JPS60143651A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS60143651A
JPS60143651A JP25134183A JP25134183A JPS60143651A JP S60143651 A JPS60143651 A JP S60143651A JP 25134183 A JP25134183 A JP 25134183A JP 25134183 A JP25134183 A JP 25134183A JP S60143651 A JPS60143651 A JP S60143651A
Authority
JP
Japan
Prior art keywords
driver
chip
heat
chips
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP25134183A
Other languages
Japanese (ja)
Inventor
Takashi Tsukada
敬 塚田
Kenzo Hatada
畑田　賢造
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP25134183A priority Critical patent/JPS60143651A/en
Publication of JPS60143651A publication Critical patent/JPS60143651A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To contrive to improve the mounting integration degree of a semiconductor device and to bring the device into a higher density state by making the device have a sufficient heat-radiating effect by a method wherein driver IC chips themselves are respectively mounted on each of printed substrates and a heat-dissipating agent is made to interpose respectively between the driver IC chips and a heat-dissipating plate. CONSTITUTION:First, driver IC chips 4 cut off from an IC wafer are respectively connected to each of first printed substrates 5 having bonding leads. Then, the first printed substrates 5 are connected to a second printed substrate 6 in such a way that each of the driver IC chips 4 is positioned in each of the holes 10 bored in the second printed substrate 6. By adopting such a constitution, the size of each driver IC chip 4 can be done substantially with the size of each first printed substrate 5, whereon the driver IC chip 4 has been installed, as a driver IC. Meanwhile, a heat-dissipating plate 8 has been mounted on the lower side of the second printed substrate 6 and a heat dissipation which is exhausted from each driver IC chip 4 is led to the heat-dissipating plate 8 through each heat-dissipating agent 7. As a result, the temperature rise of each driver IC chip 4 can be held at sufficiently low values.

Description

【発明の詳細な説明】 産業上の利用分野 本発明はＸ−Ｙマトリックス表示駆動回路やサーマルヘ
ッド駆動回路等のドライバー素子を数多く使用する駆動
回路のプリント基板への実装における半導体装置に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a semiconductor device for mounting on a printed circuit board a drive circuit that uses a large number of driver elements, such as an X-Y matrix display drive circuit or a thermal head drive circuit. .

従来例の構成とその問題点 Ｘ−Ｙマトリックス素示装置やサーマルヘッド等の駆動
には小型、軽量化そして少部品点数などの点から多チヤ
ンネル出力をもつドライバーＩＣ２ベー・ が使用される。第１図にドライバーＩＣを実装させた半
導体装置を示す。半導体装置はプリント基板１にプラス
チックモールドされたパッケージ型ドライバーＩＣ２が
配置され、ドライバー出力を出力リード線を介して表示
装置（あるいはサーマルヘッド等）３に印加することに
より、装置３は駆動状態となる。Ｘ−Ｙマド９２２フ表
示装置を例にとった場合、ドライバーＩＣ１ケの出力数
が３２ｃｈ　とすれば１２８Ｘ５１２の絵素を駆動する
には４×１６のドライバーＩＣが必要となる。Conventional configuration and its problems To drive the X-Y matrix display device, thermal head, etc., a driver IC2B with multi-channel output is used because it is small, lightweight, and has a small number of parts. FIG. 1 shows a semiconductor device on which a driver IC is mounted. The semiconductor device includes a packaged driver IC 2 molded in plastic on a printed circuit board 1, and by applying driver output to a display device (or thermal head, etc.) 3 via an output lead wire, the device 3 is put into a driving state. . Taking an XY window 922 screen display device as an example, if the number of outputs from one driver IC is 32 channels, 4×16 driver ICs are required to drive 128×512 picture elements.

