JPS60184856A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPS60184856A JPS60184856A JP4008684A JP4008684A JPS60184856A JP S60184856 A JPS60184856 A JP S60184856A JP 4008684 A JP4008684 A JP 4008684A JP 4008684 A JP4008684 A JP 4008684A JP S60184856 A JPS60184856 A JP S60184856A
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- thermal head
- protective layer
- glass
- smoothed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims abstract description 31
- 239000011241 protective layer Substances 0.000 claims abstract description 17
- 238000007639 printing Methods 0.000 claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 7
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000010304 firing Methods 0.000 claims description 8
- 230000003746 surface roughness Effects 0.000 claims description 8
- 238000001035 drying Methods 0.000 claims description 6
- 238000005498 polishing Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 abstract description 8
- 238000007650 screen-printing Methods 0.000 abstract description 7
- 238000003825 pressing Methods 0.000 description 9
- 239000010408 film Substances 0.000 description 8
- 239000010410 layer Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009499 grossing Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は、各種情報機器、計測機器、映像処理機器等に
おいて出力装置として多用されるサーマルプリンタ用の
サーマルヘッド、特に発熱用の抵抗体が厚膜型であるサ
ーマルヘッドに関する。Detailed Description of the Invention [Technical Field of the Invention] The present invention relates to a thermal head for a thermal printer, which is often used as an output device in various information equipment, measurement equipment, video processing equipment, etc. This invention relates to a membrane type thermal head.
厚膜型のサーマルヘッドは、形成容易で量産性に富み、
安価であることから、小型プリンタ、ファクシミリ用出
力装置等に利用されている。しかしながら厚膜型のサー
マルヘッドは、抵抗ペーストをスクリーン印刷で塗布し
、これを乾燥・焼成して形成されるので、スクリーンメ
ツシュの影響、印刷後の体積収縮等でその表面に5μI
n程度以上の凹凸(ウネリ)が生じる。Thick-film thermal heads are easy to form and can be mass-produced.
Because it is inexpensive, it is used in small printers, facsimile output devices, etc. However, thick-film thermal heads are formed by applying resistive paste by screen printing, drying and baking it, and due to the influence of the screen mesh and volumetric shrinkage after printing, the surface of
Unevenness (undulations) of approximately n or more occurs.
第1図は斯る従来のサーマルヘッドを示しており、図に
お(・て、1はセラミック等からなる基板、2は該基板
1上に厚膜又は薄膜技術で形成した電極、3は厚膜技術
で形成した発熱用の抵抗体、4は抵抗体3上に印刷・焼
成してなるガラス保護層であり、上述の如く凹凸のある
抵抗体3上のガラス保護層4も同程度の凹凸が生じてい
る。そして、このように表面に比較的大きな凹凸のある
サーマルヘッドを用いた場合、ガラス保護層4に当接す
る感熱紙(もしくは熱転写用インクリボン)と、該ガラ
ス保護層4とは、多数の発熱領域において同一面積・同
一圧力で接触し難く、ために各印刷ドツトが不均一とな
って、印刷品質を低下させるものであった。Figure 1 shows such a conventional thermal head. The heating resistor 4 is formed by film technology, and is a glass protective layer printed and fired on the resistor 3. As mentioned above, the glass protective layer 4 on the resistor 3, which has unevenness, also has the same degree of unevenness. When a thermal head with relatively large irregularities on the surface is used, the thermal paper (or ink ribbon for thermal transfer) that comes into contact with the glass protective layer 4 and the glass protective layer 4 are However, it is difficult to make contact with the same area and the same pressure in a large number of heat-generating areas, resulting in uneven printing dots and deterioration of printing quality.
