JPS60224209A - Manufacture of chip inductor - Google Patents
Manufacture of chip inductorInfo
- Publication number
- JPS60224209A JPS60224209A JP8045284A JP8045284A JPS60224209A JP S60224209 A JPS60224209 A JP S60224209A JP 8045284 A JP8045284 A JP 8045284A JP 8045284 A JP8045284 A JP 8045284A JP S60224209 A JPS60224209 A JP S60224209A
- Authority
- JP
- Japan
- Prior art keywords
- coated copper
- copper wire
- metal plate
- electrode
- plate terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/10—Connecting leads to windings
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は各種電子機器に利用されるチップインダクタの
製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method of manufacturing chip inductors used in various electronic devices.
従来例の構成とその問題点
各種電子機器の小型、薄型化が半導体技術の進展と種々
のチップ部品の出現及び高密度実装技術によシなされて
おシ、今後ます捷す小型化が重要視され、あらゆる部品
が、リードレス チップ部品に置き替えられる傾向にあ
る。従って電子部品業界等では従来のリード端子を用い
た部品の接続方法に代る各種チップ部品の形態に適した
新しい接合方法の確立が望まれている。Conventional configurations and their problems The miniaturization and thinning of various electronic devices have been made possible by the progress of semiconductor technology, the appearance of various chip components, and high-density packaging technology, and miniaturization will become more important in the future. The trend is for all components to be replaced with leadless chip components. Therefore, in the electronic parts industry, it is desired to establish a new joining method suitable for various types of chip parts, instead of the conventional method of connecting parts using lead terminals.
ここで、被膜銅線を接合するものとして、小型の固定イ
ンダクターを例にと９、以下図面を参照しながら従来の
被膜銅線の接合工法について説明する。Here, a conventional method for bonding coated copper wires will be described below with reference to the drawings, using a small fixed inductor as an example for bonding coated copper wires.
第１図は、固定インダクターのリード端子にコイルの被
膜銅線をディップ半田付けにより接合する様子を示す斜
視図である。同図中、１はフェライトコア、２はフェラ
イトコア１に被膜銅線を巻回したコイノペ３はフェライ
トコア１の端面に片端を固定したリード端子、４は半田
デイツプ槽、５は溶融半田である。FIG. 1 is a perspective view showing how a coated copper wire of a coil is joined to a lead terminal of a fixed inductor by dip soldering. In the figure, 1 is a ferrite core, 2 is a ferrite core 1 with a coated copper wire wound around it, and 3 is a lead terminal with one end fixed to the end face of the ferrite core 1, 4 is a solder dip tank, and 5 is molten solder. .
このような構成の固定インダクターではリード端子３に
コイル２の被膜銅線両端部をそれぞれ数回巻き付け、約
４００℃付近の高温で溶融された半田５の中へリード端
子３と共に前記被膜銅線の巻付部を数秒間浸種させるこ
とにより被膜銅線の絶縁被膜を高温の溶融半田６の熱で
破壊すると共に銅線とリード端子３を半田接続している
。In a fixed inductor having such a structure, both ends of the coated copper wire of the coil 2 are wound around the lead terminal 3 several times, and the coated copper wire is inserted together with the lead terminal 3 into the solder 5 which is melted at a high temperature around 400°C. By seed-immersing the wound portion for several seconds, the insulation coating of the coated copper wire is destroyed by the heat of the high temperature molten solder 6, and the copper wire and the lead terminal 3 are connected by solder.
しかしながら、上記のような方法においては、被膜銅線
の線径が細い場合、高温の半田ディツプ＠４の中に浸積
させると溶融半田５中に被膜銅線の芯線の銅が析出し、
線径か細くなるという現象が起こることやチップ部品で
は接合場所を超小型化を達成するために構造上の制約に
より半田デイツプ槽４の中に浸積させることが困難であ
るという問題点を有していた。However, in the above method, when the wire diameter of the coated copper wire is small, when it is immersed in the high temperature solder dip @ 4, the copper of the core wire of the coated copper wire is precipitated in the molten solder 5.
There are problems in that the wire diameter decreases, and in the case of chip parts, it is difficult to immerse the solder into the solder dip tank 4 due to structural constraints in order to achieve ultra-miniaturization of the bonding location. was.
