JPS60246015A - Gimbal spring for magnetic head - Google Patents
Gimbal spring for magnetic headInfo
- Publication number
- JPS60246015A JPS60246015A JP10059684A JP10059684A JPS60246015A JP S60246015 A JPS60246015 A JP S60246015A JP 10059684 A JP10059684 A JP 10059684A JP 10059684 A JP10059684 A JP 10059684A JP S60246015 A JPS60246015 A JP S60246015A
- Authority
- JP
- Japan
- Prior art keywords
- magnetic head
- insulating layer
- spring piece
- spring
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/486—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives with provision for mounting or arranging electrical conducting means or circuits on or along the arm assembly
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/17—Construction or disposition of windings
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/58—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed with provision for moving the head for the purpose of maintaining alignment of the head relative to the record carrier during transducing operation, e.g. to compensate for surface irregularities of the latter or for track following
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
- Supporting Of Heads In Record-Carrier Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は電子計算機の記憶装置などに用いられる磁気ヘ
ッド用ジンバルばねに関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a gimbal spring for a magnetic head used in a storage device of an electronic computer.
一般に高密度記録のためには磁気ヘッドと記憶媒体との
間隙は小さいほど有利である。一方、記憶媒体として用
いられている磁気円板などにおいては面振れや熱膨張が
あり、磁気ヘッドを単に機械的に固定したのでは前記間
隙を一定に保つことは困難となる。このため、近年磁気
ヘッドをジンバルばねに保持し流体力学的に浮動させ、
前記面振れに追従しながら常に一定の微小間隙を保つ浮
動ヘッド機構が開発されている。Generally, for high-density recording, the smaller the gap between the magnetic head and the storage medium, the more advantageous. On the other hand, a magnetic disk used as a storage medium is subject to surface runout and thermal expansion, making it difficult to maintain the gap constant by simply mechanically fixing the magnetic head. For this reason, in recent years the magnetic head has been held on a gimbal spring and floated hydrodynamically.
A floating head mechanism that always maintains a constant minute gap while following the surface runout has been developed.
第１図はこの機構に用いられる従来の磁気ヘッド用ジン
バルばねの磁気ヘッドが取付けられた状態を示す斜視図
で、ジンバルばね１はステンレス等の金属材から薄板状
に形成されたばね片２から構成されている。ばね片２は
容易に弾性変形可能な短冊状の保持部２ａを有し、この
保持部２ａに磁気ヘッドとしての薄膜へソド３を保持し
ている。Fig. 1 is a perspective view showing a conventional gimbal spring for a magnetic head used in this mechanism with a magnetic head attached, and the gimbal spring 1 is composed of a spring piece 2 formed into a thin plate shape from a metal material such as stainless steel. has been done. The spring piece 2 has a strip-shaped holding portion 2a that can be easily elastically deformed, and a magnetic head 3 is held on this holding portion 2a to a thin film serving as a magnetic head.
薄膜ヘッド３は端部に薄膜ヘッドエレメント４が設けら
れ、図示しない記憶媒体との対向面にはスライダ５が形
成されている。そして、前記保持部２ａが弾性変形する
ことにより、薄膜ヘッド３を揺動させ、記憶媒体上の薄
膜ヘッド３に加わる縦および横方向の外乱に対して薄膜
へソド３を安定に走行させるように構成されている。The thin film head 3 is provided with a thin film head element 4 at an end thereof, and a slider 5 is formed on a surface facing a storage medium (not shown). By elastically deforming the holding portion 2a, the thin film head 3 is swung, and the rod 3 is stably moved to the thin film against vertical and horizontal disturbances applied to the thin film head 3 on the storage medium. It is configured.
ところで、前記薄膜ヘッドエレメント４と記録−および
再生信号のやり取りを行うためには、薄膜ヘッドエレメ
ント４の電極６を前記信号を制御する回路に接続する必
要があり、従来リード線７を用い、このリード線７をは
んだ付けすることによって電極６に接続し、ジンバルば
ね１上をはわせるようにしている。By the way, in order to exchange recording and reproduction signals with the thin film head element 4, it is necessary to connect the electrodes 6 of the thin film head element 4 to a circuit that controls the signals. The lead wire 7 is connected to the electrode 6 by soldering, and is made to fit over the gimbal spring 1.
