JPS60244018A - Cluster ion beam evaporation device - Google Patents

Cluster ion beam evaporation device

Info

Publication number
JPS60244018A
JPS60244018A JP9941384A JP9941384A JPS60244018A JP S60244018 A JPS60244018 A JP S60244018A JP 9941384 A JP9941384 A JP 9941384A JP 9941384 A JP9941384 A JP 9941384A JP S60244018 A JPS60244018 A JP S60244018A
Authority
JP
Japan
Prior art keywords
evaporation
chamber
ion beam
shutter
cluster ion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9941384A
Other languages
Japanese (ja)
Inventor
Keiji Nagai
永井 慶次
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP9941384A priority Critical patent/JPS60244018A/en
Publication of JPS60244018A publication Critical patent/JPS60244018A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To perform cluster ion beam evaporation of even a material of high boiling point or sublimating point by a method wherein an injection nozzle is opened in a partition wall isolating an evaporation chamber and a vaporization source chamber, and a valve to be used both as a shutter and to open and close the injection nozzle is provided to the partition wall. CONSTITUTION:A nozzle 7 provided between an evaporation chamber 14 and a vaporization source chamber 16 is closed according to a valve 12 to be used both as a shutter, the inside of the evaporation chamber 14 is exhausted up to a superhigh vacuum according to an exhaust system 11a, and the inside of the vaporization source chamber 16 is exhausted up to a high vacuum according to an exhaust system 11b. An electron beam is projected to an evaporating material 9 to vaporize the evaporating material, and when the valve 12 to be used both as the shutter is opened controlling the inside of a space part 15, the vaporized evaporating material in the space part 15 is drawn out to a superhigh vacuum passing through the nozzle 7, and the evaporating material forms a cluster according to a supercooling phenomenon to be generated according to adiabatic expansion. Because the electron beam is projected directly to the evaporating material like this, cluster ion beam evaporation can be performed even with a material of high boiling point and high sublimating point.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は真空蒸着装置、特にクラスタイオンビーム蒸着
装置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a vacuum evaporation apparatus, particularly a cluster ion beam evaporation apparatus.

〔従来技術〕[Prior art]

クラスタイオンビーム蒸着装置は第2図に示すようにる
つぼ8で蒸着物質9を加熱、蒸気化し、るつぼのノズル
7から高真空中へ蒸気化した蒸着物質を噴射させること
により、蒸着物質の塊状原(1) + 子集団(クラスタ)を形成する。これにイオン化用電子
放出フィラメント5及びイオン化用電子引き出しグリッ
ド6で電子を照射してクラスタを形成する原子のうち1
個の原子をイオン化してクラスタイオンとし、加速電極
4に印加した負電圧によりクラスタイオンを加速し、イ
オン化しなかったクラスタと共に基板2に衝突させ蒸着
を行なう装置である。この真空蒸着装置は蒸着速度を制
御できるのみならず、クラスタイオンとイオン化しない
中性のクラスタとの比(イオン化率)およびクラスタイ
オンや中性クラスタの運動エネルギーを制御でき、形成
される膜の物性や結晶学的諸性質を制御できるという特
長がある。ところが、クラスタを形成するために蒸着物
質をノズルから高真空中へ噴射させる必要があるので、
蒸着物質の蒸発の方法としては炭化ケイ素等でつくられ
たるつぼ8に蒸着物質9を入れ、るつほの外壁にるつぼ
加熱用電子放出フィラメント10で電子を照射して加熱
し、蒸着物質を蒸発させる方法がとられている。このた
め、クラスタイオンビーム蒸着装置!7 (2) には多くの利点があるにもかかわらず、蒸着物質として
は沸点または昇華点がるつぼの融点よりも十分低い温度
の物質しか使用できないという制限がある。
As shown in FIG. 2, the cluster ion beam evaporation apparatus heats and vaporizes a vapor deposition material 9 in a crucible 8, and injects the vaporized vapor deposition material into a high vacuum from a nozzle 7 of the crucible, thereby forming a lumpy source of the vapor deposition material. (1) + Form a child group (cluster). This is irradiated with electrons by the ionization electron emitting filament 5 and the ionization electron extraction grid 6, so that one of the atoms forming a cluster is
This device ionizes atoms into cluster ions, accelerates the cluster ions with a negative voltage applied to the accelerating electrode 4, and causes them to collide with the non-ionized clusters on the substrate 2 for vapor deposition. This vacuum evaporation equipment can not only control the deposition rate, but also the ratio of cluster ions to neutral clusters that do not ionize (ionization rate) and the kinetic energy of cluster ions and neutral clusters, and the physical properties of the formed film. It has the advantage of being able to control various crystallographic properties. However, in order to form clusters, it is necessary to inject the deposition material from a nozzle into a high vacuum.
The method for evaporating the vapor deposition material is to place the vapor deposition material 9 in a crucible 8 made of silicon carbide or the like, and heat the outer wall of the crucible by irradiating electrons with an electron emitting filament 10 for heating the crucible to evaporate the vapor deposition material. A method is being taken to For this reason, cluster ion beam evaporation equipment! Although 7(2) has many advantages, it has the limitation that only substances whose boiling point or sublimation point are sufficiently lower than the melting point of the crucible can be used as vapor deposition substances.

