JPS60228070A - Both sides polishing machine - Google Patents

Abstract

PURPOSE:To provide mirroring surfaces which have a high flatness and whose peripheral edges are less rounded, by fixing fine abrasive grains on a polyester film to manufacture a polishing film, sticking such polishing films to surface plates of metal or ceramic, and moving the surface plates relative to the object surfaces while supplying a polishing liquid thereto. CONSTITUTION:Four or five carriers 4 for rotating a workpiece 3 and a center gear 12 and an internal gear 13 for causing the carriers to perform a planetary motion are disposed between an upper and a lower surface plates 1, 2 which are made of stainless steel at a diameter of 24 inches and have cooling holes 11 inside and cross-cut grooves on the surfaces. Polishing films 8, 9 are stuck to the surface of the surface plates 1, 2. To manufacture the polishing films 8, 9, abrasive alumina grains of #8,000 in size are fixed to polyester films of 1mil in thickness. A polishing liquid supply section 10 is also provided in a both-side polishing machine. Recesses with scores of microns in depth are made on the films 8, 9 because of the grooves of the surface plates 1, 2. When both the sides of an aluminum disk with a thickness of 2mm. are polished under pressure of 30kg/cm<2> while a polishing liquid is supplied to cool the upper and the lower surface plates by water, the sides having an unpolished surface roughness of 2-3mum are changed to mirroring surfaces which have a roughness of 0.01mum Ra or less and whose peripheral edges are less rounded.

Description

【発明の詳細な説明】 〔発明の利用分野〕 本発明は、ウェーハ、磁気ディスク、水晶振ｉ動板など
の薄板材の両面研摩装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a double-sided polishing apparatus for thin plate materials such as wafers, magnetic disks, and crystal i-diaphragm plates.

〔発明の背景〕[Background of the invention]

従来の両面研摩装置を図に従って説明する。 A conventional double-sided polishing device will be explained according to the drawings.

第１図は両面ラップ盤と呼ばれ、鋳鉄やその他の金属の
上、下定盤１，２とそれぞれの定盤の間に、加工物３を
配置したキャリア４をはさみ、それぞれを相対運動させ
、遊離砥粒を分散させた研摩剤５を供給しながら加工物
５の両面をラッピングする装置であり、また第２図は両
面ボリシ盤と呼ばれ、前記上、下定盤の表面にボリシン
グクロス６，７を張り付け、加工物５およびキャリア４
をはさみ、ラッピングと同様に両面を研摩する装置であ
る。両面ラッピングでは、平面度が良く、周辺部ブレが
少なく形状精度の良い加工面を得る加工法であるが、加
工時間とともに上、下定盤の形状精度が劣化し、このた
め定期的に定盤修正作業を必要とし、研摩作業を中断し
なげればならない。また遊離砥粒を用い、砥粒の転動作
用による加工が主となる加工機構であるので、加工面が
梨地面となり鏡面が得にく（、また遊離砥粒を分散させ
研摩剤を作成する作業が必要であり、さらに研摩剤の飛
散等で作業環境が悪い。Figure 1 is called a double-sided lapping machine, in which a carrier 4 on which a workpiece 3 is placed is sandwiched between upper and lower surface plates 1 and 2 of cast iron or other metals, and the workpiece 3 is moved relative to each other. This is a device that laps both sides of a workpiece 5 while supplying an abrasive agent 5 in which free abrasive grains are dispersed. Also, the device shown in FIG. , 7, workpiece 5 and carrier 4
This is a device that grips the paper and polishes both sides, similar to lapping. Double-sided lapping is a processing method that produces a machined surface with good flatness and less peripheral wobbling, but the shape accuracy of the upper and lower surface plates deteriorates with processing time, and as a result, the surface plates must be periodically corrected. operation is required, and the polishing operation must be interrupted. In addition, since the machining mechanism uses free abrasive grains and is mainly processed by the rolling action of the abrasive grains, the machined surface becomes a matte surface, making it difficult to obtain a mirror surface (also, the free abrasive grains are dispersed to create an abrasive). It requires a lot of work, and the work environment is bad because of the scattering of abrasives.