ところで、これらのドライバーＩＣは表示装置に対し並
列に配置するので表示面積が広く絵素数の少ない場合に
は駆動素子を従来例に示すような実装プリント基板で構
成できるが、絵素をよシ高密度化した場合のドライバー
ＩＣ数の増加あるいは表示面積をより小さくした場合に
は表示面積よりも駆動回路の占める面積が大きくなシ、
小型・軽量化といった点で限界が生じてくる。Incidentally, since these driver ICs are arranged in parallel to the display device, if the display area is large and the number of pixels is small, the driving element can be constructed with a mounted printed circuit board as shown in the conventional example. When increasing the density, the number of driver ICs increases, or when the display area is made smaller, the area occupied by the driver circuit is larger than the display area.
Limits arise in terms of miniaturization and weight reduction.

発明の目的 本発明は、係る従来例の欠点を解決する事を目３ベーー 的にしたものでドライバーＩＣの実装において高密度化
を行うことができる半導体装置を提供するものである。OBJECTS OF THE INVENTION The present invention is based on the objective of overcoming the drawbacks of the prior art, and provides a semiconductor device in which driver ICs can be mounted at higher densities.

発明の構成 本発明による半導体装置の構成は、ドライバーＩＣチッ
プそのものをプリント基板に取付けかつドライバーＩＣ
チップと放熱板間に放熱剤を介在させることにより、実
装集積度の向上と充分なる放熱効果をもたせることによ
υ高密度化をはかったものである・ 実施例の説明 以下本発明の一実施例における半導体装置を図面を参照
して説明する。第２図に一実施例を示す。Structure of the Invention The structure of the semiconductor device according to the present invention is such that the driver IC chip itself is mounted on a printed circuit board, and the driver IC chip itself is mounted on a printed circuit board.
By interposing a heat dissipating agent between the chip and the heat dissipation plate, it is possible to increase the density by increasing the degree of packaging integration and providing a sufficient heat dissipation effect.Description of Examples The following is an implementation of the present invention. An example semiconductor device will be described with reference to the drawings. FIG. 2 shows one embodiment.

第２図は半導体装置の構成順序を示す図、第３図は半導
体装置の断面図である。まずＩＣウェノ・−から切りは
なされたドライバーＩＣチップ４をボンディング・リー
ドを有する第１プリント基板６に接続する。この段階で
はドライバーＩＣチップ４はポンディング・リードを介
して第１プリント基板６に対し中空状態となっている。FIG. 2 is a diagram showing the construction order of the semiconductor device, and FIG. 3 is a sectional view of the semiconductor device. First, the driver IC chip 4 cut out from the IC chip 4 is connected to the first printed circuit board 6 having bonding leads. At this stage, the driver IC chip 4 is in a hollow state relative to the first printed circuit board 6 via the bonding leads.

第２プリント基板６は、前記ドライバーＩＣチップ４と
対向する面の部分はドライバーＩＣチップ４より若干大
きめの穴１ｏが打抜かれている。この穴１０にドライバ
ーＩＣチップ４が位置するように第１プリント基板５を
第２プリント基板６に接続する。In the second printed circuit board 6, a hole 1o slightly larger than the driver IC chip 4 is punched in a portion of the surface facing the driver IC chip 4. The first printed circuit board 5 is connected to the second printed circuit board 6 so that the driver IC chip 4 is located in this hole 10.

一方、第２プリント基板６の下にはアルミ板等による放
熱板８が取付けられており、ドライバーＩＣチップ４と
放熱板８との穴１ｏによる空間部に放熱材７が充填され
ている。ドライバーＩＣチップ４からの熱放散は放熱剤
７を介して放熱板８へ導びかれ、ドライバーＩＣチップ
の温度上昇を充分に低い値に保つことができる。第４図
はこのようにして構成された半導体装置の外観図を示し
たものである。第４図において、９は出力リード線、１
１は表示装置（あるいはサーマルヘッド等）である。以
上のような構成をとることによシ、ドライバーＩＣとし
ての大きさは従来のパッケージ型ＩＣの時に比べ、実質
的にはＩＣチップ４を装着させた第１プリント基板５の
大きさですみ、この大きさはＩＣチップ４より若干大き
い程度であるから、大巾な高密度化が可能となる。又、
ＩＣチップ４の熱的保護に対しても放熱剤７を介して直
接、放熱板８に放熱されるので熱的破壊の心配は彦い。On the other hand, a heat dissipation plate 8 made of an aluminum plate or the like is attached below the second printed circuit board 6, and a space formed by a hole 1o between the driver IC chip 4 and the heat dissipation plate 8 is filled with a heat dissipation material 7. Heat dissipated from the driver IC chip 4 is guided to the heat sink 8 via the heat sink 7, and the temperature rise of the driver IC chip can be kept at a sufficiently low value. FIG. 4 shows an external view of the semiconductor device constructed in this manner. In Fig. 4, 9 is an output lead wire, 1
1 is a display device (or a thermal head, etc.). By adopting the above configuration, the size of the driver IC is substantially the same as that of the first printed circuit board 5 on which the IC chip 4 is mounted, compared to a conventional package type IC. Since this size is slightly larger than the IC chip 4, it is possible to increase the density over a wide area. or,
For thermal protection of the IC chip 4, heat is radiated directly to the heat sink 8 via the heat sink 7, so there is no need to worry about thermal damage.

