JPS6025158U - Simulation frame for synthetic resin molding - Google Patents
Simulation frame for synthetic resin moldingInfo
- Publication number
- JPS6025158U JPS6025158U JP11599183U JP11599183U JPS6025158U JP S6025158 U JPS6025158 U JP S6025158U JP 11599183 U JP11599183 U JP 11599183U JP 11599183 U JP11599183 U JP 11599183U JP S6025158 U JPS6025158 U JP S6025158U
- Authority
- JP
- Japan
- Prior art keywords
- synthetic resin
- resin molding
- frame
- simulation frame
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図はトランジスタ用リードフレームの平面図、第2
図は前記リードフレームとモールド金型との位置関係を
示す平面図、第3図は第2図の■−I線拡大断面図、第
4図は第3図のTV−IV線拡大断面図、第5図はトラ
ンジスタ用模擬フレームの平面図、第6図は模擬フレー
ムとモールド金型の位置関係を示す平面図、第7図は第
6図の■−■線拡大断面図、第8図はIC用リードフレ
ームの平面図、第9図はリードフレームと製品部との位
置関係を示す平面図、第10図は第9図のX−X線視で
示す拡大断面図、第11図はIC用模擬フレームの平面
図、第12図は第11図のX■−X■線断面図、第13
図は模擬フレームと製品との位置関係を示す平面図、第
14図は第13図のXIV−XIV線拡大断面図である
。
1.20・・・・・・製品用リードフレーム、7,8・
・・・・・モールド金型、27.28・・・・・・モー
ルド金型、11.11’・・・・・・段付き合せ面、2
9.29’・・・・・・段付き合せ面、12.32・・
・・・・模擬フレーム、14.35・・・・・・栓板部
。Figure 1 is a plan view of a transistor lead frame, Figure 2 is a plan view of a lead frame for a transistor.
The figure is a plan view showing the positional relationship between the lead frame and the mold die, FIG. 3 is an enlarged sectional view taken along the line ■-I in FIG. 2, and FIG. 4 is an enlarged sectional view taken along the line TV-IV in FIG. Figure 5 is a plan view of a simulated transistor frame, Figure 6 is a plan view showing the positional relationship between the simulated frame and the mold, Figure 7 is an enlarged sectional view taken along the line ■-■ in Figure 6, and Figure 8 is a plan view showing the positional relationship between the simulated frame and the mold. A plan view of a lead frame for IC, FIG. 9 is a plan view showing the positional relationship between the lead frame and the product part, FIG. 10 is an enlarged sectional view taken along line X-X in FIG. 9, and FIG. 11 is an IC lead frame. Fig. 12 is a sectional view taken along the line X--X in Fig. 11, Fig.
The figure is a plan view showing the positional relationship between the simulated frame and the product, and FIG. 14 is an enlarged sectional view taken along the line XIV-XIV in FIG. 13. 1.20... Lead frame for products, 7,8.
...Mold die, 27.28...Mold die, 11.11'...Stepped mating surface, 2
9.29'・・・Stepped surface, 12.32...
...Mock frame, 14.35...Plug plate part.
Claims (1)
ド金型に対し着脱自在に装着する模擬フレームに、前記
両金型のキャビティより外側に形成した段付き合せ面に
て挟着される栓板部を形成し、該栓坂部を前記キャビテ
ィ内に突出させない−ように構成して成る合成樹脂モー
ルド成型用模擬フレーム。A plug plate portion is sandwiched between a stepped mating surface formed on the outside of the cavity of both molds, and is attached to a mock frame that is detachably attached to a pair of mating mold molds for resin-molding a product part of an electronic component. A simulated frame for synthetic resin molding, which is configured such that the stopper slope portion does not protrude into the cavity.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11599183U JPS6025158U (en) | 1983-07-25 | 1983-07-25 | Simulation frame for synthetic resin molding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11599183U JPS6025158U (en) | 1983-07-25 | 1983-07-25 | Simulation frame for synthetic resin molding |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6025158U true JPS6025158U (en) | 1985-02-20 |
JPH0126110Y2 JPH0126110Y2 (en) | 1989-08-04 |
Family
ID=30267563
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11599183U Granted JPS6025158U (en) | 1983-07-25 | 1983-07-25 | Simulation frame for synthetic resin molding |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6025158U (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59117222A (en) * | 1982-12-24 | 1984-07-06 | Hitachi Ltd | Dummy lead frame |
-
1983
- 1983-07-25 JP JP11599183U patent/JPS6025158U/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59117222A (en) * | 1982-12-24 | 1984-07-06 | Hitachi Ltd | Dummy lead frame |
Also Published As
Publication number | Publication date |
---|---|
JPH0126110Y2 (en) | 1989-08-04 |
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