JPS60137200A - Ultrasonic probe - Google Patents
Ultrasonic probeInfo
- Publication number
- JPS60137200A JPS60137200A JP24699283A JP24699283A JPS60137200A JP S60137200 A JPS60137200 A JP S60137200A JP 24699283 A JP24699283 A JP 24699283A JP 24699283 A JP24699283 A JP 24699283A JP S60137200 A JPS60137200 A JP S60137200A
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric elements
- ultrasonic probe
- piezoelectric element
- ultrasonic
- piezoelectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 title claims abstract description 45
- 229910000679 solder Inorganic materials 0.000 claims abstract description 6
- 230000010287 polarization Effects 0.000 claims abstract description 4
- 238000013016 damping Methods 0.000 claims description 31
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000011888 foil Substances 0.000 claims description 3
- 230000008054 signal transmission Effects 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 abstract description 12
- 230000001070 adhesive effect Effects 0.000 abstract description 12
- 239000000463 material Substances 0.000 abstract description 9
- 229920000647 polyepoxide Polymers 0.000 abstract description 7
- 239000003822 epoxy resin Substances 0.000 abstract description 6
- 229910003781 PbTiO3 Inorganic materials 0.000 abstract description 2
- 238000010030 laminating Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 64
- 238000005520 cutting process Methods 0.000 description 12
- 238000002604 ultrasonography Methods 0.000 description 12
- 238000003745 diagnosis Methods 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000002405 diagnostic procedure Methods 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 235000021419 vinegar Nutrition 0.000 description 2
- 239000000052 vinegar Substances 0.000 description 2
- 230000002747 voluntary effect Effects 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 101100070115 Arabidopsis thaliana HACL gene Proteins 0.000 description 1
- 241000612182 Rexea solandri Species 0.000 description 1
- 235000002492 Rungia klossii Nutrition 0.000 description 1
- 244000117054 Rungia klossii Species 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000002872 contrast media Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 210000003238 esophagus Anatomy 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 210000000056 organ Anatomy 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000009291 secondary effect Effects 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 210000004872 soft tissue Anatomy 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 210000004003 subcutaneous fat Anatomy 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0611—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements in a pile
Abstract
Description
【発明の詳細な説明】
［発明の技術分野］
本発明はスキャン方式等の超音波診断装置に用いるのに
適した超音波探触子に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an ultrasonic probe suitable for use in an ultrasonic diagnostic apparatus such as a scan method.
［発明の技術的背景とその問題点］
近年、超音波診断法は、広く医学分野で使用される様に
なってきた。例えば体表面から、超音波パルスを体内に
発射し、生体内の音響的な情報を診断の要に供する診断
法が提案されている。この様な超音波診断装置はＸ線装
置に比べ、生体軟組織像を造影剤を用いることなしに、
容易に造影できる点、放射線障害がなく、取扱いが容易
である点、近年の超音波造影技術の進歩により、以前よ
り画質が向上した点などが見直され、医学分野における
臨床診断装置として一般化してきている。[Technical background of the invention and its problems] In recent years, ultrasonic diagnostic methods have come to be widely used in the medical field. For example, a diagnostic method has been proposed in which ultrasonic pulses are emitted into the body from the body surface and acoustic information inside the body is used for diagnosis. Compared to X-ray equipment, this type of ultrasound diagnostic equipment can capture soft tissue images of living bodies without using contrast agents.
It has become popular as a clinical diagnostic device in the medical field due to the fact that it can be easily imaged, has no radiation damage, is easy to handle, and has improved image quality due to recent advances in ultrasound contrast technology. ing.
しかし、これら従来の超音波診断装置は、殆んど生体表
面から超音波パルスを送受波する装置であるので、体表
面から深い位置の臓器の診断がむずかしく、且つ分解能
の優れた高い周波数の超音波診断ができないこと、骨、
気体の存在によって診断できない部位があること、個人
差の大きな皮下脂肪の影響をうけることなどの欠点があ
り、体腔内からの超音波診断が必要となり、体腔内に挿
入可能となる管状容器内に超音波を送受波する超音波探
触子を収容した体腔内超音波診断装置が製品化される様
になった。However, since most of these conventional ultrasonic diagnostic devices transmit and receive ultrasonic pulses from the surface of the body, it is difficult to diagnose organs deep from the body surface. The inability to perform ultrasound diagnosis, bones,
There are disadvantages such as the presence of gas in some parts of the body, which cannot be diagnosed, and the fact that the diagnosis is affected by subcutaneous fat, which varies greatly between individuals.Ultrasonic diagnosis from within the body cavity is required, and ultrasonic diagnosis is carried out in a tubular container that can be inserted into the body cavity. Intrabody cavity ultrasound diagnostic devices that house ultrasound probes that transmit and receive ultrasound waves have begun to be commercialized.