〔発明の目的〕[Purpose of the invention]

本発明はクラスタイオンビーム蒸着装置のこの欠点を改
善することを目的としており、沸点または昇華点の高い
物質でもクラスタイオンビーム蒸着が行なうことができ
る装置を提供するものである。
The present invention aims to improve this drawback of the cluster ion beam evaporation apparatus, and provides an apparatus capable of performing cluster ion beam evaporation even with substances having a high boiling point or sublimation point.

〔発明の構成〕[Structure of the invention]

本発明は装置本体内に、蒸着用基板を収容する蒸着室と
、蒸発物質を蒸発させる電子ビーム加熱装置を設置した
蒸発源室とを区画形成し、両室を隔離する隔壁に蒸発物
質を蒸着室内に噴出する噴射ノズルを開口するとともに
、該噴射ノズルを開閉するシャッター兼用パルプを隔壁
に設けたことを特徴とするクラスタイオンビーム蒸着装
置である。
In the present invention, an evaporation chamber that accommodates a substrate for evaporation and an evaporation source chamber that is equipped with an electron beam heating device that evaporates the evaporation material are formed in the main body of the apparatus, and the evaporation material is evaporated on a partition wall separating the two chambers. This cluster ion beam evaporation apparatus is characterized in that a partition wall is provided with pulp that also serves as a shutter for opening and closing an injection nozzle that ejects the injection nozzle into a room.

〔実施例〕〔Example〕

以下に、本発明の一実施例を図により説明する。 An embodiment of the present invention will be described below with reference to the drawings.

第1図は本実施例の真空蒸着装置の構造図である。蒸着
装置本体Mの内部は、蒸発源室16と蒸着室14とに隔
壁17により分離されており、それぞれ別々の排気系1
1α、11bが接続される。蒸発源室16内には蒸発し
た蒸着物質9が散逸しないように壁で囲まれた空間部1
5が形成されているとともに、蒸着物質9を直接電子ビ
ームを当て加熱蒸発させる電子ビーム加熱装置13が設
置されている。
FIG. 1 is a structural diagram of the vacuum evaporation apparatus of this embodiment. The inside of the vapor deposition apparatus main body M is divided into an evaporation source chamber 16 and a vapor deposition chamber 14 by a partition wall 17, each of which has a separate exhaust system 1.
1α and 11b are connected. Inside the evaporation source chamber 16, there is a space 1 surrounded by a wall to prevent the evaporated deposition material 9 from escaping.
5 is formed, and an electron beam heating device 13 is installed to heat and evaporate the deposition material 9 by directly applying an electron beam to it.

