JPS6016551U - Heatsink mounting bracket for semiconductor devices - Google Patents
Heatsink mounting bracket for semiconductor devicesInfo
- Publication number
- JPS6016551U JPS6016551U JP10836883U JP10836883U JPS6016551U JP S6016551 U JPS6016551 U JP S6016551U JP 10836883 U JP10836883 U JP 10836883U JP 10836883 U JP10836883 U JP 10836883U JP S6016551 U JPS6016551 U JP S6016551U
- Authority
- JP
- Japan
- Prior art keywords
- heatsink
- mounting bracket
- semiconductor devices
- holes
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来の半導体素子の放熱器取付台を使用した時
の断面図、第2図は本考案の実施例の使用時の断面図、
第3図、第4図は本考案の実施例の斜視図およびその展
開平面図、第5図は第3図の実施例を装着した時の平面
図である。
図において1・・・・・・印刷配線板、1′・・・・・
・放熱器取付具の足挿入用孔、2・・・・・・半導体素
子、3・・・・・・放熱器、3′・・・・・・放熱器取
付具の足挿入用孔、4・・・・・・支持台、5・・・・
・・接着剤、10・・・・・・放熱器取付具、11.1
2・・・・・・足、13・・・・・・鍔、14・・曲切
欠き、15・・・・・・通風孔、16・・・・・・斜材
である。Fig. 1 is a cross-sectional view when using a conventional heatsink mount for a semiconductor element, and Fig. 2 is a cross-sectional view when an embodiment of the present invention is used.
3 and 4 are a perspective view and a developed plan view of the embodiment of the present invention, and FIG. 5 is a plan view of the embodiment of FIG. 3 when it is installed. In the figure, 1...Printed wiring board, 1'...
・Hole for inserting the foot of the radiator mounting tool, 2... Semiconductor element, 3... Heatsink, 3'... Hole for inserting the foot of the radiator mounting tool, 4 ...Support stand, 5...
...Adhesive, 10... Heatsink mounting tool, 11.1
2... Legs, 13... Tsuba, 14... Curved notches, 15... Ventilation holes, 16... Diagonal members.
Claims (1)
きにこれら放熱器と印刷配線板との間に装着される半導
体素子の放熱器取付具において、側面に通風孔を有し上
下にそれぞれ前記放熱器の孔と前記印刷配線板の孔に係
合する足を有するように成形した金属製薄板を折曲げて
柱状体に構成したことを特徴とする半導体素子の放熱器
取付具。When mounting a semiconductor element with a heatsink attached thereto on a printed wiring board, a heatsink mounting fixture for a semiconductor element is installed between the heatsink and the printed wiring board, and has ventilation holes on the side and the above-mentioned holes on the top and bottom, respectively. 1. A heatsink mounting fixture for a semiconductor device, characterized in that it is formed into a columnar body by bending a thin metal plate formed so as to have legs that engage with holes in the heatsink and holes in the printed wiring board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10836883U JPS6016551U (en) | 1983-07-13 | 1983-07-13 | Heatsink mounting bracket for semiconductor devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10836883U JPS6016551U (en) | 1983-07-13 | 1983-07-13 | Heatsink mounting bracket for semiconductor devices |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6016551U true JPS6016551U (en) | 1985-02-04 |
Family
ID=30252852
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10836883U Pending JPS6016551U (en) | 1983-07-13 | 1983-07-13 | Heatsink mounting bracket for semiconductor devices |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6016551U (en) |
-
1983
- 1983-07-13 JP JP10836883U patent/JPS6016551U/en active Pending
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