又、ＩＣチップ４そのものを実装させるので従来めよう
なプラスチックモールド等の外装の必要がな（ＩＣコス
トの低減というメリットもあり、装置全体のコストダウ
ン効果も大きい。その上、第２プリント基板６は放熱板
８と一体とすることにより、完成後の半導体装置は外的
圧力に対しても非常に強固となり信頼性の向上にもつな
がる。ここでは表示装置におけるドライバーＩＣの半導
体装置の構成について述べたが、これにかかわらず、本
発明はドライバーＩＣを多数必要とする装置であれば半
導体装置の小型・軽量化等が可能となることはいうまで
もない。In addition, since the IC chip 4 itself is mounted, there is no need for an exterior such as a conventional plastic mold. By integrating it with the heat dissipation plate 8, the semiconductor device after completion becomes extremely strong against external pressure, which also leads to improved reliability.Here, we will discuss the structure of the semiconductor device of the driver IC in the display device. However, regardless of this, it goes without saying that the present invention makes it possible to reduce the size and weight of a semiconductor device if the device requires a large number of driver ICs.

発明の効果 以上の説明から明らかなように、本発明によれば実装プ
リント基板でのドライバーＩＣの高密度化が可能であシ
、大巾な小型・軽量化をはかることができる。又、ＩＣ
チップそのものの実装であ６ベー・ ることがら駆動回路のコストダウン効果も高い等多くの
利点を有するものである。Effects of the Invention As is clear from the above description, according to the present invention, it is possible to increase the density of the driver IC on the mounted printed circuit board, and it is possible to significantly reduce the size and weight of the driver IC. Also, IC
It has many advantages, such as the fact that the chip itself can be mounted in a 6-basis area, and the cost reduction effect of the drive circuit is also high.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来例におけるドライバーＩＣを実装した半導
体装置の斜視図、第２図は本発明の一実施例における半
導体装置の分解斜視図、第３図は同装置の断正面図、第
４図は同装置の斜視図である。 ４・・・・・・ドライバーＩＣチップ、５・・・・・・
第１プリント基板、６・・・・・・第２プリント基板、
７・・・・・・放熱剤、８・・・・・・放熱板、１０・
・・・・・穴。 代理人の氏名　弁理士　中　尾　敏　男　ほか１名ＷＡ
１図 第２図 ル゛ｑり久ｌ・ ０ ｂｉｈｉｈｔｕｉｎｈ’　ｇ ・ＬＪ：ｎｑ １ｍ３図 第４図FIG. 1 is a perspective view of a semiconductor device mounted with a conventional driver IC, FIG. 2 is an exploded perspective view of a semiconductor device according to an embodiment of the present invention, FIG. 3 is a sectional front view of the same device, and FIG. 4 is a perspective view of the same device. 4... Driver IC chip, 5...
1st printed circuit board, 6... 2nd printed circuit board,
7... Heat dissipation agent, 8... Heat dissipation plate, 10.
·····hole. Name of agent: Patent attorney Toshio Nakao and one other WA
1 Figure 2 Figure 2 LJ:nq 1m3 Figure 4