この点を解消するために、特開昭54−99443号公
報に見られるように、厚膜抵抗材料を印刷・乾燥後に加
圧もしくは機械的に研摩し、然る後焼成して抵抗体表面
を2μn]以下の表面粗さにするという試みもなされて
いる。しかしながら、この先願におけるように単に抵抗
体のみを成る程度平滑しても、その上のガラス層に凹凸
が生じることは避は難く、良好な印字品質を保障するに
は至らぬものであった。何んとなれば、抵抗体上に塗布
されるガラス層はその厚みを15μIn以上とすれば、
塗布(印刷)後の所定時間の常温放置においてその流動
性による所謂”レベリング効果パによって表面の平滑度
を成る程度期待できるが、ガラス層の厚みが増すと今度
は熱応答性(熱伝導特性)が劣下するので、ガラス層の
厚みは実用上10μm以下にせざるを得す、このように
ガラス層を薄くすると前記゛レベリング効果“が期待で
きず、スクリーンメツシュの影響等によって表面に避は
難い凹凸が生じるものであった。In order to solve this problem, as seen in Japanese Patent Application Laid-Open No. 54-99443, a thick film resistor material is printed and dried, then pressurized or mechanically polished, and then fired to improve the surface of the resistor. Attempts have also been made to achieve a surface roughness of 2 μm or less. However, even if only the resistor is smoothed to such an extent as in this prior application, it is inevitable that the glass layer thereon will be uneven, and good printing quality cannot be guaranteed. After all, if the thickness of the glass layer coated on the resistor is 15μIn or more,
When left at room temperature for a predetermined period of time after coating (printing), it can be expected that the surface will become smoother due to the so-called "leveling effect" due to its fluidity, but as the thickness of the glass layer increases, thermal responsiveness (thermal conduction characteristics) will increase. In practical terms, the thickness of the glass layer must be kept at 10 μm or less. If the glass layer is made thin in this way, the above-mentioned "leveling effect" cannot be expected, and there is no possibility of evacuation on the surface due to the influence of the screen mesh, etc. This resulted in difficult unevenness.
従って本発明の目的とするところは、上記従来技術の欠
点を解消し、極めて表面が平滑で、良好な印刷品質が保
障できる厚膜型のサーマルヘッドを提供するにある。Therefore, an object of the present invention is to eliminate the drawbacks of the prior art described above and to provide a thick film type thermal head that has an extremely smooth surface and can ensure good printing quality.
本発明のサーマルヘッドは、上記目的を達成するため、
基板上に印刷・形成され且つその表面が平滑化された抵
抗体上に、ガラスペーストを塗布して乾燥させ、続いて
ガラスペーストを加圧・加熱した後焼成し、その表面粗
さが1μrn以下で膜厚が3〜10μmのガラス保護層
を形成したことを特徴とする。In order to achieve the above object, the thermal head of the present invention has the following features:
A glass paste is applied onto a resistor whose surface has been smoothed and printed on a substrate, and is dried.Then, the glass paste is pressurized and heated, and then fired, so that the surface roughness is 1 μrn or less. It is characterized in that a glass protective layer having a film thickness of 3 to 10 μm is formed.
本願発明者は、種々検討の結果、抵抗体表面を平滑する
と共に、該抵抗体上に塗布(印刷)したガラス層を加圧
・加熱し、然る後焼成することによって、表面が極めて
平滑な(表面粗さが±1μm′ 以下の)サーマルヘッ
ドが得られることを見出した。As a result of various studies, the inventor of the present application has found that the surface of the resistor is extremely smooth by smoothing the surface of the resistor, applying pressure and heating to the glass layer coated (printed) on the resistor, and then firing it. It has been found that a thermal head (with a surface roughness of ±1 μm' or less) can be obtained.
