals 27 and 28 of the heater 20 were welded with lead wires 22 mainly composed of PT, and the thick film humidity sensor 11 was mounted in the opening 12 in a suspended manner. .
以上のように構成した本実施例において、第４図を用い
厚膜湿度センサ１１の耐震性と析離について説明する
先ず耐震性について説明すると、厚膜湿度センサ１１は
、絶縁性基板１６に設けた開口部１２に、リード線２２
によって４ケ所を固定し宙吊りにされている。そこで厚
膜湿度セ／す１１のＸ方向の震動は、リード線２２の引
帳りと圧縮力によって拘束され、又Ｙ方向の震動は、リ
ード線２２の剛性力によって拘束される。In this embodiment configured as above, the seismic resistance and separation of the thick film humidity sensor 11 will be explained using FIG. 4. First, the seismic resistance will be explained. Insert the lead wire 22 into the opening 12.
It is suspended in the air by fixing it in four places. Therefore, the vibration of the thick film humidity cell 11 in the X direction is restrained by the tension and compressive force of the lead wire 22, and the vibration in the Y direction is restrained by the rigid force of the lead wire 22.
父上下方向の震動に対しては、リード線２２の引力と剛
性力によって緩ａされる。Vibration in the vertical direction is dampened by the attractive force and rigidity of the lead wire 22.
一方断熱性については、宙吊り状態になっているので、
従来と同称に厚膜湿度センサ１１を囲む空気層によって
放散される熱は遮断され、又リード線２２が溶接接きし
ている絶縁性基板１６の端子の、熱容量が小さいので、
リード線２２を伝導して逃げる熱は少ない。On the other hand, regarding insulation, since it is suspended in the air,
As in the conventional case, the heat dissipated by the air layer surrounding the thick film humidity sensor 11 is blocked, and the heat capacity of the terminal of the insulating substrate 16 to which the lead wire 22 is welded is small.
Less heat is conducted through the lead wire 22 and escapes.
次に多機能化について説明する。加熱機構を必要とする
センサ、例えば、湿度センサとガスセンサとを並設する
場合、開口部１２の大きさを２つのセンサが収容できる
大きさにし、並設することができる。Next, multifunctionalization will be explained. When sensors that require a heating mechanism, such as a humidity sensor and a gas sensor, are installed side by side, the size of the opening 12 can be made large enough to accommodate the two sensors, and the sensors can be installed side by side.
又配置の関係上、絶縁性基板１６の任意の個所に開口部
１２を設け、加熱用ヒータを必要とするセンサを配設す
ることができる・
上記説明においては、厚膜湿菱センサ、温度センサ、放
射温センサを塔載した多機能センサについて説明したが
、これ以外に、ガスセンサとか風速センサ等を塔載して
もよいことは勿論である。Also, due to the arrangement, the opening 12 can be provided at any location on the insulating substrate 16 to accommodate a sensor that requires a heater. Although a multifunctional sensor including a radiation temperature sensor has been described, it is of course possible to include a gas sensor, a wind speed sensor, etc. in addition to this.
以上詳述した通り、本発明の多機能センサによれば、絶
縁性基板に開口部を設け、この開口部に加熱ヒータを必
要とするセンサを設けたので、耐震性を向上すると共に
省電力化が可能になった・
又加熱ヒータを必要としないセンサと周辺回路とを絶縁
性基板上に一体成形し、この絶縁性基板に開口部を設け
、この開口部に加熱ヒータを必要とするセンサを組込む
ようにしたので、絶縁性基板の斌題か可能であることは
勿論のこｌ−１−Ａ【］ 立Ｉ＋ ヘア１”１ ’ｌｌ
ｎ ｍ、ｋ Ｊ ？ ＋ｆ人遍な μ −−ム −←・
ノ廿の組込みが容易となって量産性を向上させ、従って
低価格となり、間島価値を大巾に向上することができた
。As detailed above, according to the multifunctional sensor of the present invention, an opening is provided in the insulating substrate, and a sensor that requires a heater is provided in this opening, which improves earthquake resistance and saves power. In addition, a sensor that does not require a heater and a peripheral circuit are integrally molded on an insulating substrate, an opening is provided in this insulating substrate, and a sensor that requires a heater is placed in this opening. Since I built it in, it is of course possible to use an insulating substrate.
n m, k J? +f Uneven μ −−mu −←・
This made it easier to incorporate the material, improving mass production, resulting in a lower price, and greatly increasing the value of the product.