発明の目的
本発明は、細い線径の被膜銅線と金属板端子とを微少面
積でかつ高信頼性をもって接続し、合わせて量産性に富
むチップインダクタの製造方法を提供することを目的と
するものである。OBJECTS OF THE INVENTION An object of the present invention is to provide a method for manufacturing a chip inductor that connects a coated copper wire with a small diameter and a metal plate terminal in a small area with high reliability, and is also highly suitable for mass production. It is something.
発明の構成
上記目的を達成するために本発明のチップインダクタの
製造方法は、被膜銅線を巻回したコイル部分を、金属板
端子上に固着するとともに、前記被膜銅線の端末を金属
板端子に設けた接続箇所に沿わし、この接続箇所を１対
の溶接電極で挟み、被膜銅線に接した側の溶接電極を加
熱させ、その熱により被膜銅線の絶縁被膜を破壊した後
、溶接電極間に電流を通じる事により溶接を行うように
構成したものであシ、これによシ、被膜銅線と金属板端
子とを機械的かつ電気的に接続することが可能となるも
のである。Structure of the Invention In order to achieve the above object, the method for manufacturing a chip inductor of the present invention fixes a coil portion wound with a coated copper wire onto a metal plate terminal, and connects an end of the coated copper wire to a metal plate terminal. This connection point is sandwiched between a pair of welding electrodes, and the welding electrode on the side that is in contact with the coated copper wire is heated.The heat destroys the insulation coating of the coated copper wire, and then welding is carried out. It is configured to perform welding by passing a current between the electrodes, thereby making it possible to mechanically and electrically connect the coated copper wire and the metal plate terminal. .
実施例の説明
以下、本発明の一実施例について図面を参照しながら説
明する。DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.
第２図ａは本発明の一実施例における、被膜銅線を巻回
したドラムコアを金属板端子上に固着し前記被膜銅線の
端末を金属板端子に設けた接続箇所に溶接接続している
状態図であり第２図すは溶接接続後の構造図を示す。Figure 2a shows an embodiment of the present invention in which a drum core wound with a coated copper wire is fixed onto a metal plate terminal, and the end of the coated copper wire is welded to a connection point provided on the metal plate terminal. Fig. 2 is a state diagram and shows a structural diagram after welding and connection.
第２図ａにおいて、６はドラムコア、７は被膜銅線を巻
回したコイル部、８は金属板端子、９は一対の溶接電極
のうち被膜銅線１２側に位置した片側の電極（以下第一
電極と記す）、１ｏは金属板端子８側に位置し前記第一
電極８と対をなす他側電極（以下第二電極と記す）、１
１は被膜銅線と金属板端子８の接続部を示したものであ
る。In FIG. 2a, 6 is a drum core, 7 is a coil portion around which coated copper wire is wound, 8 is a metal plate terminal, and 9 is one of the pair of welding electrodes located on the coated copper wire 12 side (hereinafter referred to as 1o is located on the metal plate terminal 8 side and forms a pair with the first electrode 8 (hereinafter referred to as a second electrode), 1
1 shows the connection portion between the coated copper wire and the metal plate terminal 8.
また、第３図は第２図の被膜銅線１２と金属板端子８の
接続部１１の接続方法を示す詳細図である０
第３図において、１２は被膜銅線、１３は金属板端子８
の断面、１４は第一電極９の両端に接続し、第一電極９
を加熱させるための電気エネルギーを与えるトランスを
示す。１５は第一電極９゜第二電極１０間に被膜銅線１
２と金属板端子８を接続するだめの電気エネルギーを与
えるトラン入１６は第一電極９を加熱させるために通じ
る電流の方向を示し、１７は被膜銅線１２と金属板端子
８を接続する溶接電流の方向を示すものである。Moreover, FIG. 3 is a detailed diagram showing the connection method of the connection part 11 between the coated copper wire 12 and the metal plate terminal 8 shown in FIG. 2. In FIG.
The cross section of 14 is connected to both ends of the first electrode 9, and the first electrode 9
Shows a transformer that provides electrical energy to heat the 15 is a coated copper wire 1 between the first electrode 9 and the second electrode 10.
2 and the metal plate terminal 8, the transformer input 16 which provides electrical energy indicates the direction of the current to heat the first electrode 9, and 17 indicates the welding line which connects the coated copper wire 12 and the metal plate terminal 8. It indicates the direction of current.
