JPS60177697A - Porcelain substrate - Google Patents
Porcelain substrateInfo
- Publication number
- JPS60177697A JPS60177697A JP3305384A JP3305384A JPS60177697A JP S60177697 A JPS60177697 A JP S60177697A JP 3305384 A JP3305384 A JP 3305384A JP 3305384 A JP3305384 A JP 3305384A JP S60177697 A JPS60177697 A JP S60177697A
- Authority
- JP
- Japan
- Prior art keywords
- hollow
- layer
- core material
- enamel
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title description 10
- 229910052573 porcelain Inorganic materials 0.000 title 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 18
- 239000011162 core material Substances 0.000 claims description 17
- 239000010410 layer Substances 0.000 claims description 17
- 210000003298 dental enamel Anatomy 0.000 claims description 15
- 238000007747 plating Methods 0.000 claims description 13
- 239000002356 single layer Substances 0.000 claims description 11
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 229910000480 nickel oxide Inorganic materials 0.000 claims description 3
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 claims description 3
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 4
- 238000010304 firing Methods 0.000 description 4
- 230000002265 prevention Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000011796 hollow space material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- AHADSRNLHOHMQK-UHFFFAOYSA-N methylidenecopper Chemical compound [Cu].[C] AHADSRNLHOHMQK-UHFFFAOYSA-N 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
この発明は、印刷回路用ホーロー基板、詳しくは、コア
材に部分的にホーロ一層を有する印刷回路用のホーロー
基板に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a hollow substrate for a printed circuit, and more particularly to a hollow substrate for a printed circuit having a core material partially having a single layer of hollow.
厚膜印刷回路用基板どして、近年、鉄等の金属板からな
るコア材にホーロ一層を形成し、このホーロ一層の表面
に回路パターンを設けたホーロー基板が用いＩＥ＋れで
いる。この従来のホーロー基板は、コア゛材全面がホー
ロ一層で覆われており、そのため電気的絶縁の不要な部
分にまでホーロ一層が存在しており、従って、基板の放
熱効率が悪く、またホーロー基板の価格が高くなるとい
う欠点があった、この欠点を除去した基板として、コア
材の絶縁が必要である部分にのみホーロ一層を形成した
部分ホーロー基板が提案されている。In recent years, hollow substrates have been used as substrates for thick film printed circuits, in which a single layer of hollow is formed on a core material made of a metal plate such as iron, and a circuit pattern is provided on the surface of this hollow layer. In this conventional hollow board, the entire surface of the core material is covered with a single layer of hollow, and as a result, a single layer of hollow exists even in areas that do not require electrical insulation, resulting in poor heat dissipation efficiency of the board, and As a board that eliminates this drawback, a partial hollow board in which a single layer of hollow material is formed only in the portions of the core material that require insulation has been proposed.
上記部分ホーロー基板の場合、ホーロ一層で被覆されて
いない部分、すなわち、非ホーロ一層部分に防錆処理を
施す必要がある。この防錆処理の方法として、従来、非
ホーロ一層部分に防錆塗料を塗布したり、あるいは防錆
メッキを施す等の処理方法が採られていたが、このよう
な処理方法においては、その処理前にホーロ一層をコー
ティング等で保護しておく必要があるので、防錆処理が
面倒であるばかりでなく、防錆メッキ液等がホーロ一層
に付着してしまった場合は、ホーロ一層がメッキ液で侵
されてしまい、絶縁性の劣化を招くなどの不具合を生じ
る。In the case of the above-mentioned partial hollow substrate, it is necessary to perform rust prevention treatment on the portion not covered with a single layer of hollow, that is, the non-hollow single layer. Conventionally, this anti-corrosion treatment has been carried out by applying anti-rust paint or anti-corrosion plating to the non-hollow single-layer part. It is necessary to protect the first layer of the enamel with a coating, etc., so not only is the rust prevention treatment troublesome, but if the anti-rust plating solution etc. adheres to the first layer of the enamel, the first layer of the enamel will be exposed to the plating solution. This can lead to problems such as deterioration of insulation.