しかしながら、このようにリード線７を用いるとリード
線７をはんだ付けによって接続するというきわめて煩雑
な作業が要求されるため、リード線７の接続が困難にな
るという不具合がある。その結果、生産性の向上をはか
ることができないのは勿論、前記はんだ付は作業の熱に
より薄膜ヘッド３が熱破壊するおそれがあり、延いては
信頼性の低下を招くことになる。また、リード線７が固
定されていないために、高速ヘンドシーク時の振動によ
りリード線７の分布容量やインダクタンスが変化し、リ
ード線７まで含めた薄膜ヘッド３の入力インピーダンス
が変動することになり、さらにリード線７の剛性のため
に、薄膜ヘッド３の安定走行が妨げられるという不都合
も生じていた。However, when the lead wires 7 are used in this way, the very complicated work of connecting the lead wires 7 by soldering is required, and therefore there is a problem that the connection of the lead wires 7 becomes difficult. As a result, it goes without saying that productivity cannot be improved, and the thin film head 3 may be thermally destroyed by the heat of the soldering operation, which ultimately leads to a decrease in reliability. In addition, since the lead wire 7 is not fixed, the distributed capacitance and inductance of the lead wire 7 change due to vibration during high-speed hand seek, and the input impedance of the thin film head 3 including the lead wire 7 changes. Furthermore, the rigidity of the lead wire 7 has caused the inconvenience that stable running of the thin film head 3 has been hindered.
本発明はこのような事情に鑑みなされたもので、ばね片
の表面に絶縁層を形成すると共に、この絶縁層上に磁気
ヘッドのリード線を構成する導電膜を形成するというき
わめて簡単な構成により、リード線の接続が容易に行え
る磁気ヘッド用ジンバルばねを提供するものである。以
下、その構成等を図に示す実施例により詳細に説明する
。The present invention was developed in view of these circumstances, and uses an extremely simple structure in which an insulating layer is formed on the surface of the spring piece, and a conductive film that constitutes the lead wire of the magnetic head is formed on this insulating layer. The present invention provides a gimbal spring for a magnetic head that allows easy connection of lead wires. Hereinafter, its configuration and the like will be explained in detail with reference to embodiments shown in the drawings.
第２図は本発明に係る磁気ヘッド用ジンバルばねの磁気
ヘッドが取付けられた状態を示す斜視図で、同図におい
て符号８で示すものはジンバルばねを示し、このジンバ
ルばね８は従来のものと同様にばね材であるステンレス
等の金属材の薄板からジンバル形状に形成されたばね片
２を備えており、このばね片２の保持部２ａの裏面に薄
膜へンド３を保持している。この薄膜ヘッド３は従来と
同様に端部に薄膜ヘッドエレメント４が設けられ、図示
しない記憶媒体との対向面にはスライダ５が形成されて
いる。薄膜ヘッドエレメント４の電極６は薄膜ヘッド３
の表面にまで延設されている。FIG. 2 is a perspective view showing a gimbal spring for a magnetic head according to the present invention in which a magnetic head is attached. Similarly, a spring piece 2 formed in a gimbal shape from a thin plate of a metal material such as stainless steel, which is a spring material, is provided, and a thin film end 3 is held on the back surface of a holding portion 2a of this spring piece 2. This thin film head 3 is provided with a thin film head element 4 at the end as in the conventional case, and a slider 5 is formed on the surface facing a storage medium (not shown). The electrode 6 of the thin film head element 4 is connected to the thin film head 3
It extends to the surface of the
換言すれば、電極６はばね片２の表面と同一な方向に対
向するように設けられている。In other words, the electrode 6 is provided so as to face the surface of the spring piece 2 in the same direction.
９はポリイミド樹脂等の有機物の絶縁材からなる絶縁層
で、この絶縁層９は前記ポリイミド樹脂等を塗布するこ
とによりばね片２の表面に一様な厚さに形成されている
。また絶縁層９の形状はばね片２の基端部から縁部に沿
って保持部２ａに至る連続した形状に形成されている。Reference numeral 9 denotes an insulating layer made of an organic insulating material such as polyimide resin, and this insulating layer 9 is formed to have a uniform thickness on the surface of the spring piece 2 by applying the polyimide resin or the like. Moreover, the shape of the insulating layer 9 is formed in a continuous shape from the base end of the spring piece 2 to the holding part 2a along the edge.
１０はこの絶縁層９上に周知の蒸着手段およびフォトリ
ソグラフィ技術によって形成されたアルミニウムあるい
はクロムと金との合金などの導電材からなる導電膜であ
る。この導電膜１０は前記絶縁層９に沿った一様な厚さ
および幅を有する薄膜状に形成され、薄膜ヘッド３の電
極６に近接する位置にまで延設されている。このため、
この導電膜１０は薄膜ヘッド３とばね片２の基端部とを
電気的に接続するリード線を構成している。Reference numeral 10 denotes a conductive film made of a conductive material such as aluminum or an alloy of chromium and gold, which is formed on the insulating layer 9 by well-known vapor deposition means and photolithography. The conductive film 10 is formed into a thin film having a uniform thickness and width along the insulating layer 9, and extends to a position close to the electrode 6 of the thin film head 3. For this reason,
This conductive film 10 constitutes a lead wire that electrically connects the thin film head 3 and the base end of the spring piece 2 .