空間部15の上部の隔壁17に蒸発物質を蒸着室内に噴
出する噴射ノズル7が開口されており、ノズル7を開閉
するシャッター兼用パルプ12が隔壁17に設けられて
いる。蒸着室にはイオン化用電子放出フィラメント6お
よびイオン化用電子引き出しグリッド5のイオン化部分
と、イオンの加速電極4、基板ホルダー1、基板2が従
来装置と同様に配置され、本発明ではシャッター3は空
間部15内に設置される。
An injection nozzle 7 for ejecting the evaporated substance into the deposition chamber is opened in a partition wall 17 at the upper part of the space 15, and a shutter-cum-pulp 12 for opening and closing the nozzle 7 is provided in the partition wall 17. In the deposition chamber, the ionization part of the ionization electron emitting filament 6 and the ionization electron extraction grid 5, the ion acceleration electrode 4, the substrate holder 1, and the substrate 2 are arranged in the same manner as in the conventional apparatus. It is installed in the section 15.

この装置を用いて蒸着は下記の様に行なわれる。Vapor deposition is performed using this apparatus as follows.

蒸着室14と蒸発源室16との間に設けられたノズル7
をシャッター兼用パルプ12で閉じ、蒸着室14内を排
気系11αにより5 X 10””9Torr以下の超
高真空まで排気するとともに、蒸発源室16内を排気系
11bによりI X 10 ’−6Torr程度の高真
空まで排気する。つぎに蒸着物質9に電子ビームを照射
し蒸着物質を蒸発させ、空間部15内を5 ×10−5
 Torr 〜5 XIO’Torr程度に制御しなが
ら、シャッター兼用パルプ12を開けると、空間部15
内の蒸発した蒸着物質はノズル7を通して5 xto−
9Torr以下の超高真空中にひき出され、断熱膨張に
よる過冷現象により蒸着物質はクラスタを形成する。さ
らに、このクラスタに電子を照射しクラスタイオンとし
、加速電極に印加した電圧によりクラスタイオンを加速
し、基板に射突させて蒸着を行なうことは従来装置と同
様である。
Nozzle 7 provided between vapor deposition chamber 14 and evaporation source chamber 16
is closed by the pulp shutter 12, and the inside of the evaporation chamber 14 is evacuated to an ultra-high vacuum of 5 X 10''9 Torr or less by the exhaust system 11α, and the inside of the evaporation source chamber 16 is evacuated to about I X 10'-6 Torr by the exhaust system 11b. Evacuate to high vacuum. Next, the vapor deposition material 9 is irradiated with an electron beam to evaporate the vapor deposition material, and the inside of the space 15 is 5×10−5
When the shutter pulp 12 is opened while controlling the pressure to about 5 XIO' Torr, the space 15
The evaporated material inside passes through the nozzle 7 to 5xto-
The deposited material is drawn out into an ultra-high vacuum of 9 Torr or less, and the deposited material forms clusters due to the supercooling phenomenon caused by adiabatic expansion. Further, the clusters are irradiated with electrons to form cluster ions, the cluster ions are accelerated by a voltage applied to an accelerating electrode, and the cluster ions are made to impinge on a substrate to perform vapor deposition, as in the conventional apparatus.

