JPS6018289A - Micro-machining method with laser light - Google Patents

Micro-machining method with laser light

Info

Publication number
JPS6018289A
JPS6018289A JP58126184A JP12618483A JPS6018289A JP S6018289 A JPS6018289 A JP S6018289A JP 58126184 A JP58126184 A JP 58126184A JP 12618483 A JP12618483 A JP 12618483A JP S6018289 A JPS6018289 A JP S6018289A
Authority
JP
Japan
Prior art keywords
white
worked
micro
laser
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58126184A
Other languages
Japanese (ja)
Inventor
Kiyoshi Hajikano
初鹿野　清
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP58126184A priority Critical patent/JPS6018289A/en
Publication of JPS6018289A publication Critical patent/JPS6018289A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes

Abstract

PURPOSE:To enable micromachining by interposing a black etching liquid on the surface to be worked of a material to be worked and subjecting said surface to laser beam machining. CONSTITUTION:A white layer 2 is formed of a white tape, white resin, white paint, etc. on the surface of a material 3 to be worked. A groove is formed to the layer 2 and a black etching liquid 4 is run from a vessel 5 into the groove, then the groove is worked by a tip port 1 of a laser. Micromachining of about 0.1micron is thus satisfactorily made possible.

Description

【発明の詳細な説明】 本発明はレーザー加工による微小加工方法に係わるもの
である。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a microfabrication method using laser processing.

レーザー加工方法は光による熱溶融加工であるので、精
密加工特に数ミクロン又は０１ミクロン以下の微小加工
に適さないものとされていた。Since the laser processing method is heat-melting processing using light, it has been considered unsuitable for precision processing, particularly micro processing of several microns or 0.1 microns or less.

しかし、セラミック等の微小加工についてレーザー加工
は有効である。本発明は之等のレーザー加工を微小加工
を可能にする方法を提供するものである。レーザー加工
は瞬時にして、加工物を溶融するものであるから、溶融
したくずを即時に溶かして、加工表面から流出させる作
用を併用することによって、レーザー加工を促進させる
ことができるし、かつそのエツチング加工液を使用する
ことにより微小範囲に限定できるものである。However, laser processing is effective for micro-processing of ceramics and the like. The present invention provides a method that enables such microfabrication by laser processing. Since laser processing instantly melts the workpiece, laser processing can be accelerated by simultaneously melting the molten debris and flowing it out from the processing surface. By using an etching liquid, it can be limited to a minute range.

本発明の詳細な説明する。第１図は本発明に係わる一実
施例の形状図である。１はレーザーの先端口であり、２
は白色の層である。これは白色テープ、白色樹脂、白色
塗料等であり、６は加工物である、４は黒色ｑエツチン
グ液であり、４の黒色のエツチング液は乙の白色の層が
除去されたみそに流れているものである。５の白色の層
を除去する方法として、機械的方法。The present invention will be described in detail. FIG. 1 is a shape diagram of an embodiment according to the present invention. 1 is the tip of the laser, 2
is a white layer. These are white tape, white resin, white paint, etc., 6 is the processed product, 4 is black etching liquid, and the black etching liquid in 4 flows into the miso paste from which the white layer has been removed. It is something that exists. A mechanical method is used to remove the white layer in step 5.

化学的反応による方法等がある。いづれにしても加工す
る表面に黒色のエツチング液を流して、レーザー加工に
よる微細なダスト等を化学的に溶かして加工表面から除
去するものである。There are methods such as chemical reactions. In any case, a black etching solution is poured over the surface to be processed, and fine dust caused by laser processing is chemically dissolved and removed from the processed surface.

５は４のエツチング液を流し込んでいる容器の形状図で
ある。流す方法としてはホースから流し出す竹科々の方
法が採用可能である。5 is a diagram showing the shape of a container into which the etching solution of 4 is poured. As a method of flushing, it is possible to adopt the method of flushing out from a hose.

本発明はレーザー加工にエツチング作用を付加しプζも
ので、エツチング液を黒色Ｋ　Ｌ、たことを特徴とした
もので、十分に０１ミクロン等の微小加工を可能にする
ものである。The present invention is characterized in that an etching action is added to laser processing, and the etching liquid is black (KL), making it possible to perform micro-processing of 0.1 micron or the like.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明に係わる一実施例の形状図である。 １・・・レーザー先端口。２・・白色層。６・・・加工
物。 ４・・・黒イエノチング液。 特許出願人初鹿野　清 第１図FIG. 1 is a shape diagram of an embodiment according to the present invention. 1...Laser tip port. 2. White layer. 6...Processed product. 4...Black enoting liquid. Patent applicant Kiyoshi Hatsushikano Figure 1

Claims (1)

【特許請求の範囲】[Claims] レーザー加工を実施する際に、該加工する面に黒色のエ
ツチング液を介在させることを特徴とするレーザー微細
加工方法。A laser microfabrication method characterized in that a black etching liquid is interposed on the surface to be processed when laser processing is performed.
JP58126184A 1983-07-13 1983-07-13 Micro-machining method with laser light Pending JPS6018289A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58126184A JPS6018289A (en) 1983-07-13 1983-07-13 Micro-machining method with laser light

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58126184A JPS6018289A (en) 1983-07-13 1983-07-13 Micro-machining method with laser light

Publications (1)

Publication Number Publication Date
JPS6018289A true JPS6018289A (en) 1985-01-30

Family

ID=14928764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58126184A Pending JPS6018289A (en) 1983-07-13 1983-07-13 Micro-machining method with laser light

Country Status (1)

Country Link
JP (1) JPS6018289A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7893386B2 (en) 2003-11-14 2011-02-22 Hewlett-Packard Development Company, L.P. Laser micromachining and methods of same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7893386B2 (en) 2003-11-14 2011-02-22 Hewlett-Packard Development Company, L.P. Laser micromachining and methods of same

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