JPS60182142A - Resin sealing mold for semiconductor device - Google Patents

Resin sealing mold for semiconductor device

Info

Publication number
JPS60182142A
JPS60182142A JP3647684A JP3647684A JPS60182142A JP S60182142 A JPS60182142 A JP S60182142A JP 3647684 A JP3647684 A JP 3647684A JP 3647684 A JP3647684 A JP 3647684A JP S60182142 A JPS60182142 A JP S60182142A
Authority
JP
Japan
Prior art keywords
resin
mold
cavity
air
air exhaust
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3647684A
Other languages
Japanese (ja)
Inventor
Shiyuuzou Akishima
周三 明島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP3647684A priority Critical patent/JPS60182142A/en
Publication of JPS60182142A publication Critical patent/JPS60182142A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/34—Moulds having venting means

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent the generation of poor filling and cavities caused by the intrusion of air into resin on the upper part of a pellet as well as to improve the reliability of a semiconductor device by a method wherein an air exhaust hole is provided on the surface of the upper mold located on the upper part of a semiconductor pellet. CONSTITUTION:On a part of the section corresponding to the top force 1' located on the upper part of a semiconductor pellet 12, an air exhaust pipe 21 perpendicularly directing upward and another air exhaust pipe 22 opened to the side face of the top force 1' heading in the horizontal direction from the midway of the pipe 21 are provided. After a molding work has been completed in the air exhaust pipe 21, an ejector 23 from which the flowed in and hardened resin will be exhausted by performing a sliding movement is provided. The sealing resin which is softened in a pot is injected into a cavity 3 by applying high pressure through a runner 4 and a gate 5. The air contained in the cavity 3 is exhausted through an air vent 6 and an air exhaust pipe 21, and the sealing resin spreads in the cavity 3 uniformly.

Description

【発明の詳細な説明】 〔発明の技術分野〕 本発明は樹脂封止用金型に関するもので、特にＬＳＩ等
の大型パッケージを有する半導体装置の製造に使用され
るものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a mold for resin sealing, and is particularly used for manufacturing semiconductor devices having large packages such as LSIs.

〔発明の技術的背景〕[Technical background of the invention]

半導体集積回路装置のうち樹脂封止型のものにおいては
、半導体ペレットをリードフレームの中心に存在するベ
ッド上にグイボンディングにより固着し、このリードフ
レームを金型中に載置し、トランスファモールド法等に
より樹脂封止を行うようにしている。最近の樹脂封止技
術の向上および信頼性の向上から、ＬＳＩ等の大型パッ
ケージも樹脂封止型のものが多くなっている。In the case of resin-sealed semiconductor integrated circuit devices, semiconductor pellets are fixed onto a bed at the center of a lead frame by Gui bonding, and this lead frame is placed in a mold using a transfer molding method, etc. Resin sealing is performed using the following methods. Due to recent improvements in resin sealing technology and reliability, many large packages such as LSIs are now of the resin seal type.

第１図はこのような大型パンケージを製造するトランス
ファモールド用の樹脂封止用金型の主要部分を示す断面
図であって、上金型／および下金型−が組合わされてお
り、これら両金型間には封止用樹脂を注入する空間であ
るキャピテイ３が形成されている。また、このキャピテ
イ３に成形用材料を供給するために、分配流路であるラ
ンナダおよびキャビティ３への流入口であるゲートＳが
樹脂封止用金型に設けられている。さらに、樹脂封止の
際、キャビティ内の空気を適切に逃し、巣や樹脂未充填
を防止するため、止金型／と下金型スの合わせ面には溝
状のエアーベント６が設げられている。FIG. 1 is a cross-sectional view showing the main parts of a resin sealing mold for transfer molding that manufactures such large pan cages, in which an upper mold and a lower mold are combined. A cavity 3, which is a space in which a sealing resin is injected, is formed between the molds. Further, in order to supply molding material to the cavity 3, a runner serving as a distribution channel and a gate S serving as an inlet to the cavity 3 are provided in the resin sealing mold. Furthermore, during resin sealing, a groove-shaped air vent 6 is provided on the mating surface of the stopper mold/lower mold in order to properly release the air inside the cavity and prevent cavities and resin non-filling. It is being

このような樹脂封止用金型を使用して樹脂封止型の半導
体装置を製造するには次のように行う。Manufacturing a resin-sealed semiconductor device using such a resin-sealing mold is performed as follows.