Claims (1)

【特許請求の範囲】[Claims] ＩＣチップを実装した第１プリント基板を、このＩＣチ
ップに対向する部分に穴を有する第２プリント基板に接
続すると共に、この第２プリント基板下に放熱板を配置
させ、前記穴に挿入された上記ＩＣチップと前記放熱板
間に放熱剤を介在させた半導体装置。A first printed circuit board on which an IC chip is mounted is connected to a second printed circuit board having a hole in a portion facing the IC chip, and a heat sink is placed under the second printed circuit board, and the heat sink is inserted into the hole. A semiconductor device in which a heat sink is interposed between the IC chip and the heat sink.
JP25134183A 1983-12-29 1983-12-29 Semiconductor device Pending JPS60143651A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25134183A JPS60143651A (en) 1983-12-29 1983-12-29 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25134183A JPS60143651A (en) 1983-12-29 1983-12-29 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS60143651A true JPS60143651A (en) 1985-07-29

Family

ID=17221378

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25134183A Pending JPS60143651A (en) 1983-12-29 1983-12-29 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS60143651A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991011091A1 (en) * 1990-01-16 1991-07-25 Cray Research, Inc. Board-mounted thermal path connector
EP0831530A3 (en) * 1996-09-19 2000-03-22 Murata Manufacturing Co., Ltd. Integrated dielectric substrate
AT512131A1 (en) * 2011-10-31 2013-05-15 Fronius Int Gmbh PLATINUM FOR INTEGRATION IN A POWER SOURCE

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991011091A1 (en) * 1990-01-16 1991-07-25 Cray Research, Inc. Board-mounted thermal path connector
EP0831530A3 (en) * 1996-09-19 2000-03-22 Murata Manufacturing Co., Ltd. Integrated dielectric substrate
AT512131A1 (en) * 2011-10-31 2013-05-15 Fronius Int Gmbh PLATINUM FOR INTEGRATION IN A POWER SOURCE
AT512131B1 (en) * 2011-10-31 2013-09-15 Fronius Int Gmbh PLATINUM FOR INTEGRATION IN A POWER SOURCE
CN104025441A (en) * 2011-10-31 2014-09-03 弗罗纽斯国际有限公司 Synchronous rectifier
JP2014533076A (en) * 2011-10-31 2014-12-08 フロニウス・インテルナツィオナール・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツングＦｒｏｎｉｕｓ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｇｍｂｈ Synchronous rectifier
US9595882B2 (en) 2011-10-31 2017-03-14 Fronius International Gmbh Synchronous rectifier

Similar Documents

Publication Publication Date Title
US5200809A (en) Exposed die-attach heatsink package
US5464054A (en) Spring clamp and heat sink assembly
US5969947A (en) Integral design features for heatsink attach for electronic packages
US6359334B1 (en) Thermally conductive adhesive tape for semiconductor devices and method using the same
US20060038202A1 (en) Heatsink apparatus and thermally-conductive intermediate material for dissipating heat in semiconductor packages
JPH11251483A (en) Semiconductor device
JPS60143651A (en) Semiconductor device
US6784536B1 (en) Symmetric stack up structure for organic BGA chip carriers
US6441480B1 (en) Microelectronic circuit package
JPH07235633A (en) Multi-chip module
JPH0448740A (en) Tab semiconductor device
JPH06268142A (en) Semiconductor device
JPS6136961A (en) Package for multichip integrated circuit
JPH0521666A (en) Semiconductor package provided with heat sink
JPH01282846A (en) Hybrid integrated circuit
JPH046105B2 (en)
JPH0878616A (en) Multi-chip module
JP3348581B2 (en) Ball grid array package type semiconductor device
JPH04241444A (en) Semiconductor device
JPH09246466A (en) Ic package device
JPH0430185B2 (en)
JPH11243162A (en) Ball grid array package provided with expansion buffering insert and manufacture thereof
JPH06291233A (en) Semiconductor device and manufacture thereof
JPH04124860A (en) Semiconductor package
KR100567045B1 (en) A package