体腔外から体表面に当接させて上記超音波を送受波する
超音波探触子は、それ程小型化の必要がないが、食道等
を通して体腔内に挿入して使用する場合には小型のもの
が要求される。Ultrasonic probes that transmit and receive the above-mentioned ultrasonic waves by contacting the body surface from outside the body cavity do not need to be so miniaturized, but if they are used by being inserted into the body cavity through the esophagus etc., a small size is required. is required.
第１図は、体腔内等で使用される従来のアレイ型超音波
探触子の構造を示し、第２図は第１図の側面断面図を示
す。FIG. 1 shows the structure of a conventional array-type ultrasonic probe used inside a body cavity, and FIG. 2 shows a side sectional view of FIG. 1.
即ち、従来例のアレイ型超音波探触子１は、板状の厚み
方向に分極可能とされるＰＺＴ等の圧電素子板を板の垂
直方向から細い幅で薄く切断し、隣接するものとわずか
に離間するよう平行に整列したアレイ型の圧電素子２．
・・・、２が形成されている。各圧電素子２の厚み方向
の両面には銀等を蒸着等して電極３ａ 、３ｂが形成さ
れており、超音波が送受波される側の一方の電極３８面
はアース側１ｉａｉとされ、板状で導電性のフレキシブ
ル基板等で電極３ａが導通保持され、さらにフレキシブ
ル基板の上に各圧電素子２と同形状で細長に形成された
第１及び第２の音響的整合層５及び６を貼着する等して
８層層状に形成されている。That is, in the conventional array-type ultrasonic probe 1, a piezoelectric element plate made of PZT or the like, which can be polarized in the thickness direction of the plate, is cut thinly in a narrow width from the perpendicular direction of the plate. Array-type piezoelectric elements arranged in parallel so as to be spaced apart from each other 2.
..., 2 are formed. Electrodes 3a and 3b are formed on both sides in the thickness direction of each piezoelectric element 2 by vapor deposition of silver, etc., and one electrode 38 surface on the side where ultrasonic waves are transmitted and received is the ground side 1iai, and the plate The electrode 3a is held conductive by a conductive flexible substrate or the like, and first and second acoustic matching layers 5 and 6, which are elongated and have the same shape as each piezoelectric element 2, are attached on the flexible substrate. It is formed into 8 layers.
上記第２の整合ＷＪ６の上面には各圧電素子２の長手方
向の中央が凸となる音響レンズ７が形成されている。An acoustic lens 7 whose longitudinal center of each piezoelectric element 2 is convex is formed on the upper surface of the second alignment WJ6.
一方、上記各圧電素子２の正極側’ｌ１ｔｌｉ３ｂ面は
、絶縁性部材を用いた絶縁層８を介装してダンピング部
（層）９に固着されて各超音波振動子エレメントが形成
されている。On the other hand, the positive electrode side 'l1tli3b surface of each of the piezoelectric elements 2 is fixed to a damping part (layer) 9 with an insulating layer 8 made of an insulating material interposed therebetween to form each ultrasonic transducer element. .
上記正極側電極３ｂはフレキシブルリード１０ｂによっ
て長手方向の両側からダンピング部９の裏面側に引き出
され、又、アース側１ＨＭ３ａもフレキシブルリード１
０ａで、裏面側に引き出されている。The positive side electrode 3b is pulled out from both sides in the longitudinal direction to the back side of the damping part 9 by a flexible lead 10b, and the ground side 1HM3a is also pulled out from the flexible lead 10b.
At 0a, it is pulled out to the back side.
上記絶縁層８の両側のすき間には、エポキシ系等の接着
剤１１を用いて絶縁層８をダンピング層９に固着しであ
る。In the gaps on both sides of the insulating layer 8, the insulating layer 8 is fixed to the damping layer 9 using an adhesive 11 such as an epoxy adhesive.