また第４図ａ −ｃは接続の状態変遷を順を追って示し
た接続箇所の断面図であり、第４図の乙は第一電極９を
加熱直後、第４図すは溶接電流通電直後、第４図Ｃは接
合終了の各状態を示したものである。In addition, Fig. 4 a - c are cross-sectional views of the connection points showing the transition of the connection state in order. FIG. 4C shows each state after the joining is completed.
第４図において、９，１０．１２〜１７は前記記載内容
と同一であシ、１８は被膜銅線１２の芯線部、１９は第
一電極９の加熱により溶融除去された被膜銅線１２の絶
縁被膜部、２０は金属板端子８の基材部、２１は金属板
端子８の半田メッキ層を示している。In FIG. 4, 9, 10, 12 to 17 are the same as described above, 18 is the core wire portion of the coated copper wire 12, and 19 is the core wire portion of the coated copper wire 12 that has been melted and removed by heating the first electrode 9. 20 is a base material portion of the metal plate terminal 8, and 21 is a solder plating layer of the metal plate terminal 8.
以上のように構成した本実施例の被膜銅線１２の接続方
法について以下に説明する。A method of connecting the coated copper wire 12 of this embodiment configured as described above will be described below.
第二電極１ｏの上に接続する金属板端子８を配し、その
接続部位に被膜銅線１２を沿わし、第一電極９を被膜銅
線１２に接触させ一定の圧力を加える。その状態で保持
し、第一電極９に加熱電流１６を通じることにより第一
電極９を加熱させ、その熱で被膜銅線１２の絶縁被膜１
９を破壊すると共に、接合部位の金属板端子８の表面半
田メッキ層２１を溶融除去させる（第４図ａ参照）。た
だし、被膜銅線１２が自然な状態でだんだんつぶれてい
くようにコイル側に位置する第一電極９に少しアールを
取る（第２図ａ参照）。A metal plate terminal 8 to be connected is placed on the second electrode 1o, a coated copper wire 12 is placed along the connection portion, and the first electrode 9 is brought into contact with the coated copper wire 12 to apply a constant pressure. While holding this state, the first electrode 9 is heated by passing a heating current 16 through the first electrode 9, and the heat is used to coat the insulating coating 1 of the coated copper wire 12.
At the same time, the surface solder plating layer 21 of the metal plate terminal 8 at the joint portion is melted and removed (see FIG. 4a). However, the first electrode 9 located on the coil side is slightly rounded so that the coated copper wire 12 gradually collapses in a natural state (see FIG. 2a).
次に第一電極９と第二電極１ｏの間に溶接電流１７を通
じ金属板端子８と被膜銅線１２の芯線部１８を溶接接続
させる。またこの時、溶接電流１７により半田メッキ層
２１が再度溶融し、芯線１８を一部被うようにして半田
付けも同時に行われる（第４ｂ参照）。最後に第１電極
９により接合部に加えていた圧力を除去する（第４図Ｃ
参照）。Next, a welding current 17 is passed between the first electrode 9 and the second electrode 1o to connect the metal plate terminal 8 and the core wire portion 18 of the coated copper wire 12 by welding. Further, at this time, the solder plating layer 21 is melted again by the welding current 17, and soldering is also performed at the same time so as to partially cover the core wire 18 (see 4b). Finally, the pressure applied to the joint by the first electrode 9 is removed (Fig. 4C
reference).
以上のように本実施例によれば、被膜銅線１２に接した
第一電極９を通電加熱し、被膜銅＃Ｊ１２の絶縁被膜１
９を破壊後、芯線１８と金属板端子８に溶接電流を通じ
ることによシ、被膜銅線１２と金属板端子８の接続を実
現している。この後、接続部を含むように外装樹脂でモ
ールドすることによシチップインダクタが完成する。As described above, according to this embodiment, the first electrode 9 in contact with the coated copper wire 12 is electrically heated and the insulation coating 1 of the coated copper #J12 is heated.
After breaking the wire 9, a welding current is passed between the core wire 18 and the metal plate terminal 8, thereby realizing the connection between the coated copper wire 12 and the metal plate terminal 8. Thereafter, the chip inductor is completed by molding with exterior resin so as to include the connection portion.