更に重要なことは、加熱ヒータを必要とするセンサの組
込みスペースが小さくなって、多数のセンサの塔載が可
能となり、快適な居住性追求に対応した多機能センサの
実用化ができるなど、優れた効果を肩する。More importantly, the installation space for sensors that require heaters is reduced, making it possible to mount a large number of sensors, and making it possible to put into practical use multifunctional sensors that support the pursuit of comfortable living. shoulder the effect of
第１図は従来の加熱ヒータを必要とするセンサの断熱実
装を示す斜視図、第２図は、従来の多機能センサの斜視
図である。第６図は本発明の一実施例であり、多機能セ
ンサの斜視図、第４図は、第３図における加熱ヒータを
必要とするセンサの断熱実装を示す斜視図である・１１
・・・・・・加熱ヒータを必要とするセンサ１２・・・
・・・開口部
１３、１４．１４ ’・・・・・・センサ１５・・・・
・・周辺回路
１６・・・・・・絶縁性基板
２０・・・・・・加熱ヒータ
２２・・・・・・リード線
第 ５月
子４−口
２FIG. 1 is a perspective view showing a conventional adiabatic mounting of a sensor requiring a heater, and FIG. 2 is a perspective view of a conventional multifunctional sensor. FIG. 6 is a perspective view of a multifunctional sensor according to an embodiment of the present invention, and FIG. 4 is a perspective view showing an adiabatic mounting of the sensor that requires a heater in FIG. 3.
...Sensor 12 that requires a heater...
...Openings 13, 14.14'...Sensor 15...
... Peripheral circuit 16 ... Insulating board 20 ... Heater 22 ... Lead wire No. 4-port 2
Claims (1)
えたセンサを断熱実装すると共に上記開口部以外の絶縁
性基板上に他のセンサを実装し、これら複数のセンサを
駆動するだめの電源回路、センサ出力を検出する検出回
路、各センサからの出力を演算する演算回路を同じ絶縁
性基板に一体化形成したことを特徴とする多機能センサ
。An opening is provided in an insulating substrate, a sensor equipped with a heating mechanism is mounted inside the opening, and other sensors are mounted on the insulating substrate other than the opening, and a device for driving the plurality of sensors is provided. A multifunctional sensor characterized in that a power supply circuit, a detection circuit that detects sensor output, and an arithmetic circuit that calculates the output from each sensor are integrated on the same insulating substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13583683A JPS6029650A (en) | 1983-07-27 | 1983-07-27 | Multi-function sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13583683A JPS6029650A (en) | 1983-07-27 | 1983-07-27 | Multi-function sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6029650A true JPS6029650A (en) | 1985-02-15 |
Family
ID=15160899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13583683A Pending JPS6029650A (en) | 1983-07-27 | 1983-07-27 | Multi-function sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6029650A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0512694A2 (en) * | 1991-04-11 | 1992-11-11 | De Beers Industrial Diamond Division (Proprietary) Limited | Sensing device for temperatures |
| KR100329807B1 (en) * | 1999-08-10 | 2002-03-25 | 박호군 | Electrode structure of the semiconducting type gas sensor |
| WO2010013727A1 (en) * | 2008-07-31 | 2010-02-04 | シチズンファインテックミヨタ株式会社 | Gas sensor |
-
1983
- 1983-07-27 JP JP13583683A patent/JPS6029650A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0512694A2 (en) * | 1991-04-11 | 1992-11-11 | De Beers Industrial Diamond Division (Proprietary) Limited | Sensing device for temperatures |
| KR100329807B1 (en) * | 1999-08-10 | 2002-03-25 | 박호군 | Electrode structure of the semiconducting type gas sensor |
| WO2010013727A1 (en) * | 2008-07-31 | 2010-02-04 | シチズンファインテックミヨタ株式会社 | Gas sensor |
| JP2010038575A (en) * | 2008-07-31 | 2010-02-18 | Citizen Finetech Miyota Co Ltd | Gas sensor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7228725B2 (en) | Thin film gas sensor configuration | |
| CN206362480U (en) | A kind of integrating device and encapsulating structure of pressure sensor and gas sensor | |
| KR970002295A (en) | Gas sensor | |
| CN101031795B (en) | Method and apparatus for thermal isolation of a gas sensor | |
| JPS6029650A (en) | Multi-function sensor | |
| JPS58103654A (en) | Multifunctional gas sensor | |
| JP2007322355A (en) | Gas sensor and gas detection system | |
| US6571623B1 (en) | Measuring instrument with rectangular flow channel and sensors for measuring the mass of a flowing medium | |
| JPS61275648A (en) | Micro gas sensor | |
| EP2806266B1 (en) | Single element pellistor insensitive to internal and external interferences | |
| JPH0613467Y2 (en) | Temperature sensor | |
| JPH0750705Y2 (en) | Gas sensor | |
| JP2000003734A5 (en) | ||
| CN218066630U (en) | Membrane structure for flow detection and thermal flow sensor | |
| JPH0774763B2 (en) | Temperature detector | |
| JPH0143822Y2 (en) | ||
| JPH04109157A (en) | Gas detecting element | |
| JP4507438B2 (en) | Gas detection method using a gas sensor | |
| JPH0747708Y2 (en) | Indoor detector | |
| JPS5914771Y2 (en) | wind monitoring device | |
| JPH0642209Y2 (en) | Flow sensor | |
| JPH0415553A (en) | Local heating type thin-film gas sensor | |
| CN2051351U (en) | High stabilization semi-conductor hydrogen sensitive transducer | |
| JPS6056244U (en) | semiconductor pressure sensor | |
| JPH04116464A (en) | Fluid velocity sensor |