即ち、基板上にスクリーン印刷で形成した抵抗体は、焼
成後15〜40μm厚となるように設定され、100〜
180℃での数分〜数10分程度の乾燥後、プレスによ
る加圧、ローラによる加圧、熱プレスによる加圧・加熱
、或いは機械的研摩によって、その表面が±2μm以下
、望ましくは±1μIn以下に設定される。プレス、又
はローラによる加圧の場合、抵抗体表面と接触する部材
は、その表面粗さが1μm以下(peak−1o−pe
ak )で、プレス用平板の場合その平面度(ウネリ、
ソリ等)が1〜5μmnのものが用意される。そして、
例えばプレス機の場合、その抑圧荷重は1〜100kg
/cnlで数秒〜数分程度加圧され、表面が上記精度に
整形・平滑化される。熱プレスの場合、その押圧部材の
表面は上記の程度の鏡面仕上げしたものが用いられ、金
属又はガラスが選定される。そして、この熱プレスの場
合、抑圧加重1〜100kg/crlで、温度120〜
200℃で数10秒〜数分行なわれ、該熱プレス時にお
ける溶剤の成る程度の除去によって抵抗体表面は平滑・
半硬化され、続(焼成工程での溶剤除去(゛トビ″)に
よる体積収縮の影響が減少することが期待できる。また
、機械的研摩の場合、例えば研摩紙等を用いた研摩治具
とサーマルヘッドとの相対運動(摺動・回転)によって
、研摩が行なわれる。この場合は、研摩後の摩耗粉の除
去が肝要である。そして、上記例れかの手法で表面を平
滑化した後、抵抗体は焼成される。That is, the resistor formed on the substrate by screen printing is set to have a thickness of 15 to 40 μm after firing, and has a thickness of 100 to 40 μm.
After drying at 180°C for several minutes to several tens of minutes, the surface is polished to within ±2 μm, preferably ±1 μIn, by applying pressure with a press, pressure with a roller, pressure/heating with a hot press, or mechanical polishing. It is set as below. In the case of pressurization by a press or roller, the surface roughness of the member that comes into contact with the resistor surface is 1 μm or less (peak-1 o-pe
ak), and in the case of a flat plate for press, its flatness (undulation,
A material with warp, etc.) of 1 to 5 μm is prepared. and,
For example, in the case of a press machine, the suppressing load is 1 to 100 kg.
/cnl for several seconds to several minutes, and the surface is shaped and smoothed to the above precision. In the case of hot press, the surface of the pressing member is mirror-finished to the above-mentioned degree, and metal or glass is selected. In the case of this heat press, the compression load is 1 to 100 kg/crl and the temperature is 120 to 100 kg/crl.
The heat pressing process is carried out at 200°C for several tens of seconds to several minutes, and the surface of the resistor becomes smooth and smooth by removing only a small amount of the solvent during the heat pressing.
It is expected that the effect of volumetric shrinkage due to solvent removal during the subsequent firing process will be reduced.In addition, in the case of mechanical polishing, for example, polishing jig using abrasive paper and thermal Polishing is performed by relative movement (sliding/rotation) with the head. In this case, it is important to remove wear particles after polishing. After smoothing the surface using one of the above methods, The resistor is fired.
抵抗体上に形成されるガラス保護層は、焼成後、3〜1
0μm厚となるように設定され、スクリーン印刷による
塗布後、120〜180℃で3〜15分乾燥され、熱プ
レス、もしくは加熱下における原圧ローラによる加重に
よって、その表面粗さが±1μrn以下となるように整
形・平滑化される。加圧荷重は1〜100kg/dで、
加熱温度120〜200℃で、数秒〜数分行なわれる。The glass protective layer formed on the resistor has a thickness of 3 to 1 after baking.
After coating by screen printing, it is dried for 3 to 15 minutes at 120 to 180°C, and the surface roughness is reduced to ±1 μrn or less by applying heat using a heat press or applying pressure with a pressure roller under heating. It is shaped and smoothed so that it looks like this. Pressure load is 1 to 100 kg/d,
Heating is carried out at a heating temperature of 120 to 200°C for several seconds to several minutes.
なお、ガラス保護層と当接する加圧部材の表面は、前記
抵抗体への加圧の場合と同様のものとされる。Note that the surface of the pressure member that comes into contact with the glass protective layer is the same as in the case of pressurizing the resistor.
そして、上記加圧・加熱の終了後、ガラス保護層をピー
ク温度750〜850℃で5〜lO分間焼成することに
よって、焼成時のレベリング効果と相俟って表面粗さが
±1μIn以下のサーマルヘッドが形成される。After the above-mentioned pressure and heating are completed, the glass protective layer is fired at a peak temperature of 750 to 850°C for 5 to 10 minutes, which combines with the leveling effect during firing to achieve a thermal surface roughness of ±1 μIn or less. A head is formed.
