JPS60163794U - Electronic component mounting equipment - Google Patents
Electronic component mounting equipmentInfo
- Publication number
- JPS60163794U JPS60163794U JP5040984U JP5040984U JPS60163794U JP S60163794 U JPS60163794 U JP S60163794U JP 5040984 U JP5040984 U JP 5040984U JP 5040984 U JP5040984 U JP 5040984U JP S60163794 U JPS60163794 U JP S60163794U
- Authority
- JP
- Japan
- Prior art keywords
- board
- sub
- main printed
- electronic component
- component mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来の電子部品の取り付は装置を示す平面図で
、第2図は同装置の正面図、第3図は左側面図、第4図
は同電子部品の取り付は装置の使用状態を示す縦断面図
、第5図は本考案に係る電子部品の取り付は装置を示す
平面図で、第6図は同装置の正面図、第7図は左側面図
、第8図は同電子部品の取り付は装置の使用状態を示す
子図、第9図は同使用状態を示す縦断面図である。
1・・・主プリント基板、2・・・ミシン目、3,4・
・・副基板、5・・・スリット、8・・・接続線。Figure 1 is a plan view showing the device in which conventional electronic components are installed, Figure 2 is a front view of the device, Figure 3 is a left side view, and Figure 4 is a plan view of the device in which the electronic components are installed. FIG. 5 is a plan view showing the device in which electronic components are installed according to the present invention; FIG. 6 is a front view of the device; FIG. 7 is a left side view; FIG. FIG. 9 is a sub-view showing how the device is used, and FIG. 9 is a vertical cross-sectional view showing how the device is used. 1... Main printed circuit board, 2... Perforation, 3, 4...
... Sub board, 5... Slit, 8... Connection wire.
Claims (1)
副基板を設けると共に、主プリント基板及び副基板に分
割可能にプリント基板片を設け、この副基板に電子部品
の端子を取り付け、かつ、前記主プリント基板と副基板
との間にスリットを跨いで前記電子部品を主プリント基
板に電気的に接続するための接続線を接続し、前記副基
板を分割し、折り曲げて電子部品を放熱板に固定したこ
とを特徴とする電子部品の取り付は装置。A sub-board surrounded by a U-shaped slit is provided in the main printed board, a printed board piece is provided that can be divided into the main printed board and the sub-board, terminals of electronic components are attached to this sub-board, and the A connecting wire for electrically connecting the electronic components to the main printed circuit board is connected across the slit between the main printed circuit board and the sub-board, and the sub-board is divided and bent to attach the electronic components to the heat sink. A device for installing electronic parts characterized by being fixed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5040984U JPS60163794U (en) | 1984-04-06 | 1984-04-06 | Electronic component mounting equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5040984U JPS60163794U (en) | 1984-04-06 | 1984-04-06 | Electronic component mounting equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60163794U true JPS60163794U (en) | 1985-10-30 |
Family
ID=30568513
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5040984U Pending JPS60163794U (en) | 1984-04-06 | 1984-04-06 | Electronic component mounting equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60163794U (en) |
-
1984
- 1984-04-06 JP JP5040984U patent/JPS60163794U/en active Pending
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