上記第１及び第２の整合層５及び６は、音響レンズ７の
前面（上面）が当接される体腔内壁等に圧電素子２から
送波（及び受波）される超音波を（反射を少くして）能
率良く体腔内壁側に伝達できるように、圧電素子２と体
腔内壁との音響インピーダンスの中間の値に設定され、
２層の整合層５．６にすることによってより円滑に整合
できるようにしである。The first and second matching layers 5 and 6 transmit (reflect) the ultrasonic waves transmitted (and received) from the piezoelectric element 2 to the inner wall of the body cavity, etc., which the front surface (upper surface) of the acoustic lens 7 contacts. In order to efficiently transmit the acoustic impedance to the inner wall of the body cavity, the acoustic impedance is set to a value intermediate between the acoustic impedance of the piezoelectric element 2 and the inner wall of the body cavity.
By using two matching layers 5 and 6, smoother matching can be achieved.
上記ダンピング層９は、各圧電素子２が両電極３ａ、３
ｂに印加された高周波パルスによって励振して超音波を
送出する際、裏面側に送出された超音波を速やかにダン
ピングさせて、ダンピング層９の裏面で反射されたもの
が受波されて分解能を悪化するのを防止するためのもの
である。このダンピング層９は、体腔外での使用におい
てはその厚みを大きくして十分な減衰機能を有するよう
にできるが、体腔内で使用する場合には最も嵩ばる部材
となるので厚みの少いものが要求される。In the damping layer 9, each piezoelectric element 2 has both electrodes 3a, 3
When excited by the high frequency pulse applied to b and sending out ultrasonic waves, the ultrasonic waves sent out to the back side are quickly damped, and the waves reflected on the back side of the damping layer 9 are received and improve the resolution. This is to prevent it from getting worse. This damping layer 9 can be made thicker to have a sufficient damping function when used outside the body cavity, but when used inside the body cavity, it is the bulkiest member, so a thinner layer is recommended. is required.
この場合、ダンピング層９の材質として、タングステン
粉末をエポキシ、シリコーン、塩化ビニル樹脂等に該タ
ングステン粉末の分散量を重量比で９０〜９５％前後と
なるように分散したものを用いることによりほぼ満足で
きる減衰量を実現できるようにしである。In this case, as the material of the damping layer 9, it is almost satisfactory to use a material in which tungsten powder is dispersed in epoxy, silicone, vinyl chloride resin, etc. so that the amount of the tungsten powder dispersed is about 90 to 95% by weight. This is so that the amount of attenuation that can be achieved can be achieved.
上記材質のダンピング層９の場合には、その電気抵抗が
低いので、人体に対する安全対策上、超音波送受面側の
アース電位側となり、ダンピング層９側が正極側に設定
されるので、ダンピング層９が直接正極側に接触すると
、該ダンピング層９を形成する部材の低い抵抗（インピ
ーダンス）によってアレイ状に分割された各超音波振動
子エレメントが導通してしまう不都合が生じるため、上
記絶縁層８によって絶縁している。In the case of the damping layer 9 made of the above material, its electrical resistance is low, so for safety measures against the human body, the ultrasonic transmitting and receiving surface side is on the earth potential side, and the damping layer 9 side is set as the positive electrode side, so the damping layer 9 If the damping layer 9 comes into direct contact with the positive electrode side, the low resistance (impedance) of the member forming the damping layer 9 causes the inconvenience that each ultrasonic transducer element divided into an array becomes electrically conductive. Insulated.
しかして、各超音波振動子は、各エレメント間のクロス
トークを防ぐために、隣接する各エレメント間には空隙
部がそれぞれ形成されており、この場合圧電素子２．２
間のみに空隙部１２を設ける場合よりも、第１及び第２
の整合層５．６を含めた３層にわたって空隙部１２を形
成することによって、より確実にクロス１ヘークを防止
できるようにしである。Therefore, in each ultrasonic transducer, in order to prevent crosstalk between each element, a gap is formed between each adjacent element, and in this case, the piezoelectric element 2.
Compared to the case where the cavity 12 is provided only between the first and second
By forming the void portion 12 over three layers including the matching layer 5.6, cross-1 hake can be more reliably prevented.
ところで、上記絶縁層８によって、正極側電極３ｂが短
絡するのを防止しているが、他に次のような副次的な作
用も有する。Incidentally, although the insulating layer 8 prevents the positive electrode 3b from being short-circuited, it also has the following secondary effects.