〔発明の効果〕〔Effect of the invention〕

本発明は以上説明したように、蒸着物質に電子ビームを
直接照射する為、高沸点、高昇華点の物質でもクラスタ
イオンビーム蒸着を行なうことができる。また本体内を
蒸着室と蒸発源室とに隔絶したので、別々の排気系で排
気を行なうことができ、超高真空中で蒸着を行なうこと
により蒸着膜成長に対して残留ガスの影響を少なくでき
る効果を有するものである。
As explained above, since the present invention directly irradiates the deposition material with an electron beam, cluster ion beam deposition can be performed even on materials with high boiling points and high sublimation points. In addition, since the main body is separated into the evaporation chamber and the evaporation source chamber, exhaust can be performed using separate exhaust systems, and by performing evaporation in an ultra-high vacuum, the influence of residual gas on the growth of the deposited film is reduced. It has the effect that it can.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明のクラスタイオンビーム蒸着装置の構造
概念図、第2図は従来のクラスタイオンビーム蒸着装置
の構造概念図である。 1・・・基板ホルダー、2・・・基板、3・・・シャッ
ター、4・・・イオン加速用電極、5・・・イオン化用
電子放出フィラメント、6・・・イオン化用電子引き出
しグリッド、7・・・噴射ノズル、8・・・るつぼ、9
・・・蒸着物質、lO・・・るつぼ加熱用電子放出フィ
ラメント、11・・・真空排気系、12・・・シャッタ
ー兼用パルプ、13・・・電子ビーム加熱装置、14・
・・蒸着室、15・・・空間部、16・・・蒸発源室 特許出願人 日本電気株式会社
FIG. 1 is a conceptual diagram of the structure of a cluster ion beam evaporation apparatus according to the present invention, and FIG. 2 is a conceptual diagram of the structure of a conventional cluster ion beam evaporation apparatus. DESCRIPTION OF SYMBOLS 1... Substrate holder, 2... Substrate, 3... Shutter, 4... Electrode for ion acceleration, 5... Electron emission filament for ionization, 6... Electron extraction grid for ionization, 7... ... Injection nozzle, 8 ... Crucible, 9
. . . Vapor deposition substance, lO . . . Electron emitting filament for heating the crucible, 11.
... Vapor deposition chamber, 15... Space section, 16... Evaporation source chamber Patent applicant NEC Corporation

Claims (1)

【特許請求の範囲】[Claims] (1)装置本体内に、蒸着用基板を収容する蒸着室と、
蒸発物質を蒸発させる電子ビーム加熱装置を設置した蒸
発源室とを区画形成し、両室を隔離する隔壁に蒸発物質
を蒸着室内に噴出する噴射ノズルを開口するとともに、
該噴射ノズルを開閉するシャッター兼用パルプを隔壁に
設けたことを特徴とするクラスタイオンビーム蒸着装置
(1) A vapor deposition chamber that accommodates a substrate for vapor deposition within the apparatus main body;
An evaporation source chamber is partitioned into an evaporation source chamber in which an electron beam heating device for evaporating the evaporation material is installed, and an injection nozzle for ejecting the evaporation material into the evaporation chamber is opened in a partition wall separating both chambers.
A cluster ion beam evaporation apparatus characterized in that a partition wall is provided with a pulp that also serves as a shutter for opening and closing the injection nozzle.
JP9941384A 1984-05-17 1984-05-17 Cluster ion beam evaporation device Pending JPS60244018A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9941384A JPS60244018A (en) 1984-05-17 1984-05-17 Cluster ion beam evaporation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9941384A JPS60244018A (en) 1984-05-17 1984-05-17 Cluster ion beam evaporation device

Publications (1)

Publication Number Publication Date
JPS60244018A true JPS60244018A (en) 1985-12-03

Family

ID=14246789

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9941384A Pending JPS60244018A (en) 1984-05-17 1984-05-17 Cluster ion beam evaporation device

Country Status (1)

Country Link
JP (1) JPS60244018A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5025751A (en) * 1988-02-08 1991-06-25 Hitachi, Ltd. Solid film growth apparatus
US5099791A (en) * 1989-09-08 1992-03-31 Mitsubishi Denki Kabushiki Kaisha Cluster beam thin film deposition apparatus with thermionic electron control

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5025751A (en) * 1988-02-08 1991-06-25 Hitachi, Ltd. Solid film growth apparatus
US5099791A (en) * 1989-09-08 1992-03-31 Mitsubishi Denki Kabushiki Kaisha Cluster beam thin film deposition apparatus with thermionic electron control

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