この発明の目的は、従来の部分ホーロー基板における欠
点、不具合を解消したホーロー基板を提供することにあ
る。An object of the present invention is to provide a hollow substrate that eliminates the drawbacks and problems of conventional partial hollow substrates.
この発明の、ホーロー基板は、コア材に二ツケルメッキ
が施されていて、このニッケルメッキの上の所要部分に
ホーロ一層が形成されており、非ホーロ一層部分にニッ
ケル酸イビ被膜を形成したものである。The enamel board of this invention has a core material plated with Nitsukel, a single layer of enamel is formed on the required portions on top of the nickel plating, and a nickel oxide coating is formed on the non-hollow layer. be.
以下、図示の実施例によって、本発明を説明する。図に
おいて、全体を符号１で示すホーロー基板は、低炭素銅
などの金属板からなるコア材２、このコア材２に施され
たニッケルメッキ層３及びこのメッキ層３上の必要部分
に設けられたホーロ一層４によって構成されている。The present invention will be explained below with reference to illustrated embodiments. In the figure, the enamel board, which is designated as a whole by reference numeral 1, includes a core material 2 made of a metal plate such as low carbon copper, a nickel plating layer 3 applied to the core material 2, and necessary parts provided on the plating layer 3. It is composed of 4 layers of hollow hollow.
ニッケルメッキは、コア材２を硫酸ニッケル溶液に浸す
ことによって施される。このメッキの厚さが厚すぎると
きは、ホーロ一層がコア材から剥離するおそれがあるの
で、メッキ厚は１μｍ以下とすることが望しい。Nickel plating is performed by dipping the core material 2 in a nickel sulfate solution. If this plating is too thick, there is a risk that the hollow layer will peel off from the core material, so it is desirable that the plating thickness be 1 μm or less.
ニッケルメッキを施したのち、コア材にホーロ一層を印
刷する。ホーローには、たとえばホウケイ酸ガラスが用
いられる。コア材に印刷されたホーローを乾燥させた後
、コア材を酸化雰囲気中で。After nickel plating, a single layer of enamel is printed on the core material. For example, borosilicate glass is used for the enamel. After drying the enamel printed on the core material, the core material is placed in an oxidizing atmosphere.
焼成温度６５０℃〜７５０℃のもとて焼成する。具体的
には、多量の空気を吹き付けながら焼成され、酸化雰囲
気中での焼成によって、ニッケルを酸化させてコア材表
面に酸化被膜形成する。上記の焼成温度が比較的低い（
通常８００℃〜９００℃）のは、７５１℃以下ではニッ
ケル酸化被膜層の剥離が生じて充分な防錆処理がなされ
ず、また６５０℃未満ではホーロ一層の完全な焼成が達
成されないからである。It is fired at a firing temperature of 650°C to 750°C. Specifically, it is fired while blowing a large amount of air, and by firing in an oxidizing atmosphere, nickel is oxidized and an oxide film is formed on the surface of the core material. The above firing temperature is relatively low (
The reason for this is that if the temperature is below 751°C, the nickel oxide layer will peel off and sufficient rust prevention treatment will not be achieved, and if it is below 650°C, complete firing of the enamel layer will not be achieved.
このようにして得られた酸化被膜は耐食性に優れている
。The oxide film thus obtained has excellent corrosion resistance.
この発明によれば、コア材にホーロ一層を印刷する前に
施されたニッケルメッキ層の非ホーロ一層部分に耐食性
の高い酸化被膜が形成されており。According to this invention, a highly corrosion-resistant oxide film is formed on the non-hollow layer portion of the nickel plating layer that is applied before printing the hollow layer on the core material.
この酸化被膜によって非ホーロ一層部分の防錆がなされ
る。This oxide film protects the non-hollow layered portion from rust.