両面ボリシングでは、一般的にラッピングに較べ表面粗
さは良く、鏡面を得る加工法であイが、上、下定盤に張
りつけたボリシング、クロスは人工皮革や繊維から構成
され、厚さが０．５〜’１ｒｎｉｎの弾性体であり、こ
の弾性変形によつ℃。Double-sided borising generally has a better surface roughness than wrapping, and is a processing method that produces a mirror surface. However, the borising and cloth attached to the upper and lower surface plates are made of artificial leather or fibers, and have a thickness of 0.5 mm. It is an elastic body with a temperature of 5 to 1 rnin, and due to this elastic deformation,

加工物の周辺部ダレが大きく生じやす（、平面度の良い
加工面を得ることが難しい。また、加工物の被加工面が
大きくなると、ポリシング。Large sagging occurs around the workpiece (and it is difficult to obtain a machined surface with good flatness. Also, when the workpiece surface becomes large, polishing is necessary.

クロスと加工面との間に新しい遊離砥粒が介在４しに（
＜、加工面にはオレンジビールなどの欠陥が生じやす（
なる。New free abrasive grains are interposed between the cloth and the machined surface (4).
＜, Processed surfaces are prone to defects such as orange beer (
Become.

さらに、研摩剤の供給方法は、上定盤を通し、上、下定
盤の間に供給するが、遊離砥粒が下足。Furthermore, the abrasive is supplied through the upper surface plate and between the upper and lower surface plates, but free abrasive grains are present at the bottom.

盤の表面に蓄積され、加工物の両面に対する作。Accumulates on the surface of the plate and acts on both sides of the workpiece.

用砥粒数が異なるため、加工物の両面で加工量。Since the number of abrasive grains used is different, the amount of processing on both sides of the workpiece.

差が生じる欠点がある。There are drawbacks that make a difference.

〔発明の目的〕[Purpose of the invention]

本発明の目的は、上記した従来技術の欠点をな（し、周
辺部ダレの少ない高度な平面度かつスクラッチやオレン
ジビールなどの表面欠陥のない鏡面を得る、薄板平板の
両面を同時に研摩、。The object of the present invention is to simultaneously polish both sides of a thin plate to obtain a mirror surface with a high level of flatness with little peripheral sagging and no surface defects such as scratches or orange beer.

する装置を提供するにある。The purpose is to provide equipment for

〔発明の概要〕[Summary of the invention]

本発明は、加工面の周辺部ダレを防ぎ、鏡面を得るため
、微細砥粒な数十μｍの厚さのポリエステルフィルムに
固着した研摩フィルムを平面形状に加工した金属定盤あ
るいはセラミック定盤に張り付け、研摩液を供給しなが
らそれぞＦの上、下定盤および加工物、キャリアを相対
幻勅させ薄板平板の両面を研摩する。更に上、］定盤に
は、加工中の温度上昇による平面度劣化を防ぐため冷却
機能を具備し、また研摩フィＡムからの脱落砥粒や研摩
屑を排除するためにクロスカットあるいは放射状に溝を
形成する。In order to prevent the periphery of the machined surface from sagging and obtain a mirror surface, the present invention uses an abrasive film fixed to a polyester film with a thickness of several tens of micrometers containing fine abrasive grains and a metal surface plate or a ceramic surface plate that is processed into a flat shape. Both sides of the thin plate are polished by moving the upper and lower surface plates of F, the workpiece, and the carrier relative to each other while applying and supplying polishing liquid. Furthermore,] the surface plate is equipped with a cooling function to prevent flatness from deteriorating due to temperature rise during processing, and is equipped with a cross-cut or radial pattern to eliminate abrasive grains and abrasive debris that fall off from the polishing film. Form a groove.

上記した薄い研摩フィルムを張りつけた上。The thin abrasive film mentioned above was pasted on top.