即ち、電子セクタスキャン方式に用いる超音波探触子は
サイドローブ押圧のため、通常次式を満足する様に各圧
電素子２間のピッチが設計される。That is, since the ultrasonic probe used in the electronic sector scan method uses sidelobe pressure, the pitch between each piezoelectric element 2 is usually designed to satisfy the following equation.
Ｓ／λ＜１／（１＋１ｓｉｎθ１）
Ｓ：切断ピッチ、λ：用いる超音波の波長、θ：１７２
走査角である。S/λ<1/(1+1 sin θ1) S: cutting pitch, λ: wavelength of ultrasonic wave used, θ: 172
is the scanning angle.
上記のく不等）式から超音波の周波数を５ＭＨｚ、音速
を１５００ｍ ／ｓｅｃとした時、波長ハλ＝０．３ｎ
ｕｎとなり、θ−４５° （走査角９０°）とすると、
Ｓ＜０．１７６ｍｍ
となる。一方、各圧電素子２の共振周波数を５ＭＨｚに
するには圧電素子２の厚みを０．３〜０゜４１１ＩＩｌ
１程度にする必要がある。更に１／４λの厚みを持った
音響整合層５．６を２層用いると、厚層で０．４〜０．
４５１ａｍとなり、合計０．７〜０゜８５１ＩＩｌの厚
さとなってしまい、１つのエレメントについて見れば幅
が前記０．１７６ｍｍのピッチにするためには切断刃の
厚さ分０．０５ｍｍを差し引いた０、１２６ｍｍで、高
さ０．７〜０．８５ｍｍという薄片積層薄片状の構成に
しなければならないことになる。通常この様な構造にす
るのには各層を積層後一括して切断するが、仮に圧電素
子が比較的弾力性を有するダンピング層９に直接接着す
ると、切断時の流水圧力や微小な振動によってわずかに
傾き、この為正常な切断が行われない様になる。弾力性
を有しない絶縁性のダンピング層を用いれば良いが、例
えば超音波内視鏡に用いる詩の様に小型化の要求が非常
に強い時、探触子のうち最大の容積を占めるダンピング
層については極力小型化する必要があり、上述のように
ダンピング層の材質として優れたタングステンをエポキ
シ材料等に９０％以上入れた複合材料を用いればならな
くなっている。以上の様な点即ち、導電性ダンピング層
９による正極側筒ｔｍ ３ ａの各エレメント間の導通
及び弾力性を有するダンピング材を用いることによる切
断加工性を改善する為、やむなく絶縁層８を用いている
のである。この絶縁層８を用いることによって、上記問
題点は共に解決される。しかしながら、絶縁層８が一層
余分に入れることによって、その接着剤（図示せず）を
入れると、２層増加することになり、この為、超音波パ
ルス波形の乱れが発生することを回避することは出来に
くくなる。From the above equation, when the frequency of the ultrasonic wave is 5 MHz and the speed of sound is 1500 m/sec, the wavelength is λ = 0.3n.
If it is θ-45° (scanning angle 90°), then S<0.176 mm. On the other hand, in order to set the resonance frequency of each piezoelectric element 2 to 5MHz, the thickness of the piezoelectric element 2 should be 0.3 to 0°411IIl.
It needs to be around 1. Furthermore, when two acoustic matching layers 5.6 with a thickness of 1/4λ are used, the thickness of the thick layer is 0.4 to 0.
451am, resulting in a total thickness of 0.7 to 0°851IIl.If we look at one element, in order to make the width pitch 0.176mm, we need to subtract 0.05mm for the thickness of the cutting blade. , 126 mm, and a height of 0.7 to 0.85 mm. Normally, to create such a structure, each layer is laminated and then cut all at once. However, if the piezoelectric element were directly bonded to the damping layer 9, which has relatively elasticity, it would be slightly damaged by the pressure of running water and minute vibrations during cutting. This causes the blade to tilt to the side, which prevents proper cutting. An insulating damping layer with no elasticity may be used, but when there is a strong demand for miniaturization, such as in ultrasonic endoscopes, the damping layer, which occupies the largest volume of the probe, may be used. It is necessary to miniaturize the damping layer as much as possible, and as mentioned above, it is necessary to use a composite material in which 90% or more of tungsten, which is excellent as a material for the damping layer, is contained in an epoxy material or the like. In order to improve the electrical continuity between the elements of the positive electrode side tube tm 3 a due to the conductive damping layer 9 and the cutting workability due to the use of a damping material having elasticity, the insulating layer 8 is unavoidably used. -ing By using this insulating layer 8, both of the above problems are solved. However, by adding an extra layer of the insulating layer 8 and adding the adhesive (not shown), the number of layers increases by two, which prevents disturbances in the ultrasonic pulse waveform. becomes difficult to do.
