JPS6027162B2 - Manufacturing method of high voltage resistor - Google Patents
Manufacturing method of high voltage resistorInfo
- Publication number
- JPS6027162B2 JPS6027162B2 JP56004496A JP449681A JPS6027162B2 JP S6027162 B2 JPS6027162 B2 JP S6027162B2 JP 56004496 A JP56004496 A JP 56004496A JP 449681 A JP449681 A JP 449681A JP S6027162 B2 JPS6027162 B2 JP S6027162B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- resistor
- cover
- high voltage
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Description
【発明の詳細な説明】 本発明は高圧抵抗器の製造方法に関する。[Detailed description of the invention] The present invention relates to a method of manufacturing a high voltage resistor.
第１図は従来のこの種抵抗器としてのＣＲＴ用フオーカ
ス可変抵抗器を示し、１は抵抗基板、２は該基板を収納
せる樹脂製カバー、３は該カバー内に抵抗基板１を封止
するェポキシ等の注型用樹脂である。FIG. 1 shows a focus variable resistor for a CRT as a conventional resistor of this kind, where 1 is a resistor board, 2 is a resin cover for housing the board, and 3 is a resistor board 1 sealed within the cover. Casting resin such as epoxy.
抵抗基板１の表面には第２図に示す如く馬蹄形抵抗体４
と、該抵抗体の中心に位置する中心導体５と、基板１表
面より裏面に貫通椿設された端子ピン６ａ，６ｂ，６ｃ
の夫々と抵抗体４又は中心導体５とに連なる接続導体７
ａ，７ｂ，７ｃとが各々印刷形成されている。８はカバ
ー２のほゞ中央に突出成形された軸受筒部２ａ内に回転
自在に挿入された回転軸で、その下端のつば部８ａ下面
に固設されたバネ性を有する摺動導体９が基板１上の抵
抗体４と中心導体５とを橋絡し、回転軸８の回転時「中
心導体５を中心として、摺動導体９が抵抗体４上を摺動
移動することにより端子ピン６ｃと他の端子ピン６ａ又
は６ｂとの間の抵抗値を変化させる。A horseshoe-shaped resistor 4 is provided on the surface of the resistor board 1 as shown in FIG.
, a center conductor 5 located at the center of the resistor, and terminal pins 6a, 6b, 6c provided through the substrate 1 from the front surface to the back surface.
A connecting conductor 7 connected to each of the resistor 4 or the center conductor 5
a, 7b, and 7c are formed by printing, respectively. Reference numeral 8 denotes a rotary shaft rotatably inserted into a bearing cylinder portion 2a formed protruding from the center of the cover 2, and a sliding conductor 9 having spring properties is fixed to the lower surface of the collar portion 8a at the lower end of the rotary shaft. The resistor 4 on the substrate 1 and the center conductor 5 are bridged, and when the rotating shaft 8 is rotated, the sliding conductor 9 slides on the resistor 4 with the center conductor 5 as the center, so that the terminal pin 6c and the other terminal pin 6a or 6b.
フオーカス抵抗器では１万Ｖもの高圧が加わるので、絶
縁度を高めるため上記注型用樹脂３で封止がなされるの
であるが、斯る樹脂の洋型時、溶融状態の樹脂３が基板
１の周縁ｌａとカバー２との間隙から基板１表面へと入
り込んで抵抗体４にかぶさるのを防ぐべく抵抗体４の周
囲を囲む０リング１０が配置されている。Since a high voltage of 10,000 V is applied to the focus resistor, it is sealed with the above-mentioned casting resin 3 in order to increase the degree of insulation. An O-ring 10 is arranged around the resistor 4 to prevent it from entering the surface of the substrate 1 through the gap between the peripheral edge la and the cover 2 and covering the resistor 4.
即ち０リング１０‘まゴム等の弾性体からなり、基板１
表面とカバー２内面との間に密着するのである。尚１１
ａ，１１ｂ‘ま基板裏面に一体楯設されたピンカバーで
、絶縁性の筒体からなり端子ピンを間隙をおいて包囲し
ている。さて、上記フオーカス抵抗器にあっては、０リ
ング１０を使用しているため、該リングの配置作業が煩
しく生産能率が悪い。That is, the O-ring 10' is made of an elastic body such as rubber, and the substrate 1
There is a close contact between the surface and the inner surface of the cover 2. Sho 11
The pin covers a and 11b' are integrally provided on the back surface of the board, and are made of an insulating cylinder and surround the terminal pins with a gap therebetween. Now, in the above-mentioned focus resistor, since the O-ring 10 is used, the work of arranging the ring is troublesome and production efficiency is low.