まず、止金型／と下金型コを分離しキャビティ３内に半
導体ペレット１２をベッド部／／ａに搭載し多数のり一
部／／ｂを有するリードフレーム／／を載置する。次に
上金型／と下金型ユとを組合わせ、成型材料装入室（ポ
ット）ランチダ、ゲート５を経て樹脂を高圧でキャビテ
ィ３内に導びくと、キャピテイ３内全面に樹脂が注入さ
れ、樹脂が硬化し、封止が完了する。First, the stopper mold and the lower mold are separated, and the semiconductor pellet 12 is mounted on the bed part //a in the cavity 3, and the lead frame // having a large number of glue parts //b is placed thereon. Next, the upper mold and lower mold are combined, and the resin is introduced into the cavity 3 under high pressure through the molding material charging chamber (pot) launcher and gate 5, and the resin is injected all over the inside of the cavity 3. The resin is cured and the sealing is completed.

〔背景技術の問題点〕[Problems with background technology]

しかしながら、大型の半導体装置では、大型でかつ厚さ
が比較的厚いペレットを用い、その上方では樹脂の厚さ
が相対的に薄くなるため樹脂の回り込みが遅くなり、成
型不良が発生しやすいという問題がある。すなわち、第
１図に示すように半導体ペレット／２の上に未充填ある
いは巣等の成型不良／３が生じる。これは第２図の模式
的平面図に示されるように、金型のキャビティ３の各す
みの部分に空気抜き孔であるエアーペン）４が複数本設
けられているため、キャビティ３周囲近傍での樹脂の回
り込みは良好であるが、半導体ペレット／−の上方では
上金型／との間隙が少なく、しかも空気の逃げ場がない
ことから空気が封止用樹脂内に混入し、未充填および巣
が発生しやすい。このような未充填等が発生したときは
この封止不完全部を通して水分が半導体ペレットの方へ
侵入し、半導体ペレット中の導体および配線ワイヤ等を
腐食させ、信頼性を低下させるという問題がある。However, in large semiconductor devices, large and relatively thick pellets are used, and the thickness of the resin becomes relatively thin above the pellets, which slows down the flow of the resin and causes molding defects. There is. That is, as shown in FIG. 1, molding defects /3 such as unfilled or voids occur on semiconductor pellet /2. This is because, as shown in the schematic plan view in Fig. 2, a plurality of air pens 4, which are air vent holes, are provided in each corner of the cavity 3 of the mold, so that the resin in the vicinity of the cavity 3 is Although the wraparound is good, there is a small gap between the semiconductor pellet /- and the upper mold /-, and there is no place for air to escape, so air gets mixed into the sealing resin, causing unfilling and cavities. It's easy to do. When such unfilling occurs, there is a problem in that moisture enters the semiconductor pellet through the incomplete sealing, corrodes the conductors and wiring wires in the semiconductor pellet, and reduces reliability. .

このような成型不良は大型パッケージでは顕著であり、
例えば／ｊｘ／ｊｍ＋ｎの大きさを持つキャビティ中で
／θＸ１０Ｗｒｍの大きさで厚さ、２＆θ／Ｉｔｍの／
θＯピ／半導体ペレットに対して上金型、下金型の双方
でｌｒＩｍ厚の樹脂封止を行ってフラットパッケージの
半導体装置を製造したところ、上述の未充填や巣の発生
する確率はほば１００％であった。Such molding defects are noticeable in large packages,
For example, in a cavity with size /jx/jm+n, /θX10Wrm and thickness 2&θ/Itm/
When we manufactured a flat packaged semiconductor device by sealing the θO pi/semiconductor pellet with lrIm-thick resin in both the upper and lower molds, we found that the probability of the above-mentioned unfilling and voids occurring was almost negligible. It was 100%.