又、一層余分に入れることによる製造工数の増加によっ
てコストアップもまぬがれない。更に、工程の複雑化に
よる歩留りの低下、信頼性の低下も招来してしまうこと
のなるという欠点がある。In addition, the cost increases due to the increase in manufacturing man-hours due to the addition of an extra layer. Furthermore, there is a drawback that the process becomes more complicated, resulting in lower yield and lower reliability.
一方、５ＭＨｚ以上の高周波セクタ走査用接触子に於い
て、上述の様に、各圧電素子２エレメントの幅は０．１
７６ｍｎ＋と非常に薄く、しかも電極間距離が０．３〜
０．４ｍ１ｌｌと大きい為、空気容量が極めて小さくな
る。このことは以下の理由でエネルギー変換効率のロス
につながり、少しでも容量を大きくした方が良い。On the other hand, in the contact for high-frequency sector scanning of 5 MHz or higher, as mentioned above, the width of each two piezoelectric elements is 0.1
Very thin at 76mm+, and the distance between electrodes is 0.3~
Since it is large at 0.4ml, the air capacity is extremely small. This leads to a loss in energy conversion efficiency for the following reasons, so it is better to increase the capacity as much as possible.
即ち、超音波内視鏡に用いる場合接触子には体外用と異
って、スペースの制約から、空気的整合用のコイルを近
接して設置することが出来ない。That is, when used in an ultrasonic endoscope, a coil for pneumatic matching cannot be placed close to the contactor due to space constraints, unlike when used outside the body.
この為、駆動回路との整合は探触子の各圧電素子エレメ
ントに接続されているリード線を介して行われることに
なり、リード線の有する浮遊容量が並列に入ることにな
る。第３図はこの様子を等価回路で表わしたもので、等
価容１ｍＧｏ 、Ｃ＋ 、等価インダクタンスＬ＋、等
価抵抗Ｒ１からなる各圧電素子２の等価回路部１４に、
並列の浮遊容量ＣＬが付加されたものとなる。この浮遊
容Ｊｉ ＣＬは、リード線の長さに比例し、内視鏡の如
く、長いリード線が必要の場合、圧電素子の容量の４〜
５倍の容量を持つようになる。この様な場合には超音波
励振用の印加電圧は浮遊容ＨＡ ＣＬの有無にかかわら
ず、同一になるが、電流値については殆んど圧電素子２
を通らず、リード線の浮遊容量ＣＬの方を通ることにな
る。このため探触子のエネルギー変換効率を考えると、
圧電素子の容量を少しでも大きくして変換効率を高め、
ＳＮ比の良好な超音波断層像を得る必要があった。Therefore, matching with the drive circuit is performed through the lead wires connected to each piezoelectric element of the probe, and the stray capacitance of the lead wires is introduced in parallel. FIG. 3 shows this situation using an equivalent circuit. In the equivalent circuit section 14 of each piezoelectric element 2, which consists of an equivalent capacitance of 1 mGo, C+, an equivalent inductance L+, and an equivalent resistance R1,
A parallel stray capacitance CL is added. This floating capacitance Ji CL is proportional to the length of the lead wire, and when a long lead wire is required, such as in an endoscope, the capacitance of the piezoelectric element is 4~
It will have 5 times the capacity. In such a case, the applied voltage for ultrasonic excitation will be the same regardless of the presence or absence of the stray capacitance HACL, but the current value will almost always be
Instead, it passes through the stray capacitance CL of the lead wire. Therefore, considering the energy conversion efficiency of the probe,
Increase the conversion efficiency by increasing the capacitance of the piezoelectric element as much as possible,
It was necessary to obtain an ultrasonic tomographic image with a good signal-to-noise ratio.
［発明の目的］
本発明は上述した点にかんがみてなされたちので、簡単
な構造でエネルギー変換効率が高く、且つ信頼性の高い
超音波探触子を提供することを目的とする。[Object of the Invention] The present invention has been made in view of the above-mentioned points, and an object of the present invention is to provide an ultrasonic probe that has a simple structure, high energy conversion efficiency, and high reliability.