第１図は、この発明の一実施例を示すホーロー基板の断
面図、第２図は、ホーロー基板の製造工程を示す図であ
る。
１・・・・ホーロー基板、２・・・・コア材。
３・・・ニッケルメッキ層、 ４・・・・ホーロ一層。
第１図
第 ？ 図
手続補正書
昭和５９年・４ 月 ３ 口
ｌ 事件の表示
昭和５９年特許願第３３０５３号
２発明の名称
ホーロー基板
３ 補正をする者
事件との関係 特許出願人
名 称 （２２３）株式会社三協精機製作所４ 代 理
人
住 所 東京都世田谷区経堂４丁目５番４号明細書の「
発明の詳細な説明」の欄
６補正の内容
（１）明細書第３頁第７行中の「銅」を「鋼」に改める
。
（２）同第４頁第３行中の「膜形成」を「膜を形成Ｊに
改める。FIG. 1 is a cross-sectional view of a hollow substrate showing an embodiment of the present invention, and FIG. 2 is a diagram showing the manufacturing process of the hollow substrate. 1... Enamel board, 2... Core material. 3...Nickel plating layer, 4...Enamel layer. Figure 1 No. ? Drawing procedure amendment April 1980 3 Indication of the case 1982 Patent Application No. 33053 2 Name of the invention Enamel board 3 Person making the amendment Relationship to the case Patent applicant name Title (223) Sankyo Co., Ltd. Seiki Seisakusho 4th Director Address: 4-5-4 Kyodo, Setagaya-ku, Tokyo
Contents of amendment in column 6 of ``Detailed Description of the Invention'' (1) Change ``copper'' in line 7 of page 3 of the specification to ``steel.'' (2) "Membrane formation" in the third line of page 4 has been changed to "Membrane formation J."
Claims (1)
−）で、上記コア材にニッケルメッキが施されており、
このニッケルメッキの上の必要部分にホーロ一層を有し
、非ホーロ一層部分をニッケル酸化被膜としたことを特
徴とするホーロー基板。It is a hollow board whose core material has a partial hollow layer, and the core material is nickel plated.
This enamel board is characterized in that it has a single layer of enamel in the necessary areas on top of the nickel plating, and a nickel oxide coating on the non-hollow part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3305384A JPS60177697A (en) | 1984-02-23 | 1984-02-23 | Porcelain substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3305384A JPS60177697A (en) | 1984-02-23 | 1984-02-23 | Porcelain substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60177697A true JPS60177697A (en) | 1985-09-11 |
| JPH053157B2 JPH053157B2 (en) | 1993-01-14 |
Family
ID=12376019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3305384A Granted JPS60177697A (en) | 1984-02-23 | 1984-02-23 | Porcelain substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60177697A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5724596A (en) * | 1980-07-21 | 1982-02-09 | Tokyo Shibaura Electric Co | Circuit board |
| JPS58137286A (en) * | 1982-02-09 | 1983-08-15 | 株式会社東芝 | Porcelain board |
| JPS58199865A (en) * | 1982-05-15 | 1983-11-21 | Takara Standard Kk | Enameled substrate |
| JPS58217453A (en) * | 1982-06-10 | 1983-12-17 | Toshiba Corp | Crystallized enamel substrate |
-
1984
- 1984-02-23 JP JP3305384A patent/JPS60177697A/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5724596A (en) * | 1980-07-21 | 1982-02-09 | Tokyo Shibaura Electric Co | Circuit board |
| JPS58137286A (en) * | 1982-02-09 | 1983-08-15 | 株式会社東芝 | Porcelain board |
| JPS58199865A (en) * | 1982-05-15 | 1983-11-21 | Takara Standard Kk | Enameled substrate |
| JPS58217453A (en) * | 1982-06-10 | 1983-12-17 | Toshiba Corp | Crystallized enamel substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH053157B2 (en) | 1993-01-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |