JPS60144258U - optical semiconductor device - Google Patents

optical semiconductor device

Info

Publication number
JPS60144258U
JPS60144258U JP1984031305U JP3130584U JPS60144258U JP S60144258 U JPS60144258 U JP S60144258U JP 1984031305 U JP1984031305 U JP 1984031305U JP 3130584 U JP3130584 U JP 3130584U JP S60144258 U JPS60144258 U JP S60144258U
Authority
JP
Japan
Prior art keywords
semiconductor device
optical semiconductor
light emitting
emitting chip
infrared light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984031305U
Other languages
Japanese (ja)
Inventor
博文 野間
Original Assignee
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東芝 filed Critical 株式会社東芝
Priority to JP1984031305U priority Critical patent/JPS60144258U/en
Publication of JPS60144258U publication Critical patent/JPS60144258U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図ａｔ赤外発光半導体素子の断面図、第２図、　　
は赤外発光半導体素子の等価回路図、第３図はこの考案
の１実施例の光半導体素子の断面図、第４図は１実施例
の光半導体素子の等価回路図、第５図はこの考案の別の
１実施例の光半導体素子の断面−である。 １．２４・・・・・・赤外発光チップ、２．２２−・間
カソード用リード、２ａ＊　　２３ａ・・・・−ノード
頂部の椀、５・・・・・・モールドｌＩＭｆｉＦｉ、１
１．　２１・・・・・・アノード用リード、１２．２５
・・・・・・可視光発光チップ、１３．２６．２７・・
・・・・ボンディングワイヤ、２３　　゛・・・・・・
リード。Figure 1 is a cross-sectional view of an infrared light emitting semiconductor device, Figure 2 is
is an equivalent circuit diagram of an infrared light-emitting semiconductor device, FIG. 3 is a sectional view of an optical semiconductor device according to one embodiment of this invention, FIG. 4 is an equivalent circuit diagram of an optical semiconductor device according to one embodiment of this invention, and FIG. It is a cross section of an optical semiconductor device of another example of the invention. 1.24...Infrared light emitting chip, 2.22--Cathode lead, 2a* 23a...-Node top bowl, 5...Mold lIMfiFi, 1
1. 21...Anode lead, 12.25
...Visible light emitting chip, 13.26.27...
・・・・Bonding wire, 23 ゛・・・・・・
Lead.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 赤外発光チップに対しその通電をモニタする可視光発光
チップを前記チップと共通の外囲器内に並設したことを
特徴とする光半導体素子。1. An optical semiconductor device characterized in that a visible light emitting chip for monitoring energization of an infrared light emitting chip is arranged in parallel with the infrared light emitting chip in a common envelope.
JP1984031305U 1984-03-06 1984-03-06 optical semiconductor device Pending JPS60144258U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984031305U JPS60144258U (en) 1984-03-06 1984-03-06 optical semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984031305U JPS60144258U (en) 1984-03-06 1984-03-06 optical semiconductor device

Publications (1)

Publication Number Publication Date
JPS60144258U true JPS60144258U (en) 1985-09-25

Family

ID=30531792

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984031305U Pending JPS60144258U (en) 1984-03-06 1984-03-06 optical semiconductor device

Country Status (1)

Country Link
JP (1) JPS60144258U (en)

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