Ｕ発明の概要］
本発明は音響的整合層、圧電素子部、ダンピング層が積
層状にされた超音波探触子において、前記圧電素子部を
分極方向が逆方向になる様に２枚の圧電素子を貼り合わ
せ、且つ内側の電極を厚み方向における両圧電素子の共
通の非アース側Ｎ＠とし、他の外側の２面のをアース側
の共通電極にする構造のものを単位構成として少くとも
１層設けることによって、絶縁層を不要にすると共に、
超音波送受信号の増大を可能にしてＳＮ比の大きな超音
波信号像を得ることができるようになっている。U Overview of the Invention] The present invention provides an ultrasonic probe in which an acoustic matching layer, a piezoelectric element portion, and a damping layer are laminated, in which two piezoelectric sheets are used so that the piezoelectric element portion is polarized in opposite directions. At least a unit configuration in which the elements are bonded together, and the inner electrode is used as the common non-ground side N@ of both piezoelectric elements in the thickness direction, and the other two outer surfaces are used as the common electrode on the earth side. By providing one layer, an insulating layer is not required, and
It is now possible to increase the number of ultrasound transmitted and received signals, thereby making it possible to obtain an ultrasound signal image with a high signal-to-noise ratio.
［発明の実施例コ 以下、図面を参照して本発明を具体的に説明する。[Embodiments of the invention] Hereinafter, the present invention will be specifically explained with reference to the drawings.
第４図ないし第６図は本発明の第１実施例に係り、第４
図は第１実施例のアレイ型超音波探触子を示し、第５図
は第４図のＡ−Ａ線側面断面を示し、第６図はＮ極取付
は部分周辺を拡大して示す。4 to 6 relate to the first embodiment of the present invention, and FIG.
The figure shows the array type ultrasonic probe of the first embodiment, FIG. 5 shows a side cross section taken along the line A--A in FIG. 4, and FIG. 6 shows an enlarged view of a portion of the periphery where the N pole is attached.
尚、第１図に示す従来例と同一部材には同符号を付けて
示す。Incidentally, the same members as those in the conventional example shown in FIG. 1 are denoted by the same reference numerals.
第４図に示すように第１実施例のアレイ型超音波探触子
２１は、第１図における圧電素子板と絶縁層８の部分に
、ｐｚ丁、Ｐｂ Ｔｉ Ｏ３等の圧電材料を、その分極
方向が互いに逆向き（第６図において矢符で示す）にな
る様にして、厚さ方向に２枚の圧電素子２２ａ、２２ｂ
がエポキシ樹脂接着剤、導電性接着剤、あるいは半田等
で接合して接合部分が共通の電極となるようにして介装
されている。尚、エポキシ樹脂は絶縁性であるが、加圧
硬化することによって実質的に接合面を互いに導通でき
ることは圧電ブザーにおける金属板と圧電板の接合で行
われているように公知のものである。As shown in FIG. 4, the array-type ultrasonic probe 21 of the first embodiment has a piezoelectric material such as PZD, PbTiO3, etc. in the piezoelectric element plate and insulating layer 8 in FIG. Two piezoelectric elements 22a and 22b are connected in the thickness direction so that their polarization directions are opposite to each other (indicated by arrows in FIG. 6).
The electrodes are joined together using epoxy resin adhesive, conductive adhesive, solder, etc., and the joined portions are interposed as common electrodes. Although epoxy resin is insulative, it is well known that by curing under pressure, the bonded surfaces can be substantially electrically connected to each other, as is done in bonding a metal plate and a piezoelectric plate in a piezoelectric buzzer.
尚、２枚の圧電素子２２ａ、２２ｂを貼り合わせて形成
した圧電素子部の全体の厚みは、使用する周波数をす０
とし、圧電材料での音速をＣとすると（１／２＞（ｃ／
す。 ）Ｘｉ、２としである。Note that the total thickness of the piezoelectric element portion formed by bonding two piezoelectric elements 22a and 22b is determined by the frequency used.
If the sound velocity in the piezoelectric material is C, then (1/2>(c/
vinegar. ) Xi, 2.