又、基板１上に抵抗体４が複数個設けられ、回転軸８も
それに応じて複数ある様な穣柚抵抗器になると、０リン
グの使用個数が増えて作業能率が増々悪くなり、あるい
は全抵抗体を１個の０リングで包囲しようとするとく斯
るリングの径が大きくなることから、リング登のバラツ
キが大となり、ひいては各抵抗体に対する摺動導体のバ
ネ圧にもバラッキが生じる等の問題が発生する。一方、
上記０リングーを使わずに、第３図に示す如く、カバー
２内に段部１２を設け、斯る段部に基板１の周緑を当接
し、その間を熱硬化性接着剤で接着密封し、然る後、樹
脂３の注型を行なう方法も知られている。In addition, if the resistor is equipped with a plurality of resistors 4 on the substrate 1 and a plurality of rotating shafts 8, the number of O-rings used will increase, resulting in a further decline in work efficiency or overall When trying to surround a resistor with one O-ring, the diameter of such a ring becomes large, which increases the variation in ring height, which in turn causes variation in the spring pressure of the sliding conductor with respect to each resistor, etc. problem occurs. on the other hand,
Instead of using the above O-ring, as shown in Fig. 3, a stepped portion 12 is provided inside the cover 2, the peripheral green of the substrate 1 is brought into contact with the stepped portion, and the gap is adhesively sealed with a thermosetting adhesive. A method is also known in which the resin 3 is then cast.
尚「第２図にて第１図と同一部分には同一番号が付され
ている。然るに、熱硬性接着剤は硬化時間が長く「それ
が完全に硬化するまで次の樹脂３の注型作業ができない
ので作業時間が長くなる欠点がある。``In Figure 2, the same parts as in Figure 1 are given the same numbers. However, thermosetting adhesives take a long time to harden, and ``until the adhesive is completely cured, the next resin 3 casting operation is required.'' This has the disadvantage that the work time is longer because it is not possible to do so.
本発明は上記の点に鑑みてなされたもので「第４図の２
軸抵抗器の実施例に示す如く「抵抗基板１をカバー２内
に収納した後、基板周縁ｌａとカバー２との間隙を紫外
線硬化樹脂１３で密封することを特徴とするものである
。尚ト第４図にて、第３図と同一部分には同一番号が付
されている。本実施例では、紫外線硬化樹脂１３として
はソマール工業株式会社製ＴＳ−１１０が使用されたが
「その粘度は１万ＣＰＳ程度でチクソ性の高いものが好
ましい。紫外線硬化樹脂１３はノズルより在世して塗布
され、その後紫外線ランプ（例えば高圧水銀灯）照射に
より５〜１岬砂で硬化する。斯る硬化時間は、第３図に
関して述べた、熱硬化性樹脂の硬化時間に比べて著しく
短い。紫外線硬化樹脂１３が硬化するまで基板１とカバ
ー２とは適当な治具で保持されており、硬化完了後、洋
型用樹脂３による封止がなされるのである。尚「斯る洋
型用樹脂３は熱硬化性であり、又上記紫外線硬化樹脂軍
３も熱硬化性を呈するので、基板亀表面とカバー２内面
との間に入り込んだ為に紫外線によって硬化されなかっ
た若干量の樹脂１３は注型用樹脂登の熱硬化時に同時に
硬化し〜未硬化部分は完全に無くなる。従ってト未硬化
の紫外線硬化樹脂１３が、抵抗体上に流れることによっ
て摺動導体の回転が阻害される塵れもない。以上のよう
に本発明に依れば、紫外線硬化樹脂の使用により、従来
の如き煩雑な０リングが要らず、又抵抗基板とカバーと
の間の密封封着作業も短時間で行なえることとなり生産
能率が向上する。The present invention has been made in view of the above points.
As shown in the embodiment of the axial resistor, after the resistance board 1 is housed in the cover 2, the gap between the board periphery la and the cover 2 is sealed with an ultraviolet curing resin 13. In FIG. 4, the same parts as in FIG. A material with a high thixotropy of about 10,000 CPS is preferable.The ultraviolet curing resin 13 is applied through a nozzle, and then cured by irradiation with an ultraviolet lamp (for example, a high-pressure mercury lamp) in 5 to 1 cape sand.Such curing time is , which is significantly shorter than the curing time of the thermosetting resin described in connection with FIG. Sealing is done with the resin 3 for Western-style molds.It should be noted that the resin 3 for Western-style molds is thermosetting, and the ultraviolet curable resin 3 is also thermosetting, so that the surface of the board and the cover are sealed. A small amount of resin 13 that was not cured by the ultraviolet rays because it got into the space between the inner surface and the inner surface of the resin 13 is cured at the same time as the resin for casting is cured by heat, and the uncured portion is completely eliminated. There is no dust that hinders the rotation of the sliding conductor due to the resin 13 flowing onto the resistor.As described above, according to the present invention, by using the ultraviolet curing resin, there is no need for a complicated O-ring as in the past. Moreover, the sealing work between the resistor board and the cover can be carried out in a short time, which improves production efficiency.