１１はこの導電膜ゝ１０の一端部と薄膜ヘッド３の電極
６とを接続するワイヤで、超音波ボンダ２熱圧着装置等
により導電膜１０と電極６との間に形成されている。A wire 11 connects one end of the conductive film 10 and the electrode 6 of the thin film head 3, and is formed between the conductive film 10 and the electrode 6 using an ultrasonic bonder 2 thermocompression bonding device or the like.
本実施例においては、前記ばね片２にジンバルばね材と
して広く使用されている厚さ２０〜６０μｍのステンレ
ス板を用い、先ずこのステンレス板を基板としてこの表
面上に、ポリイミド樹脂を所定の厚さ例えば厚さ１０μ
ｍ程度に塗布した後、このポリイミド樹脂を周知のポリ
イミド樹脂のエツチング法により、ばね片２の基端部か
ら縁部に沿って保持部２ａに至る連続した所定の形状に
エツチングして絶縁層９を形成している。In this embodiment, a stainless steel plate with a thickness of 20 to 60 μm, which is widely used as a gimbal spring material, is used as the spring piece 2. First, the stainless steel plate is used as a substrate, and a polyimide resin is applied on the surface to a predetermined thickness. For example, thickness 10μ
After applying the polyimide resin to a thickness of about 1.5 m, the polyimide resin is etched into a continuous predetermined shape from the base end of the spring piece 2 along the edge to the holding part 2a using a well-known polyimide resin etching method to form the insulating layer 9. is formed.
このとき、絶縁層９が形成された前記基板の剛性は、基
板のヤング率と基板の厚さとで定まるが、ステンレス板
とポリイミド樹脂とのヤング率の比は５０以上となるた
め、１０μｍ程度のポリイミド樹脂をステンレス板上に
塗布してもステンレス板の剛性が損なわれるようなこと
がない。At this time, the rigidity of the substrate on which the insulating layer 9 is formed is determined by the Young's modulus of the substrate and the thickness of the substrate, but since the ratio of the Young's modulus of the stainless steel plate and the polyimide resin is 50 or more, Even if polyimide resin is applied onto a stainless steel plate, the rigidity of the stainless steel plate will not be impaired.
次いで、この絶縁層９上にアルミニウムあるいはクロム
と金との合金などを周知の蒸着手段によって蒸着し、蒸
着された膜を周知のフォトリソグラフィ技術により所定
の形状に形成している。そして、最後にステンレス板を
ジンバル形状、すなわちばね片２の形状にエツチングす
ることにより、ジンバルばね８を形成している。Next, aluminum or an alloy of chromium and gold is deposited on this insulating layer 9 by a well-known vapor deposition method, and the deposited film is formed into a predetermined shape by a well-known photolithography technique. Finally, the gimbal spring 8 is formed by etching the stainless steel plate into a gimbal shape, that is, the shape of the spring piece 2.
前述した絶縁層９の形成工程において、ポリイミド樹脂
をエツチングしているのは、絶縁層９はばね片２となる
基板のステンレス板と導電膜１０との電気的絶縁をとる
ためのもので、ばね片２の表面の全面に形成する必要は
ないからである。In the process of forming the insulating layer 9 described above, the polyimide resin is etched because the insulating layer 9 is intended to provide electrical insulation between the stainless steel plate of the substrate that will become the spring piece 2 and the conductive film 10. This is because it is not necessary to form it on the entire surface of the piece 2.
このように構成された磁気ヘッド用ジンバルばねにおい
ては、ばね片２の表面に形成した絶縁層９上にリード線
を構成する導電膜１０を形成したから、導電膜ｉ０をば
ね片２と絶縁された状態に形成し、ストリップライン形
式のリード線をばね片２と一体に、かつばね片２に固定
された状態に設けることができる。換言すれば、従来薄
膜ヘッド３を安定に走行させるためにのみ用いられてい
たばね片２に、薄膜ヘッド３の接続用のリード線が設け
られている。このため、リード線を薄膜ヘッド３の電極
６に対して固定することができるから、超音波ボンダ、
熱圧着装置等のワイヤ・ポンディング装置を使用し、こ
の装置のワイヤ１１によって導電膜１０と電極６とを接
続することにより、薄膜ヘッド３をリード線に接続する
ことができる。In the gimbal spring for a magnetic head constructed in this way, since the conductive film 10 constituting the lead wire is formed on the insulating layer 9 formed on the surface of the spring piece 2, the conductive film i0 is insulated from the spring piece 2. A strip line type lead wire can be provided integrally with the spring piece 2 and fixed to the spring piece 2. In other words, a lead wire for connecting the thin film head 3 is provided on the spring piece 2, which has conventionally been used only for making the thin film head 3 run stably. Therefore, since the lead wire can be fixed to the electrode 6 of the thin film head 3, the ultrasonic bonder
The thin film head 3 can be connected to the lead wire by using a wire bonding device such as a thermocompression bonding device and connecting the conductive film 10 and the electrode 6 through the wire 11 of this device.