〔発明の目的〕[Purpose of the invention]

本発明はこのような問題点に鑑みてなされたもので、大
型ペレットを使用した半導体装置であっても空気残りに
伴う不良を生じない樹脂封止用金型を提供することを目
的とする。The present invention has been made in view of these problems, and it is an object of the present invention to provide a mold for resin sealing that does not cause defects due to residual air even in semiconductor devices using large pellets.

〔発明の概要〕[Summary of the invention]

上記目的達成のため、本発明においてはキャビティ周囲
部に空気排出孔を備えた樹脂封止用金型において、半導
体ペレット部上方の上金型面に空気排出孔を設けるよう
にしており、止金型と半導体ペレット上面の空隙が少な
い場合でも空気の排出が効率的に行われるため樹脂の未
充填等の成形′不良を減少させることができるものであ
る。To achieve the above object, in the present invention, in a resin sealing mold equipped with an air exhaust hole around the cavity, the air exhaust hole is provided on the upper mold surface above the semiconductor pellet part, and the clasp Even when there is a small gap between the mold and the upper surface of the semiconductor pellet, air can be efficiently discharged, thereby reducing molding defects such as unfilled resin.

〔発明の実施例〕[Embodiments of the invention]

以下図面を参照しながら本発明の一実施例を詳細に説明
する。An embodiment of the present invention will be described in detail below with reference to the drawings.

第３図は本発明にかかる半導体装置の樹脂封止用金型の
主要部の構成を示す断面図であって、第１図の場合と同
様上金型／′および下金型コが対となって樹脂封止用金
型を構成しており、この止金型／′および下金型−が正
しく組合わされたときには両金型間にキャビティ３が形
成される。このキャビティ３にはゲートＳおよびランナ
グが連結され、上金型／′および下金型−の合わせ面に
は溝状のエアーベント６が設けられている。樹脂封止を
行う際には半導体ペレット／、２を搭載したリードフレ
ームｌ／がキャビティ３内に位置決めされるが、半導体
ベンツ）／Ｌ２部の上方にある上金型ｌ′の対応部分の
一部には垂直に上方に向かう空気排出管コ／およびその
途中から水平方向に向かい上金型／′の一側面に開口し
ている空気排出管２２が設けられ、垂直方向の空気排出
管、２／内には成形完了後、流入して硬化した樹脂を摺
動することによって排出するエジェクタ２３が設けられ
ている。FIG. 3 is a cross-sectional view showing the structure of the main parts of the mold for resin encapsulation of a semiconductor device according to the present invention, in which the upper mold /' and the lower mold are paired as in the case of FIG. 1. This constitutes a mold for resin sealing, and when the stopper mold /' and the lower mold are correctly assembled, a cavity 3 is formed between the two molds. A gate S and a runner are connected to this cavity 3, and a groove-shaped air vent 6 is provided on the mating surface of the upper mold /' and the lower mold. When performing resin sealing, the lead frame l/ with the semiconductor pellet /, 2 mounted thereon is positioned in the cavity 3. The part is provided with an air exhaust pipe 22 that extends vertically upward and opens on one side of the upper mold 2 that runs horizontally from the middle of the pipe. / is provided with an ejector 23 that slides and ejects the inflowing and hardened resin after completion of molding.

このような空気排出管２／の位置は半導体ペレット上で
最も空気が逃げにくい樹脂注入用ゲートから最も離れた
部分とするのがよい。The position of the air exhaust pipe 2/ is preferably at the part of the semiconductor pellet farthest from the resin injection gate where air is most difficult to escape.