上記圧電素子部を形成する２枚の圧電素子２２ａ、２２
ｂの外側となる各面には真空蒸着（又はスパッタリング
、場合によっては接着剤）によってアース側となる電極
２３ａ、２３ｂが形成されている。このように２枚の圧
電素子２２ａ、２２ｂを貼り合わせたものの一方の電ａ
２３ ｂ面にガラスとか結晶化ガラスからなる第１の
音響的整合層５と、エポキシ樹脂、アクリル樹脂等から
なる第２の音響的整合層６とが接着等して設けられてい
る。他方の電ｔＭ ２．３ ＋）面には、ダンピング層
９にエポキシ樹脂接着剤等の接着剤で接着されている。Two piezoelectric elements 22a, 22 forming the piezoelectric element part
Electrodes 23a and 23b, which are on the ground side, are formed on each outer surface of b by vacuum evaporation (or sputtering, or adhesive in some cases). When the two piezoelectric elements 22a and 22b are bonded together in this way, one of the electrodes a
A first acoustic matching layer 5 made of glass or crystallized glass and a second acoustic matching layer 6 made of epoxy resin, acrylic resin, etc. are bonded and provided on the 23 b surface. The other electric tM 2.3 +) surface is bonded to a damping layer 9 with an adhesive such as an epoxy resin adhesive.
又、各圧電素子２２ａ、２２ｂに電気信号を印加して超
音波を送出するためと、受波した超音波が電気信号に変
換された該電気信号を取り出せるように、内側の電極２
４面（後述するように細幅に裁断されるが裁断で残る部
分）にストリップ電極列（又は電極線群）２５．・・・
、２５を半田等で取り付けると共に、上部測置１ｉ２３
ａにもストリツブ電極線２６を半田等で取り付は信号伝
達線を形成しである。この場合、アース側電極線２６部
分と重なる電極列２５．・・・、２５部分は被覆したり
、絶縁板等を介装されている（図示路）。In addition, the inner electrode 2 is used to apply an electric signal to each piezoelectric element 22a, 22b to send out an ultrasonic wave, and to extract the electric signal obtained by converting the received ultrasonic wave into an electric signal.
Strip electrode rows (or electrode wire groups) 25. ...
, 25 with solder etc., and the upper measurement 1i23
Also, the strip electrode wire 26 is attached to a by soldering or the like to form a signal transmission line. In this case, the electrode row 25. which overlaps with the ground side electrode wire 26 portion. . . , 25 portion is covered or interposed with an insulating plate or the like (as shown).
上記２枚の圧電素子２２ａ、２２ｂを接合し、その一方
の電極２３ａ面に第１及び第２の整合層５．６を設け、
他方の電極２３ｂ而をダンピング層９に接着した積層体
を所定のピッチに合わせて裁断することによって（第４
図において紙面と平行方向の切断面）、第４図における
紙面垂直方向の断面がそれぞれ隣接するものと微小間隔
をへだててくしの歯状に細長の圧電素子エレメント２２
ａ 、−，２２ａ 、２２ｂ 、 ・ ２２ｂがアレイ
状に多数形成されたアレイ型圧電素子が第５図に示すよ
うに形成される（上記切断前において用いた圧電素子２
２ａ、２２ｂは、厳密には圧電素子板に相当するが、同
符号で表わす。）。The two piezoelectric elements 22a and 22b are joined together, and first and second matching layers 5.6 are provided on the surface of one of the electrodes 23a,
By cutting the laminate in which the other electrode 23b is adhered to the damping layer 9 to a predetermined pitch (the fourth
The piezoelectric element element 22 is elongated in the shape of a comb and is spaced apart from the adjacent one by a minute distance, and the cross section in the direction perpendicular to the paper surface in FIG.
An array-type piezoelectric element in which a large number of a, -, 22a, 22b, and 22b are formed in an array is formed as shown in FIG.
Strictly speaking, 2a and 22b correspond to piezoelectric element plates, but are represented by the same symbols. ).
上記裁断する深さは、２枚の圧電素子２２ａ。The cutting depth is two piezoelectric elements 22a.