更に紫外線硬化樹脂として熱硬化性をも呈する樹脂を使
用するとともに熱硬化性樹脂を洋型樹脂として用いてい
るので、前記熱硬化性樹脂の熱硬化の際に紫外線硬化樹
脂の未硬化部分も同時に硬化され、高圧抵抗器としての
信頼性が向上する。Furthermore, since a resin that also exhibits thermosetting properties is used as the ultraviolet curing resin, and the thermosetting resin is used as a western resin, when the thermosetting resin is thermally cured, the uncured portion of the ultraviolet curing resin is also cured at the same time. It is hardened and its reliability as a high voltage resistor is improved.
第１図は従来例を示す断面図、第２図は同要部平面図、
第３図は他の従釆例を示す断面図、第４図は本発明実施
例を示す断面図である。
ｉ…・・・抵抗基板、２……カバー、３……注型用樹脂
、１５・・・・・・紫外線硬化樹脂。
第１図
第２図
第３図
第４図Fig. 1 is a sectional view showing a conventional example, Fig. 2 is a plan view of the main part,
FIG. 3 is a cross-sectional view showing another subordinate example, and FIG. 4 is a cross-sectional view showing an embodiment of the present invention. i... Resistance board, 2... Cover, 3... Casting resin, 15... Ultraviolet curing resin. Figure 1 Figure 2 Figure 3 Figure 4
Claims (1)
納した後、上記基板周縁とカバー内面との間隙に熱硬化
性をも呈する紫外線硬化樹脂を施し、該紫外線硬化樹脂
を紫外線ランプ照射により硬化せしめて密封し、次いで
熱硬化性注型樹脂を前記カバーの開口端から注入後熱硬
化せしめたことを特徴とする高圧抵抗器の製造方法。1. After the resistance board is placed and stored on the step provided in the cover, an ultraviolet curing resin that also exhibits thermosetting properties is applied to the gap between the periphery of the board and the inner surface of the cover, and the ultraviolet curing resin is heated with an ultraviolet lamp. 1. A method for manufacturing a high voltage resistor, comprising curing and sealing by irradiation, and then injecting a thermosetting casting resin from the open end of the cover, and then curing with heat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56004496A JPS6027162B2 (en) | 1981-01-13 | 1981-01-13 | Manufacturing method of high voltage resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56004496A JPS6027162B2 (en) | 1981-01-13 | 1981-01-13 | Manufacturing method of high voltage resistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57117203A JPS57117203A (en) | 1982-07-21 |
| JPS6027162B2 true JPS6027162B2 (en) | 1985-06-27 |
Family
ID=11585673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56004496A Expired JPS6027162B2 (en) | 1981-01-13 | 1981-01-13 | Manufacturing method of high voltage resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6027162B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61197162U (en) * | 1985-05-29 | 1986-12-09 | ||
| JPH02240488A (en) * | 1989-03-11 | 1990-09-25 | Torii Kasei Kk | Pipe burying method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5235862A (en) * | 1975-09-16 | 1977-03-18 | Sony Corp | Method of coating electronic parts |
| JPS5482668A (en) * | 1977-12-15 | 1979-07-02 | Matsushita Electric Ind Co Ltd | Method of mounting components to printed circuit base board |
| JPS54105774A (en) * | 1978-02-08 | 1979-08-20 | Hitachi Ltd | Method of forming pattern on thin film hybrid integrated circuit |
| JPS55127698A (en) * | 1979-03-23 | 1980-10-02 | Koito Kogyo Kk | Trafic signal light unit |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52140056U (en) * | 1976-04-16 | 1977-10-24 | ||
| JPS6031210Y2 (en) * | 1977-12-05 | 1985-09-18 | 株式会社村田製作所 | High voltage variable resistor |
-
1981
- 1981-01-13 JP JP56004496A patent/JPS6027162B2/en not_active Expired
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5235862A (en) * | 1975-09-16 | 1977-03-18 | Sony Corp | Method of coating electronic parts |
| JPS5482668A (en) * | 1977-12-15 | 1979-07-02 | Matsushita Electric Ind Co Ltd | Method of mounting components to printed circuit base board |
| JPS54105774A (en) * | 1978-02-08 | 1979-08-20 | Hitachi Ltd | Method of forming pattern on thin film hybrid integrated circuit |
| JPS55127698A (en) * | 1979-03-23 | 1980-10-02 | Koito Kogyo Kk | Trafic signal light unit |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61197162U (en) * | 1985-05-29 | 1986-12-09 | ||
| JPH02240488A (en) * | 1989-03-11 | 1990-09-25 | Torii Kasei Kk | Pipe burying method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57117203A (en) | 1982-07-21 |
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