以上のような樹脂封止用金型を用いた半導体装置の樹脂
封止は次のように行われる。ポット（図示せず）内で軟
化した封止用樹脂はランナｑ１ゲート３を経てキャビテ
ィ３内に高圧で注入される。Resin encapsulation of a semiconductor device using the resin encapsulation mold as described above is performed as follows. The sealing resin softened in the pot (not shown) is injected into the cavity 3 through the runner q1 gate 3 at high pressure.

このときキャピテイ３内には多（の空気が存在しテイル
カ、エアーベント６および空気排出管２／および２ａを
通じて排出され、封止用樹脂はキャビティ３内に均一に
拡がり、特に半導体ペレット／２の上に空気が残留する
ことはない。成形完了後、エアーペン）Ａおよび空気排
出管２／には硬化した樹脂が残留するが、前者はパリと
して後者はエジエクタユＪにより押し出すことによって
取り除くことができる。At this time, a large amount of air exists in the cavity 3 and is discharged through the air vent 6 and the air exhaust pipes 2/2a, and the sealing resin spreads uniformly within the cavity 3, especially the semiconductor pellets/2. No air remains on top.After molding is completed, hardened resin remains on the air pen (A) and the air exhaust pipe (2/), but the former can be removed by extruding the former with an ejectaille J.

〔発明の効果〕〔Effect of the invention〕

以上のように、本発明によれば、未充填の発生しやすい
半導体ペレット位置に対応する上金型の一部に空気排出
孔を設けるようにしており、成形時に半導体ペレット上
の空気が効率的に排出されるので、ペレット上部におけ
る空気の樹脂への侵入に伴う未充填および巣の発生が防
止され半導体装置の信頼性が向上する。このような効果
は半導体ペレット上部く、大きい大型パッケージの半導
体装置において特に著しい。As described above, according to the present invention, the air exhaust hole is provided in a part of the upper mold corresponding to the semiconductor pellet position where unfilling is likely to occur, and the air above the semiconductor pellet is efficiently removed during molding. This prevents unfilling and the formation of voids caused by air entering the resin at the upper part of the pellet, thereby improving the reliability of the semiconductor device. Such an effect is particularly remarkable in semiconductor devices in large packages where the semiconductor pellet has a large upper part.

また、ペレット上部における排気に伴って封止用樹脂が
迅速にペレットと止金型間の間隙に侵入することから成
型時間の短縮化に伴う工数の短縮化および樹脂の厚さを
より薄くした薄型パッケージ化をも達成することができ
る。In addition, as the sealing resin quickly enters the gap between the pellet and the mold as the upper part of the pellet is exhausted, the molding time is shortened, reducing man-hours and making the resin thinner. Packaging can also be achieved.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の樹脂封止用金型の概略構成を示す断面図
、第２図はこの金型のキャビティ周囲に設げられたエア
ーベントおよび発生する巣の位置を示す平面図、第３図
は本発明にかかる樹脂封止用金型の一実施例の構成を示
す断面図である。 ／、ｌ′・・・上金型、コ・・・下金型、３・・・キャ
ビティ、ダ・・・ランナ、Ｓ・・・ゲ−）、４・・・エ
アーベント、／／・・・リードフレーム、／ユ・・・半
導体ペレット、／３・・・成形不良、　２／、　２２・
・・排気管、２３・・・エジェクタ。Fig. 1 is a cross-sectional view showing the schematic structure of a conventional mold for resin sealing, Fig. 2 is a plan view showing the air vent provided around the cavity of this mold and the position of the cavities that occur, and Fig. 3 The figure is a sectional view showing the structure of an embodiment of a resin sealing mold according to the present invention. /, l'... Upper mold, K... Lower mold, 3... Cavity, D... Runner, S... Game), 4... Air vent, //...・Lead frame, /U...Semiconductor pellet, /3...Poor molding, 2/, 22・
...Exhaust pipe, 23...Ejector.