下定盤を用いることによって、加工面は鏡面を得、また
周辺部ダレの少ない高度な平面度を携る。また従来の遊
離砥粒にかわって微細砥粒な固着した固定砥粒を用いる
ので、オレンジピールの発生がほとんどない良好な加工
面を得る。By using the lower surface plate, the machined surface has a mirror surface and has a high level of flatness with little sagging around the edges. Furthermore, since fine abrasive fixed fixed abrasive grains are used instead of conventional free abrasive grains, a good machined surface with almost no orange peel is obtained.

また研摩フィルムの劣化による工具交換は研摩フィルム
を張り換えるだけで良く、定盤の平面度劣化を防ぐ。さ
らには、固定砥粒な用（・るので従来の遊離砥粒な研摩
液忙分散した研摩剤を必要とせず研摩液のみの供給で良
く、加工物の両面で均一な加工量を得る。In addition, when replacing the tool due to deterioration of the abrasive film, it is sufficient to simply replace the abrasive film, which prevents deterioration of the flatness of the surface plate. Furthermore, since it uses fixed abrasive grains, there is no need for the conventional free abrasive abrasive dispersed in the polishing liquid, and only the polishing liquid can be supplied, resulting in a uniform processing amount on both sides of the workpiece.

〔発明の実施例〕[Embodiments of the invention]

実施例を図に従って説明する。第５図は本発明の一実施
例を示す両面研摩機の断面図である。An example will be explained according to the drawings. FIG. 5 is a sectional view of a double-sided sander showing an embodiment of the present invention.

冷却孔１１を内蔵し、クロスカットの溝を表面に形成し
た径２４インチのステンレス製の上、下定盤１，２これ
らの定盤の間に配置し、加工物５を回転駆動させる４〜
５個のキャリア４、これら。Upper and lower surface plates 1 and 2 made of stainless steel with a diameter of 24 inches have built-in cooling holes 11 and cross-cut grooves formed on their surfaces.
5 carriers 4, these.

のキャリア４を遊星運動させるセンタキア１２゜インタ
ーナルギア１５．また上、下定盤１．２の表面に張り付
けた研摩フィルム８，９およヒ研摩ｉ供給部１０から成
る両面研摩機において、粒度−＃８０００のアルミナ砥
粒を＋ＭＩＬのポリエステルフィルムに固着した研摩フ
ィルム８，９を上、下定盤に張り付けた。このとき、研
摩フィルムは第４図に示すごとく定盤の溝によって数十
μ扉の凹部が存在した。研摩圧５０奉にて研摩液を供給
し、上、下定盤を水冷させながら板厚２ｒＩＬｒｎのア
ルミ円板を両面研摩した。前加工面粗さ２〜５μｍの加
工面に対し、周辺部ダレが少なく、平面度の高い、表面
粗さ０．０１μｍ７ＬＲα以下の鏡面を得た。Sentakia 12° internal gear 15. In addition, in a double-sided polishing machine consisting of polishing films 8, 9 attached to the surfaces of upper and lower surface plates 1.2 and a polishing i supply section 10, alumina abrasive grains with a particle size of -#8000 are fixed to a polyester film of +MIL. Films 8 and 9 were pasted on the upper and lower surface plates. At this time, as shown in FIG. 4, the polishing film had recesses of several tens of microns due to the grooves of the surface plate. A polishing liquid was supplied at a polishing pressure of 50 mm, and both sides of an aluminum disk having a thickness of 2rILrn were polished while cooling the upper and lower surface plates with water. For a processed surface with a pre-processed surface roughness of 2 to 5 μm, a mirror surface with less peripheral sagging and high flatness and a surface roughness of 0.01 μm 7LRα or less was obtained.

