JPS60137492U - heat dissipation device - Google Patents

heat dissipation device

Info

Publication number
JPS60137492U
JPS60137492U JP2425984U JP2425984U JPS60137492U JP S60137492 U JPS60137492 U JP S60137492U JP 2425984 U JP2425984 U JP 2425984U JP 2425984 U JP2425984 U JP 2425984U JP S60137492 U JPS60137492 U JP S60137492U
Authority
JP
Japan
Prior art keywords
heat dissipation
dissipation device
heat
radiator
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2425984U
Other languages
Japanese (ja)
Other versions
JPH0445279Y2 (en
Inventor
健次 山本
三浦　魁
砂間　隆一
Original Assignee
電設機器工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 電設機器工業株式会社 filed Critical 電設機器工業株式会社
Priority to JP2425984U priority Critical patent/JPS60137492U/en
Publication of JPS60137492U publication Critical patent/JPS60137492U/en
Application granted granted Critical
Publication of JPH0445279Y2 publication Critical patent/JPH0445279Y2/ja
Granted legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図および第２図は従来の放熱装置の斜視図、第３図
は本考案による放熱装置の一実施例を示す分解斜視図、
第４図は同上組立後の水平断面図、第５図は組立後のＡ
−Ａ線断面図、第６図は本考案の他の実施例を示す断面
図である。 １０・・・放熱装置、１１・・・放熱板、１２・・・放
熱器、１３．１４・・・側板部、１５・・・プリント基
板、１６・・・挿入溝兼ねじ孔、１９・・・カバー、２
２・・・ねじ孔、２４・・・切欠、２５・・・電子的素
子、２６・・・発熱素子。 １６　　　　　　　　　　　　　　　１１１ｏ　　　　
　１１　リｒ　　　リ【２７１２　−1 and 2 are perspective views of a conventional heat radiating device, and FIG. 3 is an exploded perspective view showing an embodiment of the heat radiating device according to the present invention.
Figure 4 is a horizontal sectional view of the same as above after assembly, Figure 5 is A after assembly.
6 is a sectional view showing another embodiment of the present invention. DESCRIPTION OF SYMBOLS 10... Heat dissipation device, 11... Heat sink, 12... Heat sink, 13.14... Side plate part, 15... Printed circuit board, 16... Insertion groove and screw hole, 19...・Cover, 2
2... Screw hole, 24... Notch, 25... Electronic element, 26... Heat generating element. 16 111o
11 ri r ri [2712 -

Claims (5)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）電子機器の筐体内に発熱素子を実装するものにお
いて、シャーシ利用の放熱板と煙突効果の放熱器とを一
体的に連続して構成してなることを特徴とする放熱装置
。(1) A heat dissipation device in which a heat generating element is mounted within a housing of an electronic device, characterized in that it is configured by integrally and continuously comprising a heat dissipation plate using a chassis and a chimney effect heat radiator. （２）煙突効果の放熱器は角筒状に形成してなる実用新
案登録請求の範囲第１項記載の放熱装置。(2) The heat radiator according to claim 1, wherein the chimney effect radiator is formed into a rectangular tube shape. （３）放熱板と放熱器は、アルミの押出成型されたもの
を所定長に切断してなる実用新案登録請求の範囲第１項
記載の放熱装置。(3) The heat dissipation device according to claim 1, wherein the heat dissipation plate and the heat dissipation device are formed by extruding aluminum and cutting it into a predetermined length. （４）放熱板は両側板部を一体に有し、この両側板部の
互いに相対する面に、プリント基板挿入溝を形成してな
る実用新案登録請求の範囲第１項記載の放熱装置。(4) The heat dissipation device according to claim 1, wherein the heat dissipation plate integrally has both side plate portions, and printed circuit board insertion grooves are formed on mutually opposing surfaces of the both side plate portions. （５）プリント基板挿入溝はカバー取付けねじ孔を兼用
してなる実用新案登録請求の範囲第４項記載の放熱装置
。(5) The heat dissipation device according to claim 4, wherein the printed circuit board insertion groove also serves as a cover mounting screw hole.
JP2425984U 1984-02-22 1984-02-22 heat dissipation device Granted JPS60137492U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2425984U JPS60137492U (en) 1984-02-22 1984-02-22 heat dissipation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2425984U JPS60137492U (en) 1984-02-22 1984-02-22 heat dissipation device

Publications (2)

Publication Number Publication Date
JPS60137492U true JPS60137492U (en) 1985-09-11
JPH0445279Y2 JPH0445279Y2 (en) 1992-10-23

Family

ID=30518250

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2425984U Granted JPS60137492U (en) 1984-02-22 1984-02-22 heat dissipation device

Country Status (1)

Country Link
JP (1) JPS60137492U (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55147750U (en) * 1979-04-09 1980-10-23
JPS5724080U (en) * 1980-07-18 1982-02-08
JPS5742215U (en) * 1980-08-23 1982-03-08

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55147750U (en) * 1979-04-09 1980-10-23
JPS5724080U (en) * 1980-07-18 1982-02-08
JPS5742215U (en) * 1980-08-23 1982-03-08

Also Published As

Publication number Publication date
JPH0445279Y2 (en) 1992-10-23

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