Claims (1)

【特許請求の範囲】 ｌ上金型および下金型を有し、半導体ペレットを搭載し
たリードフレームを所定位置に載置して樹脂封止を行う
だめのキャピテイを前記上金型および下金型の組合せ部
に有すると共に前記上金型および下金型は前記キャビテ
ィ周囲部に空気排出部を備えた半導体装置の樹脂封止用
金型において、 前記半導体ベレット部上方の上金型面に空気排出孔を設
けたことを特徴とする半導体装置の樹脂封止用金型。 ユ空気排出孔が樹脂注入用のゲートから最も離れた半導
体ペレット位置に対応して設けられた特許請求の範囲第
１項記載の半導体装置の樹脂封止用金型。[Claims] l An upper mold and a lower mold are provided, and a cavity for placing a lead frame carrying a semiconductor pellet in a predetermined position and sealing with resin is connected to the upper mold and the lower mold. In a mold for resin sealing of a semiconductor device, the upper mold and the lower mold are provided with an air exhaust part around the cavity, wherein the upper mold and the lower mold have an air exhaust part on the upper mold surface above the semiconductor pellet part. A mold for resin-sealing a semiconductor device, characterized by having a hole. 2. The mold for resin sealing of a semiconductor device according to claim 1, wherein the air discharge hole is provided corresponding to the position of the semiconductor pellet farthest from the gate for resin injection.
JP3647684A 1984-02-28 1984-02-28 Resin sealing mold for semiconductor device Pending JPS60182142A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3647684A JPS60182142A (en) 1984-02-28 1984-02-28 Resin sealing mold for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3647684A JPS60182142A (en) 1984-02-28 1984-02-28 Resin sealing mold for semiconductor device

Publications (1)

Publication Number Publication Date
JPS60182142A true JPS60182142A (en) 1985-09-17

Family

ID=12470865

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3647684A Pending JPS60182142A (en) 1984-02-28 1984-02-28 Resin sealing mold for semiconductor device

Country Status (1)

Country Link
JP (1) JPS60182142A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03206629A (en) * 1990-01-08 1991-09-10 Nec Corp Metal mold for semiconductor resin-sealing
JPH0482236A (en) * 1990-07-25 1992-03-16 Toowa Kk Method and apparatus for resin sealing and molding of electronic component
US5252052A (en) * 1990-12-28 1993-10-12 Sgs-Thomson Microelectronics S.R.L. Mold for manufacturing plastic integrated circuits incorporating a heat sink
NL1026739C2 (en) * 2004-07-29 2006-01-31 Fico Bv Mold part for enveloping electronic components.
WO2014188707A1 (en) * 2013-05-23 2014-11-27 株式会社デンソー Die for temperature sensor, production method, and temperature sensor

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03206629A (en) * 1990-01-08 1991-09-10 Nec Corp Metal mold for semiconductor resin-sealing
JPH0482236A (en) * 1990-07-25 1992-03-16 Toowa Kk Method and apparatus for resin sealing and molding of electronic component
US5252052A (en) * 1990-12-28 1993-10-12 Sgs-Thomson Microelectronics S.R.L. Mold for manufacturing plastic integrated circuits incorporating a heat sink
NL1026739C2 (en) * 2004-07-29 2006-01-31 Fico Bv Mold part for enveloping electronic components.
WO2006011790A2 (en) * 2004-07-29 2006-02-02 Fico B.V. Mould part and method for encapsulating electronic components
WO2006011790A3 (en) * 2004-07-29 2006-05-04 Fico Bv Mould part and method for encapsulating electronic components
JP2008508116A (en) * 2004-07-29 2008-03-21 フィーコ ビー．ブイ． Mold part and method for encapsulating electronic components
JP4741592B2 (en) * 2004-07-29 2011-08-03 フィーコ ビー．ブイ． Mold part and method for encapsulating electronic components
WO2014188707A1 (en) * 2013-05-23 2014-11-27 株式会社デンソー Die for temperature sensor, production method, and temperature sensor
CN105228807A (en) * 2013-05-23 2016-01-06 株式会社电装 The mould of temperature sensor manufacture, manufacture method and temperature sensor

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