次に、本発明の他の実施例について説明する。Next, other embodiments of the present invention will be described.
前記の第一電極９は加熱電流１６を通じることにより加
熱し被膜銅線１２の絶縁被膜１９を破壊する方法を取っ
ているが、これに限定されるものではなく、常時加熱し
ている発熱体を第一電極９に接触させることによシ加熱
し被膜銅線１２の絶縁被膜１９を破壊する等、第一電極
９を加熱させる機能を有するものであれば良い。The first electrode 9 is heated by passing a heating current 16 through it to destroy the insulating coating 19 of the coated copper wire 12, but the method is not limited to this method. Any material may be used as long as it has a function of heating the first electrode 9, such as by heating it by bringing it into contact with the first electrode 9 to destroy the insulation coating 19 of the coated copper wire 12.
発明の効果
以上の説明から明らかなように、本発明はチップインダ
クタの製造方法において、被膜銅線と金属板端子を接続
する際、金属板端子に被膜銅線を沿わし一対の溶接電極
で挾み、被膜銅線に接した電極を加熱することにより絶
縁被膜を破壊し真線と金属板端子を溶接接続する方法で
あるので微少面積で接合が可能で、金属板端子形状に左
右されず、任意の箇所で接続ができること及び被膜銅線
の芯線部である銅の半田中への析出現象も無いため極細
線の接合が可能であシ金属板端子を有するチップ部品の
接合に適している。また金属板端子は回路基板実装時に
半田付が必要なことから、かなシ厚い半田メッキを施す
場合が多く、この半田メッキ層は溶接接続の信頼性を低
下させるものであるが、本発明では被膜銅線の絶縁被膜
破壊時に、尚半田メッキ層の半田を一部除去しているた
め溶接接合の信頼性も高い。合わせて、接合部位におい
て、被膜銅線を金属板端子に巻き付ける必要はなく沿わ
せるのみで良いという利点を有しているので極めて生産
性が良いという効果が得られる。Effects of the Invention As is clear from the above description, the present invention provides a method for manufacturing a chip inductor in which, when connecting a coated copper wire and a metal plate terminal, the coated copper wire is run along the metal plate terminal and sandwiched between a pair of welding electrodes. This method destroys the insulation coating by heating the electrode in contact with the coated copper wire and welds the true wire to the metal plate terminal, so it can be joined in a small area and is not affected by the shape of the metal plate terminal. Since connection can be made at any location and there is no precipitation of copper, which is the core wire of the coated copper wire, into the solder, it is possible to join ultra-fine wires and is suitable for joining chip parts having metal plate terminals. In addition, since metal plate terminals require soldering when mounted on a circuit board, they are often coated with thick solder plating, and this solder plating layer reduces the reliability of welded connections. When the insulation coating of the copper wire breaks down, part of the solder in the solder plating layer is removed, so the reliability of the welded joint is high. In addition, there is an advantage that the coated copper wire does not need to be wound around the metal plate terminal at the joining site, but only needs to be laid along the metal plate terminal, resulting in extremely high productivity.
第１図は従来の固定インダクターのリード端子にコイル
の被膜銅線をディップ半田付けによシ接合する様子を示
した斜視図、第２図ａ、ｂは本発明の一実施例のコイル
製造方法における被膜銅線を巻回したコイル部と金属板
端子とを溶接接続する工程の斜視図、第３図は第２図の
接続方法を示す詳細図、第４図ａ ％ ａは接続の状態
変遷を順を追って示した接続箇所の断面図である。
６・・・・・・フェライトコア、７・・・・・・コイル
Ｓ、ａ−・・・・・金属板端子、９・・・・・・第一電
極、１ｏ・・・・・・第二電極、１１・・・・・・接続
部、１２・・・・・・被膜銅線、１３・・・・・・金属
板端子の断面、１４・・・・・・トランス、１６・・・
・・・トランス、１６・・・・・・電流の方向、１７・
・・・・・溶接電流の方向、１８・・・・・・芯線部、
１９・・・・・・絶縁被膜部、２ｏ・・・・・・基材部
、２１・・・・・・半田メッキ層〇代理人の氏名 弁理
士 中 尾 敏 男 ほか１名第１図
第２図
ｑ
第３図
４Fig. 1 is a perspective view showing how the coated copper wire of a coil is joined to the lead terminal of a conventional fixed inductor by dip soldering, and Fig. 2 a and b are a method of manufacturing a coil according to an embodiment of the present invention. A perspective view of the process of welding and connecting a coil part wound with coated copper wire and a metal plate terminal in Figure 3 is a detailed view showing the connection method of Figure 2, Figure 4a is a diagram showing changes in connection status. FIG. 6... Ferrite core, 7... Coil S, a-... Metal plate terminal, 9... First electrode, 1o... Number Two electrodes, 11... Connection portion, 12... Coated copper wire, 13... Cross section of metal plate terminal, 14... Transformer, 16...
