JPS60179035U - bonding tools - Google Patents

bonding tools

Info

Publication number
JPS60179035U
JPS60179035U JP1984066264U JP6626484U JPS60179035U JP S60179035 U JPS60179035 U JP S60179035U JP 1984066264 U JP1984066264 U JP 1984066264U JP 6626484 U JP6626484 U JP 6626484U JP S60179035 U JPS60179035 U JP S60179035U
Authority
JP
Japan
Prior art keywords
bonding tools
bonding
bonding tool
tip
tools
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984066264U
Other languages
Japanese (ja)
Inventor
池田　史麻呂
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP1984066264U priority Critical patent/JPS60179035U/en
Publication of JPS60179035U publication Critical patent/JPS60179035U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図はインナーリードボンディング方式を説明する概
略図である。第２図Ａ及び第２図Ｂはそれぞれ本考案の
実施例によるボンディングツールを説明する斜視図であ
る。 図に於て、１，７，９・・・ボンディングツール、２・
・・熱電対、３・・・ＩＣ，４・・・インナーリード、
５・・・テープキャリア、６，８・・・先端チップを示
す。FIG. 1 is a schematic diagram illustrating the inner lead bonding method. FIGS. 2A and 2B are perspective views illustrating bonding tools according to embodiments of the present invention, respectively. In the figure, 1, 7, 9... bonding tool, 2...
...Thermocouple, 3...IC, 4...Inner lead,
5... tape carrier, 6, 8... tip tip.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] テープキャリアを用いた多点同時ボンディング方式に使
用されるポンプイングツニルに於いて、該ボンディング
ツールの先端部を分離し、先端チップをボンディングツ
ール本体にはめ込む構造を有することを特徴とするボン
ディングツール。A bonding tool, which is used in a multi-point simultaneous bonding method using a tape carrier, and has a structure in which the tip of the bonding tool is separated and the tip is fitted into the bonding tool body.
JP1984066264U 1984-05-07 1984-05-07 bonding tools Pending JPS60179035U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984066264U JPS60179035U (en) 1984-05-07 1984-05-07 bonding tools

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984066264U JPS60179035U (en) 1984-05-07 1984-05-07 bonding tools

Publications (1)

Publication Number Publication Date
JPS60179035U true JPS60179035U (en) 1985-11-28

Family

ID=30599004

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984066264U Pending JPS60179035U (en) 1984-05-07 1984-05-07 bonding tools

Country Status (1)

Country Link
JP (1) JPS60179035U (en)

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