したがって、従来のように別の部品からなるリード線を
はんだ付けしてばね片２に沿ってはわせるような煩雑な
作業が要求されないから、リード線の接続を容易にかつ
迅速に行うことができる。Therefore, there is no need for the complicated work of soldering a lead wire made of a separate component and making it fit along the spring piece 2 as in the past, making it possible to connect the lead wires easily and quickly. can.
またはんだ付は作業と異なり、磁気ヘッドに過度の熱衝
撃が加えられることもないから、薄膜へノド３の熱破壊
を防止でき、信頼性を損なうこともない。Unlike soldering work, excessive thermal shock is not applied to the magnetic head, so thermal damage to the thin film by the groove 3 can be prevented and reliability will not be impaired.
さらに、リード線はばね片２上に固定されているので、
高速ヘンドシーク時においても振動して変形することが
なく、薄膜ヘッド３の入力インピーダンスの変動も生じ
ることがない。しかもリード線は薄膜である導電膜１０
から構成され剛性はきわめて小さいから、リード線によ
って薄膜ヘッド３の安定走行が損なわれるようなことも
ない。Furthermore, since the lead wire is fixed on the spring piece 2,
Even during high-speed hand seek, it does not vibrate and deform, and the input impedance of the thin film head 3 does not fluctuate. Moreover, the lead wire is a thin conductive film 10.
Since the rigidity is extremely low, the stable running of the thin film head 3 is not impaired by the lead wire.
フォトリソグラフィ技術によれば絶縁層９の厚さおよび
導電膜１０の幅等のばらつきを小さくすることもできる
ので、分布容量１ インダクタンスのばらつきの小さな
磁気ヘッド走行系を実現することができる。Photolithography technology can also reduce variations in the thickness of the insulating layer 9 and the width of the conductive film 10, so it is possible to realize a magnetic head running system with small variations in distributed capacitance and inductance.
第３図は他の実施例を示す断面図で、この実施例におい
てはジンバルばね８は、絶縁層９を介して導電膜１０に
対向する部分が切欠き部１２によって除去されたばね片
２を備えている。切欠き部１２は導電膜１０に沿って延
在し、エツチングによって穿設されている。この例にお
いては、上述した実施例と同様な作用効果が得られるほ
か、導電膜１０の分布容量を低減することができる。こ
れは絶縁材の種類によって絶縁層９を厚く形成すること
が困難な場合に、ばね片２と導電膜１０との間隔が小さ
くなり導電膜１０の分布容量が大きくなるときに有効で
ある。すなわち、このようなときであっても、切欠き部
１２によってばね片２と導電膜１０とを離間させること
ができ、これにより前記分布容量を小さくすることがで
きる。FIG. 3 is a sectional view showing another embodiment. In this embodiment, the gimbal spring 8 includes a spring piece 2 in which a portion facing a conductive film 10 with an insulating layer 9 interposed therebetween is removed by a notch 12. ing. The notch 12 extends along the conductive film 10 and is formed by etching. In this example, in addition to obtaining the same effects as those of the above-described embodiment, the distributed capacitance of the conductive film 10 can be reduced. This is effective when it is difficult to form the insulating layer 9 thickly depending on the type of insulating material, and when the distance between the spring piece 2 and the conductive film 10 becomes small and the distributed capacitance of the conductive film 10 becomes large. That is, even in such a case, the spring piece 2 and the conductive film 10 can be separated from each other by the notch 12, thereby making it possible to reduce the distributed capacitance.
なお、上記実施例においては、磁気ヘッドとして薄膜ヘ
ッド３を保持した例について説明したが、本発明はこれ
に限定されるものではなく、通常の機械的に加工された
磁気ヘッドを保持することができるのは勿論で、従来の
リード線の剛性による不安定な走行を抑制し、安定させ
ることができるのはいうまでもない。In the above embodiment, an example was explained in which the thin film head 3 was held as a magnetic head, but the present invention is not limited to this, and it is possible to hold an ordinary mechanically processed magnetic head. Of course, it is possible to suppress unstable running due to the rigidity of conventional lead wires and stabilize it.