(具体例)
第2図および第4図に示すようにセラミック製の基板1
上に、All系の個別リード電極2A並びに共通電極2
Bを交互に等間隔に、厚膜技術もしくは薄膜技術とホト
プロセス工程によって形成する。該電極2A、2Bの厚
みは3〜5μm1幅は30〜50μInとした。次に、
Rg02系の抵抗ペーストを、前記各電極2A、2Bを
横切るように、スクリーン印刷で300〜400μmの
幅で形成して抵抗体3とした。この抵抗体3の厚みは焼
成後15〜20μIn厚となるように設定した。この抵
抗体3を150℃で10分間乾燥した後、第3図に示す
ような熱プレス機5で、プレス板6を介して20kg/
C/L、温度150°C130秒間加圧・加熱し、表面
を平滑化した。然る後、ピーク温度910℃で6〜8分
焼成した。続いて、抵抗体3上に、5IO2系のガラス
ペーストによってガラス保護層4を焼成後7μmn厚と
なるようにスクリーン印刷で塗布し、150℃で10分
間乾燥させた。(Specific example) As shown in Fig. 2 and Fig. 4, a ceramic substrate 1
Above, All-based individual lead electrode 2A and common electrode 2
The layers B are formed alternately at equal intervals using a thick film technique or a thin film technique and a photoprocessing process. The electrodes 2A and 2B had a thickness of 3 to 5 μm and a width of 30 to 50 μIn. next,
A resistor 3 was formed by screen printing an Rg02-based resistor paste to a width of 300 to 400 μm across each of the electrodes 2A and 2B. The thickness of this resistor 3 was set to be 15 to 20 μIn after firing. After drying this resistor 3 at 150° C. for 10 minutes, it was heated to 20 kg/kg using a heat press machine 5 as shown in FIG. 3 through a press plate 6.
The surface was smoothed by applying pressure and heating at C/L and a temperature of 150° C. for 130 seconds. After that, it was baked at a peak temperature of 910°C for 6 to 8 minutes. Subsequently, a glass protective layer 4 was coated on the resistor 3 by screen printing using a 5IO2-based glass paste so as to have a thickness of 7 μm after firing, and was dried at 150° C. for 10 minutes.
そして、第3図に示した熱プレス機5で、プレス板6を
介して、20kg/、7、温度150°C130秒間加
圧・加熱した。然る後、ガラス保護層4をピーク温度8
00℃で8分間焼成して、第4図のサーマルヘッドを得
た。Then, using the heat press machine 5 shown in FIG. 3, the material was pressed and heated at a pressure of 20 kg/7 at a temperature of 150° C. for 130 seconds via a press plate 6. After that, the glass protective layer 4 is heated to a peak temperature of 8.
The thermal head shown in FIG. 4 was obtained by firing at 00° C. for 8 minutes.
このようにして形成したガラス保護層の表面粗度は第5
図に示したように極めて良好な平滑度を示し、±l /
II Ill以下は勿論、peak−to−peakで
も1μrn以下となり、極めて良好な印字品質をもつこ
とが確認された。The surface roughness of the glass protective layer thus formed was 5th
As shown in the figure, it shows extremely good smoothness, ±l/
It was confirmed that the printing quality was not only less than II Ill but also less than 1 μrn even in peak-to-peak, and had extremely good printing quality.
なお、第4図に示したものは本具体例との対比のために
、具体例と同一条件で抵抗体3を形成した(勿論平滑化
処理をしである)後、ガラス保護層4を具体例と同一条
件で塗付・乾燥させた後、熱プレスなしで焼成したもの
の表面の状態を示しており、具体例の平滑度に比してそ
の表面は粗い。For comparison with this specific example, the resistor 3 shown in FIG. This shows the surface condition of a product that was applied and dried under the same conditions as in the example and then fired without heat pressing, and the surface is rough compared to the smoothness of the specific example.