比較例：厚さ１．４ｍｍのポリシングクロスを上、下定
盤に張り付け、粒径１．０μｍ以下の微細粒子を水溶性
研摩液に分散させた研摩剤を供給しながら、実施例１と
同一条件でボリシングした結果、加工面にはオレンジピ
ールの表面欠陥が生じやすく、周辺部ダレも大きく、平
面度も実施例に較べ約２倍以上となった。Comparative example: Polishing cloth with a thickness of 1.4 mm was attached to the upper and lower surface plates, and the conditions were the same as in Example 1, while supplying an abrasive agent in which fine particles with a particle size of 1.0 μm or less were dispersed in a water-soluble polishing liquid. As a result of the boring process, orange peel surface defects were likely to occur on the machined surface, sag in the peripheral area was large, and the flatness was approximately twice as high as in the example.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明によれば、数十μｍのポリエ
ステルフィルムに微細砥粒を固着した研摩フィルムを、
冷却機能を内蔵し、表面に溝を形成した上、下定盤に張
り付け、薄板平板を両面研摩することによって、従来の
ボリシングクロスを用いた両面研摩法と較べ、周辺部ダ
レが少な（、平面度が向上し、しかも加工能率良（鏡面
を得ることができる。また固定砥粒の研。As explained above, according to the present invention, an abrasive film in which fine abrasive grains are fixed to a polyester film of several tens of μm,
By polishing both sides of a thin flat plate with a built-in cooling function and attaching it to the upper and lower surface plates with grooves formed on its surface, there is less sag on the periphery (than In addition, the processing efficiency is improved (a mirror surface can be obtained. Also, fixed abrasive polishing.

摩フィルムを用いるので、研摩液を供給するだけで良く
、従来の遊離砥粒を分散させ、凝集さ。Since it uses a polishing film, all you need to do is supply the polishing liquid, and the conventional free abrasive grains are dispersed and aggregated.

せずに加工機まで供給する手段が不要となり、しかも加
工面精度においても砥粒の転動作用によるオレンジピー
ルの発生を非常に少なくする。This eliminates the need for a means to feed the abrasive grains to the processing machine, and in terms of machined surface accuracy, the occurrence of orange peel due to the rolling action of the abrasive grains is greatly reduced.

ことができ、また加工物の両面で加工量が均一となる。In addition, the amount of processing becomes uniform on both sides of the workpiece.

また、両面ラッピングの場合に必要である定。It is also necessary for double-sided wrapping.

盤修正作業が不要であり、常に高精度な加工面。There is no need for board correction work, and the machined surface is always highly accurate.

精度を得ることができる。Accuracy can be obtained.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、従来の両面ラップ盤の概略図、第２図は従来
の両面ポリシ盤の概略図、第５図は本発明による研摩フ
ィルムを用いた両面研摩装置の概略図、第４図は上、下
定盤に研摩フィルムを張りつけた状態の断面図である。 ８．９・・・研摩フィルム １０・・・研摩液供給部 １１・・・冷却孔 １２・・・センターギア １５・・・インターナルギア 第　１　図 第　２　口 埠　３　図FIG. 1 is a schematic diagram of a conventional double-sided lapping machine, FIG. 2 is a schematic diagram of a conventional double-sided polishing machine, FIG. 5 is a schematic diagram of a double-sided polishing apparatus using an abrasive film according to the present invention, and FIG. FIG. 3 is a cross-sectional view of the upper and lower surface plates with abrasive films attached thereto. 8.9...Abrasive film 10...Abrasive liquid supply section 11...Cooling hole 12...Center gear 15...Internal gear Fig. 1 Fig. 2 Pier 3 Fig.

Claims (1)

【特許請求の範囲】[Claims] 冷却用空孔部を有し、且つ相対する表面にクロスカット
あるいは放射状の溝を形成し、更に微細砥粒を数十μｍ
厚のポリエステル上に固着した研摩フィルムを表面に張
り付けた上、下定盤を設け、試料に研摩液を供給する供
給部を設け、上記上、下定盤の間に試料およびキャリア
を介し、上、下定盤およびキャリアを回転させながら試
料の両面を研摩するように構成したことを特徴とする両
面研摩装置。It has cooling holes, crosscuts or radial grooves are formed on the opposing surfaces, and fine abrasive grains are added to the surface of several tens of micrometers.
An abrasive film fixed on thick polyester is attached to the surface, and a lower surface plate is provided, and a supply section is provided to supply polishing liquid to the sample. A double-sided polishing device characterized by being configured to polish both sides of a sample while rotating a disk and a carrier.