以上説明したように本発明によれば、ばね片の表面に絶
縁層を形成すると共に、この絶縁層上に磁気ヘッドのリ
ード線を構成する導電膜を形成したから、磁気ヘッドの
リード線をばね片と一体にばね片に固定された状態に設
けることができる。As explained above, according to the present invention, an insulating layer is formed on the surface of the spring piece, and a conductive film constituting the lead wire of the magnetic head is formed on this insulating layer. It can be provided integrally with the spring piece and fixed to the spring piece.
したがって、磁気ヘッドのリード線との接続に際し、超
音波ポンダ装置等の装置を使用することができるから、
リード線の接続が容易にかつ迅速に行えるという効果が
ある。また磁気ヘッドに過度の熱衝撃が加えられること
もないから、磁気ヘッドの信頼性を損なうこともない。Therefore, it is possible to use a device such as an ultrasonic ponder device when connecting the lead wire of the magnetic head.
This has the effect that lead wires can be easily and quickly connected. Furthermore, since excessive thermal shock is not applied to the magnetic head, the reliability of the magnetic head is not impaired.
さらに、リード線はばね片上に固定されているので、磁
気ヘッドの入力インピーダンスのばらつきや動作時の変
動を抑えることができると共に、リード線は剛性の小さ
な導電膜から構成されているから磁気ヘッドの安定走行
が損なわれるようなこともない。その結果、ジンバルば
ねに保持された信頼性が高く特性変動の小さな磁気ヘッ
ドの量産も期待できる。Furthermore, since the lead wire is fixed on the spring piece, variations in the input impedance of the magnetic head and fluctuations during operation can be suppressed, and since the lead wire is made of a conductive film with low rigidity, the magnetic head Stable running will not be impaired. As a result, we can expect mass production of highly reliable magnetic heads held by gimbal springs with small characteristic fluctuations.
第１図は従来の磁気ヘッド用ジンバルばねの磁気ヘッド
が取付けられた状態を示す斜視図、第２図は本発明に係
る磁気ヘッド用ジンバルばねの磁気ヘッドが取付けられ
た状態を示す斜視図、第３図は他の実施例を示す断面図
である。
２・・・・ばね片、３・・・・薄膜ヘッド、６・・・・
電極、８・・・・ジンバルばね、９・・・・絶縁層、１
０・・・・導電膜。
特許出願人 日本電信電話公社
代理人 山川政樹（ほか１名）FIG. 1 is a perspective view showing a conventional gimbal spring for a magnetic head with a magnetic head attached thereto, FIG. 2 is a perspective view showing a gimbal spring for a magnetic head according to the present invention with a magnetic head attached; FIG. 3 is a sectional view showing another embodiment. 2...Spring piece, 3...Thin film head, 6...
Electrode, 8...Gimbal spring, 9...Insulating layer, 1
0... Conductive film. Patent applicant: Nippon Telegraph and Telephone Public Corporation agent Masaki Yamakawa (and one other person)
Claims (1)
ね片の表面に絶縁層を形成すると共に、この絶縁層上に
前記磁気ヘッドのリード線を構成する導電膜を形成した
ことを特徴とする磁気ヘッド用ジンバルばね。 （２）絶縁層を介して導電膜に対向する部分を除去した
ばね片を備えたことを特徴とする特許請求の範囲第１項
記載の磁気ヘッド用ジンバルばね。[Claims] +l) [In the gimbal spring that holds the magnetic head, an insulating layer is formed on the surface of the spring piece, and a conductive film forming the lead wire of the magnetic head is formed on the insulating layer. A gimbal spring for magnetic heads featuring: (2) The gimbal spring for a magnetic head according to claim 1, further comprising a spring piece whose portion facing the conductive film with an insulating layer interposed therebetween has been removed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10059684A JPS60246015A (en) | 1984-05-21 | 1984-05-21 | Gimbal spring for magnetic head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10059684A JPS60246015A (en) | 1984-05-21 | 1984-05-21 | Gimbal spring for magnetic head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60246015A true JPS60246015A (en) | 1985-12-05 |
Family
ID=14278246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10059684A Pending JPS60246015A (en) | 1984-05-21 | 1984-05-21 | Gimbal spring for magnetic head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60246015A (en) |
Cited By (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0265720A2 (en) * | 1986-10-28 | 1988-05-04 | International Business Machines Corporation | A slider-suspension assembly and method for attaching a slider to a suspension in a data recording disk file |
| EP0484906A2 (en) * | 1990-11-09 | 1992-05-13 | Brier Technology | Head mounting device |
| JPH0554516A (en) * | 1991-08-23 | 1993-03-05 | Matsushita Electric Ind Co Ltd | Magnetic head device |
| EP0599669A2 (en) * | 1992-11-27 | 1994-06-01 | Fujitsu Limited | Magnetic head supporting mechanism |