以上の如く本発明によれば、極めて表面の平滑な厚膜型
のサーマルヘッドを提供でき、良好な印字品質をもつサ
ーマルヘッドを大量、安価に製造できてその価値は高い
。As described above, according to the present invention, a thick film type thermal head with an extremely smooth surface can be provided, and thermal heads with good printing quality can be manufactured in large quantities at low cost, which is of high value.
第1図は従来のサーマルヘッドの断面図、第2図〜第5
図は本発明の具体例に係り、第2図はガラス保護層形成
前のサーマルヘッドの要部平面図、第3図は熱プレス工
程の説明図、第4図は完成後のサーマルヘッドの要部断
面図、第5図は第4図構成のサーマルヘッドの表面(ガ
ラス保護層の表面)の測定結果を示すグラフ図、第6図
は第5図との対比のためにガラス保護層の熱プレスがな
い状態で作成したサーマルヘッドの表面の測定結果を示
すグラフ図である。
1・・・・・・基板
2・・・・・・電極
2A・・・・・・個別リード電極
2B・・・・・・共通電極
3・・・・・・抵抗体
4・・・・ガラス保護層
特許出願人 株式会社コパル
第1図
4
第2図
第3図 第4図Figure 1 is a sectional view of a conventional thermal head, Figures 2 to 5
The figures relate to a specific example of the present invention; FIG. 2 is a plan view of the main parts of the thermal head before the formation of the glass protective layer, FIG. 3 is an explanatory diagram of the heat pressing process, and FIG. 5 is a graph showing the measurement results of the surface of the thermal head (surface of the glass protective layer) with the configuration shown in FIG. 4, and FIG. FIG. 3 is a graph diagram showing the measurement results of the surface of a thermal head created without a press. 1...Substrate 2...Electrode 2A...Individual lead electrode 2B...Common electrode 3...Resistor 4...Glass Protective layer patent applicant Copal Co., Ltd. Figure 1 Figure 4 Figure 2 Figure 3 Figure 4
Claims (4)
された抵抗体上に、ガラスペーストを塗布して乾燥させ
、続いて該ガラスペーストを加圧・加熱した後焼成し、
その表面粗さが1μ!n以下で膜厚が3〜10μIll
のガラス保護層を形成したことを特徴とするサーマルヘ
ッド。(1) Applying a glass paste onto a resistor whose surface has been smoothed and printed on a substrate, drying it, then pressurizing and heating the glass paste, and then firing it;
Its surface roughness is 1μ! The film thickness is 3 to 10 μIll when it is less than n.
A thermal head characterized by forming a glass protective layer.
その表面を平滑化されていることを特徴とする特許請求
の範囲第(1)項記載のサーマルヘッド。(2) The thermal head according to claim (1), wherein the resistor is pressurized to smooth the surface after printing and drying.
徴とする特許請求の範囲第(2)項記載のサーマルヘッ
ド。(3) The thermal head according to claim (2), wherein the pressure applied to the resistor is a heat press.
によってその表面を平滑化されていることを特徴とする
特許請求の範囲第(1)項記載のサーマルヘッド。(4) The thermal head according to claim (1), wherein the surface of the resistor is smoothed by mechanical polishing after printing and drying.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4008684A JPS60184856A (en) | 1984-03-02 | 1984-03-02 | Thermal head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4008684A JPS60184856A (en) | 1984-03-02 | 1984-03-02 | Thermal head |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60184856A true JPS60184856A (en) | 1985-09-20 |
Family
ID=12571079
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4008684A Pending JPS60184856A (en) | 1984-03-02 | 1984-03-02 | Thermal head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60184856A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5234709A (en) * | 1989-08-25 | 1993-08-10 | Seiko Instruments Inc. | Process for producing thermal head |
-
1984
- 1984-03-02 JP JP4008684A patent/JPS60184856A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5234709A (en) * | 1989-08-25 | 1993-08-10 | Seiko Instruments Inc. | Process for producing thermal head |
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