JPS60176561U - light emitting diode - Google Patents

light emitting diode

Info

Publication number
JPS60176561U
JPS60176561U JP6558884U JP6558884U JPS60176561U JP S60176561 U JPS60176561 U JP S60176561U JP 6558884 U JP6558884 U JP 6558884U JP 6558884 U JP6558884 U JP 6558884U JP S60176561 U JPS60176561 U JP S60176561U
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
lens
leg
lens leg
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6558884U
Other languages
Japanese (ja)
Inventor
濱井　信夫
Original Assignee
浜井電球工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 浜井電球工業株式会社 filed Critical 浜井電球工業株式会社
Priority to JP6558884U priority Critical patent/JPS60176561U/en
Publication of JPS60176561U publication Critical patent/JPS60176561U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の発光ダイオードの側面図を示し、第２
図はパネル板に取付けた発光ダイオードの断面図を示す
。第３図はその断面図を示し、第４図は従来の発光ダイ
オードの実施例を示すものである。 １・・・レンズ部分、２・・・レンズの脚、３・・・逆
テーパー状の突起。Figure 1 shows a side view of the light emitting diode of the present invention, and Figure 2 shows a side view of the light emitting diode of the present invention.
The figure shows a cross-sectional view of a light emitting diode attached to a panel board. FIG. 3 shows a cross-sectional view thereof, and FIG. 4 shows an example of a conventional light emitting diode. 1... Lens part, 2... Lens leg, 3... Reverse tapered projection.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 発光素子５を内蔵するレンズ１の下部に所要長さのレン
ズ脚部２を一体に設け、該レンズ脚部２の外周面に逆テ
ーパー状突起３を数段設け、レンズ１およびレンズ脚部
２全体を合成樹脂で充填成形してなることを特徴とした
発光ダイオード。A lens leg 2 of a required length is integrally provided at the lower part of the lens 1 containing the light emitting element 5, and several inverted tapered protrusions 3 are provided on the outer peripheral surface of the lens leg 2. A light emitting diode characterized by being entirely filled and molded with synthetic resin.
JP6558884U 1984-05-04 1984-05-04 light emitting diode Pending JPS60176561U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6558884U JPS60176561U (en) 1984-05-04 1984-05-04 light emitting diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6558884U JPS60176561U (en) 1984-05-04 1984-05-04 light emitting diode

Publications (1)

Publication Number Publication Date
JPS60176561U true JPS60176561U (en) 1985-11-22

Family

ID=30597717

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6558884U Pending JPS60176561U (en) 1984-05-04 1984-05-04 light emitting diode

Country Status (1)

Country Link
JP (1) JPS60176561U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5761859B2 (en) * 1978-07-31 1982-12-27 Nat House Ind

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5761859B2 (en) * 1978-07-31 1982-12-27 Nat House Ind

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