| US5491597A (en) * | 1994-04-15 | 1996-02-13 | Hutchinson Technology Incorporated | Gimbal flexure and electrical interconnect assembly |
| GB2295918A (en) * | 1994-12-08 | 1996-06-12 | Ibm | Minimal stiffness conductor arrangement for a head gimbal assembly |
| US5598307A (en) * | 1994-04-15 | 1997-01-28 | Hutchinson Technology Inc. | Integrated gimbal suspension assembly |
| US5612841A (en) * | 1993-06-15 | 1997-03-18 | Seagate Technology, Inc. | Flexure assembly for hard disc drive heads |
| US5657186A (en) * | 1994-09-01 | 1997-08-12 | Tdk Corporation | Device for supporting a magnetic head slider and magnetic head apparatus provided with the device including grounding electrical connection |
| EP0789351A1 (en) * | 1996-02-12 | 1997-08-13 | Read-Rite Corporation | Conductive trace flexure for a magnetic head suspension assembly |
| US5694270A (en) * | 1995-07-03 | 1997-12-02 | Fujitsu Limited | Head assembly having laminated conductor patterns |
| US5731931A (en) * | 1994-03-22 | 1998-03-24 | Hutchinson Technology Incorporated | Monocoque suspension |
| US5771138A (en) * | 1995-03-15 | 1998-06-23 | Read-Rite Corporation | Head gimbal assembly with transducer wires attached at two points to slider |
| US5781379A (en) * | 1994-03-15 | 1998-07-14 | International Business Machines Corporation | Single beam flexure for a head gimbal assembly |
| US5786964A (en) * | 1994-03-08 | 1998-07-28 | Fujitsu Limited | Magnetic disk drive unit with improved signal feeding and extracting arrangement |
| US5796549A (en) * | 1996-07-03 | 1998-08-18 | Seagate Technology, Inc. | Universal bond pad configuration |
| US5808834A (en) * | 1995-06-07 | 1998-09-15 | Hutchinson Technology Incorporated | Laminated adapter |
| US5835306A (en) * | 1995-06-07 | 1998-11-10 | Hutchinson Technology Incorporated | Integrated gimbal suspension assembly with assymetric bond pad |
| US5839193A (en) * | 1994-04-15 | 1998-11-24 | Hutchinson Technology Incorporated | Method of making laminated structures for a disk drive suspension assembly |
| US5862017A (en) * | 1993-07-12 | 1999-01-19 | Hitachi, Ltd. | Rotary disk storage unit and head suspension therefor |
| US5892637A (en) * | 1996-05-10 | 1999-04-06 | International Business Machines Corporation | Multi-piece integrated suspension assembly for a magnetic storage system |
| US5912788A (en) * | 1990-11-09 | 1999-06-15 | Hutchinson Technology Inc. | Flexure region for one-piece flexure-load beam structure |
| US5955176A (en) * | 1994-03-15 | 1999-09-21 | International Business Machines Corporation | Integrated suspension using a high strength conductive material |
| US5982584A (en) * | 1996-12-19 | 1999-11-09 | Hutchinson Technology Incorporated | Integrated lead suspension flexure with serially arranged metal-backed and suspended insulator portions for hygrothermal compensation |
| US6002548A (en) * | 1992-11-27 | 1999-12-14 | Fujitsu Limited | Magnetic head supporting mechanism |
| US6014289A (en) * | 1994-03-22 | 2000-01-11 | Hutchinson Technology Incorporated | Integrated circuit on a monocoque suspension |
| US6021022A (en) * | 1997-10-27 | 2000-02-01 | Seagate Technology, Inc. | Flexure displacement limiter-flex circuit interconnect |
| US6057986A (en) * | 1997-07-23 | 2000-05-02 | Suncall Corporation | Support mechanism for magnetic head sliders and method for producing the same |
| US6134075A (en) * | 1994-04-15 | 2000-10-17 | Hutchinson Technology Incorporated | Magnetic head suspension with single layer preshaped trace interconnect |
| US6147839A (en) * | 1996-12-23 | 2000-11-14 | Hutchinson Technology, Inc. | Head suspension with outriggers extending across a spring region |
| US6160685A (en) * | 1989-11-27 | 2000-12-12 | Censtor Corp. | Hard disk drive with lightly contacting head |
| US6203918B1 (en) | 1996-08-19 | 2001-03-20 | Nippon Steel Chemical Co., Ltd. | Laminate for HDD suspension and its manufacture |
| US6282064B1 (en) | 1994-03-15 | 2001-08-28 | International Business Machines Corporation | Head gimbal assembly with integrated electrical conductors |
| US6303230B1 (en) | 1995-01-17 | 2001-10-16 | Nippon Steel Chemical Co., Ltd. | Laminates |
| US6351348B1 (en) | 1994-03-15 | 2002-02-26 | International Business Machines Corporation | Minimal stiffness conductors for a head gimbal assembly |
| US6381100B1 (en) | 1996-12-19 | 2002-04-30 | Hutchinson Technology Incorporated | Integrated lead suspension flexure with balanced parallel leads for insulator layer hygrothermal compensation |
| US6539609B2 (en) | 1994-07-05 | 2003-04-01 | International Business Machines Corporation | Method of forming a head gimbal assembly |
| US6612016B1 (en) | 1997-12-18 | 2003-09-02 | Hutchinson Technology Incorporated | Method of making integrated lead suspension flexure with balanced parallel leads for insulator layer hygrothermal compensation |
| US7222794B2 (en) | 1995-07-20 | 2007-05-29 | Fujitsu Limiteed | Optical reader applicable to plurality of uses |
-
1984
- 1984-05-21 JP JP10059684A patent/JPS60246015A/en active Pending
Cited By (52)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0265720A2 (en) * | 1986-10-28 | 1988-05-04 | International Business Machines Corporation | A slider-suspension assembly and method for attaching a slider to a suspension in a data recording disk file |
| US6160685A (en) * | 1989-11-27 | 2000-12-12 | Censtor Corp. | Hard disk drive with lightly contacting head |
| US6373662B1 (en) * | 1990-11-09 | 2002-04-16 | Hutchinson Technology Incorporated | Partially etched flexure arms in an integrated gimbal suspension |
| EP0484906A2 (en) * | 1990-11-09 | 1992-05-13 | Brier Technology | Head mounting device |
| US5912788A (en) * | 1990-11-09 | 1999-06-15 | Hutchinson Technology Inc. | Flexure region for one-piece flexure-load beam structure |
| JPH0554516A (en) * | 1991-08-23 | 1993-03-05 | Matsushita Electric Ind Co Ltd | Magnetic head device |
| EP0599669A3 (en) * | 1992-11-27 | 1994-06-15 | Fujitsu Ltd | Magnetic head supporting mechanism. |
| US6560073B1 (en) | 1992-11-27 | 2003-05-06 | Fujitsu Limited | Magnetic head supporting mechanism |
| EP0716413A3 (en) * | 1992-11-27 | 1996-07-17 | Fujitsu Ltd | |
| US6522505B1 (en) | 1992-11-27 | 2003-02-18 | Fujitsu Limited | Magnetic head supporting mechanism |
| EP0716413A2 (en) * | 1992-11-27 | 1996-06-12 | Fujitsu Limited | Magnetic head supporting mechanism and wiring structure therefor |
| US7221541B2 (en) | 1992-11-27 | 2007-05-22 | Fujitsu Limited | Magnetic head supporting mechanism |
| US6212041B1 (en) | 1992-11-27 | 2001-04-03 | Fujitsu Limited | Magnetic head supporting mechanism |
| US6002548A (en) * | 1992-11-27 | 1999-12-14 | Fujitsu Limited | Magnetic head supporting mechanism |
| EP0599669A2 (en) * | 1992-11-27 | 1994-06-01 | Fujitsu Limited | Magnetic head supporting mechanism |
| US5612841A (en) * | 1993-06-15 | 1997-03-18 | Seagate Technology, Inc. | Flexure assembly for hard disc drive heads |
| US5862017A (en) * | 1993-07-12 | 1999-01-19 | Hitachi, Ltd. | Rotary disk storage unit and head suspension therefor |
| US5786964A (en) * | 1994-03-08 | 1998-07-28 | Fujitsu Limited | Magnetic disk drive unit with improved signal feeding and extracting arrangement |
| US5781379A (en) * | 1994-03-15 | 1998-07-14 | International Business Machines Corporation | Single beam flexure for a head gimbal assembly |
| US5955176A (en) * | 1994-03-15 | 1999-09-21 | International Business Machines Corporation | Integrated suspension using a high strength conductive material |
| US6282064B1 (en) | 1994-03-15 | 2001-08-28 | International Business Machines Corporation | Head gimbal assembly with integrated electrical conductors |
| US6351348B1 (en) | 1994-03-15 | 2002-02-26 | International Business Machines Corporation | Minimal stiffness conductors for a head gimbal assembly |
| US6014289A (en) * | 1994-03-22 | 2000-01-11 | Hutchinson Technology Incorporated | Integrated circuit on a monocoque suspension |
| US5731931A (en) * | 1994-03-22 | 1998-03-24 | Hutchinson Technology Incorporated | Monocoque suspension |
| US5864445A (en) * | 1994-04-15 | 1999-01-26 | Hutchinson Technology Incorporated | Hygrothermal load compensating structures in an integrated lead suspension |
| US5839193A (en) * | 1994-04-15 | 1998-11-24 | Hutchinson Technology Incorporated | Method of making laminated structures for a disk drive suspension assembly |
| US5598307A (en) * | 1994-04-15 | 1997-01-28 | Hutchinson Technology Inc. | Integrated gimbal suspension assembly |
| US5645735A (en) * | 1994-04-15 | 1997-07-08 | Hutchinson Technology Incorporated | Gimbal flexure and electrical interconnect assembly |
| US6134075A (en) * | 1994-04-15 | 2000-10-17 | Hutchinson Technology Incorporated | Magnetic head suspension with single layer preshaped trace interconnect |
| US6587310B1 (en) | 1994-04-15 | 2003-07-01 | Hutchinson Technology, Inc. | Magnetic head suspension with single layer preshaped trace interconnect |
| US5491597A (en) * | 1994-04-15 | 1996-02-13 | Hutchinson Technology Incorporated | Gimbal flexure and electrical interconnect assembly |
| US6539609B2 (en) | 1994-07-05 | 2003-04-01 | International Business Machines Corporation | Method of forming a head gimbal assembly |
| US5657186A (en) * | 1994-09-01 | 1997-08-12 | Tdk Corporation | Device for supporting a magnetic head slider and magnetic head apparatus provided with the device including grounding electrical connection |
| GB2295918B (en) * | 1994-12-08 | 1998-10-21 | Ibm | Minimal stiffness conductors for a head gimbal assembly |
| GB2295918A (en) * | 1994-12-08 | 1996-06-12 | Ibm | Minimal stiffness conductor arrangement for a head gimbal assembly |
| US6303230B1 (en) | 1995-01-17 | 2001-10-16 | Nippon Steel Chemical Co., Ltd. | Laminates |
| US5771138A (en) * | 1995-03-15 | 1998-06-23 | Read-Rite Corporation | Head gimbal assembly with transducer wires attached at two points to slider |
| US5808834A (en) * | 1995-06-07 | 1998-09-15 | Hutchinson Technology Incorporated | Laminated adapter |
| US5835306A (en) * | 1995-06-07 | 1998-11-10 | Hutchinson Technology Incorporated | Integrated gimbal suspension assembly with assymetric bond pad |
| US5694270A (en) * | 1995-07-03 | 1997-12-02 | Fujitsu Limited | Head assembly having laminated conductor patterns |
| US7222794B2 (en) | 1995-07-20 | 2007-05-29 | Fujitsu Limiteed | Optical reader applicable to plurality of uses |
| EP0789351A1 (en) * | 1996-02-12 | 1997-08-13 | Read-Rite Corporation | Conductive trace flexure for a magnetic head suspension assembly |
| US5892637A (en) * | 1996-05-10 | 1999-04-06 | International Business Machines Corporation | Multi-piece integrated suspension assembly for a magnetic storage system |
| US5796549A (en) * | 1996-07-03 | 1998-08-18 | Seagate Technology, Inc. | Universal bond pad configuration |
| US6203918B1 (en) | 1996-08-19 | 2001-03-20 | Nippon Steel Chemical Co., Ltd. | Laminate for HDD suspension and its manufacture |
| US6381100B1 (en) | 1996-12-19 | 2002-04-30 | Hutchinson Technology Incorporated | Integrated lead suspension flexure with balanced parallel leads for insulator layer hygrothermal compensation |
| US5982584A (en) * | 1996-12-19 | 1999-11-09 | Hutchinson Technology Incorporated | Integrated lead suspension flexure with serially arranged metal-backed and suspended insulator portions for hygrothermal compensation |
| US6147839A (en) * | 1996-12-23 | 2000-11-14 | Hutchinson Technology, Inc. | Head suspension with outriggers extending across a spring region |
| US6360427B1 (en) | 1997-07-23 | 2002-03-26 | Suncall Corporation | Method of producing a support mechanism for magnetic head sliders |
| US6057986A (en) * | 1997-07-23 | 2000-05-02 | Suncall Corporation | Support mechanism for magnetic head sliders and method for producing the same |
| US6021022A (en) * | 1997-10-27 | 2000-02-01 | Seagate Technology, Inc. | Flexure displacement limiter-flex circuit interconnect |
| US6612016B1 (en) | 1997-12-18 | 2003-09-02 | Hutchinson Technology Incorporated | Method of making integrated lead suspension flexure with balanced parallel leads for insulator layer hygrothermal compensation |
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