...Transformer, 16...Direction of current, 17.
... Direction of welding current, 18 ... Core wire part,
19: Insulating coating portion, 2o: Base material portion, 21: Solder plating layer Name of agent: Patent attorney Toshio Nakao and one other person Figure 1 Figure 2 q Figure 3 4
Claims (1)
子に固着するとともに、前記被膜銅線の端末を金属板端
子に設けた接合箇所に沿わし、この接合箇所を一対の溶
接電極で挟み、被膜銅線に接した側の溶接電極を加熱さ
せ、その熱により被膜銅線の絶縁被膜を破壊した後、溶
接電極間に電流を通じることにより溶接を行い金属板端
子と導線とを接合することを特徴としたチップインダク
タの製造方法。A coil portion in which a coated copper wire is wound around a magnetic core is fixed to a pair of metal plate terminals, and the end of the coated copper wire is placed along a joint provided on the metal plate terminal, and this joint is connected to a pair of welding electrodes. The welding electrode on the side that was in contact with the coated copper wire is heated, the insulation coating of the coated copper wire is destroyed by the heat, and then welding is performed by passing a current between the welding electrodes to connect the metal plate terminal and the conducting wire. A method for manufacturing a chip inductor characterized by bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59080452A JPH0736373B2 (en) | 1984-04-20 | 1984-04-20 | Chip inductor manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59080452A JPH0736373B2 (en) | 1984-04-20 | 1984-04-20 | Chip inductor manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60224209A true JPS60224209A (en) | 1985-11-08 |
| JPH0736373B2 JPH0736373B2 (en) | 1995-04-19 |
Family
ID=13718647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59080452A Expired - Lifetime JPH0736373B2 (en) | 1984-04-20 | 1984-04-20 | Chip inductor manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0736373B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6453783A (en) * | 1987-08-25 | 1989-03-01 | Miyachi Electric Co | Method for joining covered wires |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5310053A (en) * | 1976-07-15 | 1978-01-30 | Hitachi Shomei Kk | Method of manufacturing coil device |
| JPS5411487A (en) * | 1977-06-28 | 1979-01-27 | Matsushita Electric Ind Co Ltd | Lead conductor welding |
| JPS5538072A (en) * | 1978-09-12 | 1980-03-17 | Citizen Watch Co Ltd | Terminal treatment of coil lead and its structure |
| JPS571213A (en) * | 1980-06-03 | 1982-01-06 | Omron Tateisi Electronics Co | Treating method for terminal of coil |
| JPS5942008U (en) * | 1982-09-09 | 1984-03-17 | 株式会社村田製作所 | chip inductor |
-
1984
- 1984-04-20 JP JP59080452A patent/JPH0736373B2/en not_active Expired - Lifetime
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5310053A (en) * | 1976-07-15 | 1978-01-30 | Hitachi Shomei Kk | Method of manufacturing coil device |
| JPS5411487A (en) * | 1977-06-28 | 1979-01-27 | Matsushita Electric Ind Co Ltd | Lead conductor welding |
| JPS5538072A (en) * | 1978-09-12 | 1980-03-17 | Citizen Watch Co Ltd | Terminal treatment of coil lead and its structure |
| JPS571213A (en) * | 1980-06-03 | 1982-01-06 | Omron Tateisi Electronics Co | Treating method for terminal of coil |
| JPS5942008U (en) * | 1982-09-09 | 1984-03-17 | 株式会社村田製作所 | chip inductor |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6453783A (en) * | 1987-08-25 | 1989-03-01 | Miyachi Electric Co | Method for joining covered wires |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0736373B2 (en) | 1995-04-19 |
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