JPS60187555U - Mounting structure of hybrid integrated circuit - Google Patents
Mounting structure of hybrid integrated circuitInfo
- Publication number
- JPS60187555U JPS60187555U JP7464884U JP7464884U JPS60187555U JP S60187555 U JPS60187555 U JP S60187555U JP 7464884 U JP7464884 U JP 7464884U JP 7464884 U JP7464884 U JP 7464884U JP S60187555 U JPS60187555 U JP S60187555U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- mounting structure
- metal case
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の混成集積回路の実施例を示す断面図、第
２図は本考案の一実施例を示す断面図、第３図、第４図
、第５図は第２図のシールド板の３例を示す斜視図であ
る。図において、１・・・・・・混成集積回路、２・・
曲金属ケース、２′・・・・・・すき間、３・・・・・
・プリント基板、４・・・・・・突起部、５・・・・・
・リード、６・・・・・・シールド板、７・・曲挿入穴
、８，９・・・・・・リード挿入穴である。Figure 1 is a sectional view showing an embodiment of a conventional hybrid integrated circuit, Figure 2 is a sectional view showing an embodiment of the present invention, and Figures 3, 4, and 5 are the shield plates of Figure 2. It is a perspective view which shows three examples. In the figure, 1... hybrid integrated circuit, 2...
Bent metal case, 2'...Gap, 3...
・Printed circuit board, 4...Protrusion, 5...
・Lead, 6... Shield plate, 7... Curved insertion hole, 8, 9... Lead insertion hole.
Claims (1)
をもつ金属ケースで覆った混成集積回路を設けた混成集
積回路の実施構造において、前記プリント基板と前記金
属ケースとの間に半導電性樹脂または誘電体材料からな
るシールド部材を挿入して、前記金属ケースの開口部を
塞ぐようにしたことを特徴とする混成集積回路の実施構
造。In the implementation structure of a hybrid integrated circuit in which a hybrid integrated circuit is provided on a printed circuit board and covered with a metal case having an opening on the surface facing the printed circuit board, a semiconductive resin is provided between the printed circuit board and the metal case. Alternatively, an implementation structure of a hybrid integrated circuit characterized in that a shield member made of a dielectric material is inserted to close the opening of the metal case.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7464884U JPS60187555U (en) | 1984-05-22 | 1984-05-22 | Mounting structure of hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7464884U JPS60187555U (en) | 1984-05-22 | 1984-05-22 | Mounting structure of hybrid integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60187555U true JPS60187555U (en) | 1985-12-12 |
Family
ID=30615136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7464884U Pending JPS60187555U (en) | 1984-05-22 | 1984-05-22 | Mounting structure of hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60187555U (en) |
-
1984
- 1984-05-22 JP JP7464884U patent/JPS60187555U/en active Pending
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