２２ｂのうち、ダンピング層９に近い側の圧電素子２２
ｂの電極２３ｂ面までは到達してない深さく第５図に示
すもの）としても良いし、ダンピング層９まで到るよう
に形成しても良い。もっとも、ダンピング層９は、通常
ダンピング効果を高める為にタングステン粉末をエポキ
シ及びシリコーン樹脂に高い混合比で分散させであるの
で、切断時に刃が摩耗しやすく、その結果多数の圧電素
子エレメント２２ａ 、−，２２ａ 、２２ｂ 、−，
２２ｂアレイを形成する必要のある時、切断深さを一定
にすることが難しく、各エレメント間の音響的性能に差
がでてくることになる。従ってこの様な場合は切断深さ
は圧電素子２２ｂの電極２３ｂ面より若干上側となる（
第５図に示すような位置に止める方が好ましい。）。22b, the piezoelectric element 22 on the side closer to the damping layer 9
It may be formed to a depth that does not reach the surface of the electrode 23b (as shown in FIG. 5), or it may be formed so as to reach the damping layer 9. However, since the damping layer 9 is usually made by dispersing tungsten powder in epoxy and silicone resin at a high mixing ratio in order to enhance the damping effect, the blade is likely to wear out during cutting, resulting in a large number of piezoelectric elements 22a, - , 22a , 22b , -,
When a 22b array needs to be formed, it is difficult to maintain a constant cutting depth, resulting in differences in acoustic performance between each element. Therefore, in such a case, the cutting depth will be slightly above the surface of the electrode 23b of the piezoelectric element 22b (
It is preferable to stop at the position shown in FIG. ).
この様にして目的のエレメント数に切断した後、シリコ
ーンレンズ７をエポキシ樹脂等の接着剤で該接着剤が切
断溝に入り込まない様接着されて、アレイ型超音波探触
子２１が形成される。After cutting into the desired number of elements in this manner, the silicone lens 7 is glued with an adhesive such as epoxy resin so that the adhesive does not enter the cutting groove, thereby forming the array type ultrasonic probe 21. .
尚、２枚を接合した構造の各圧電素子エレメント２２ａ
、２２ｂの外側の両面は、第４図及び第６図に示すよう
に非アース側電極列２５．・・・２５の反対側端部（右
側側部）において、帯状の金属箔２７を折り返すように
して各ｆｉＭ部側を半田付は等して導通させである。Note that each piezoelectric element 22a has a structure in which two pieces are joined.
, 22b are provided with non-ground side electrode rows 25., 22b, as shown in FIGS. 4 and 6. . . . At the opposite end (right side) of 25, the band-shaped metal foil 27 is folded back and each fiM part side is soldered equally to make it electrically conductive.
又、非アース側の各電極列２５は、第４図又は第６図の
拡大図に示すようにｆｉｌｌする上部側の圧電素子エレ
メント２２ａより、下部側圧電素子エレメント２２ｂの
一方の端部を突出させることによって、（形成した）両
者に長さの差部となる突部上面端部に取付けるようにし
である。尚、アース側電極線２６はフレキシブルな板状
部材として電極２３ａ面に取り付け、カッタによる各圧
電素子エレメント２２ａ及び２２ｂ形成の際の裁断によ
って、上部側が切り込まれたものとしても良い。In addition, each electrode row 25 on the non-ground side has one end of the lower piezoelectric element 22b protruding from the upper piezoelectric element 22a that fills, as shown in the enlarged view of FIG. 4 or FIG. By doing so, it is attached to the end of the upper surface of the protrusion that is the difference in length between the two (formed). The ground side electrode wire 26 may be attached to the surface of the electrode 23a as a flexible plate-like member, and the upper side may be cut by a cutter when forming the piezoelectric elements 22a and 22b.
このように構成された第１実施例によれば、従来例にお
ける絶縁層を不要とすると共に、２層にわたって圧電素
子エレメント２２ｂ、２２ｂを設けであるので、浮遊容
−の値は殆んど変化させることなく、圧電素子エレメン
ト２２ａ、２２ｂの等価容量を略２倍にでき、超音波励
振用（送出用）のパルス信号（パルス電圧）の印加によ
って、従来例よりも略２倍の強度を有する超音波を送出
できる（積層状に接合された両圧電素子エレメント２２
ａ、２２ｂには互いに逆極性でパルス電圧が印加される
が、互いに極方向に分極するようにして取付けであるの
で、全体としては単一の圧電素子エレメントの様に励振
される。）。又、受波する場合も２層で受けることにな
るので、略２倍の強度の電気信号を得ることができるの
で、第１実施例のアレイ型超音波探触子２１を用いると
、ＳＮ比の大きい超音波像を得ることができる。従って
超音波診断装置に用いると、鮮明な超音波断層像を得る
ことができ、的確な診断をし易いものとナル。 尚、Ｉ
ｔ１２３ａ 、−２３ｂ 、２４．？ｌｌら（７）ｔｉ
極線２６あるいは２５等の取付は構造は上述のものに限
らず、例えば第７図に示す第２実施例のような構造にす
ることもできる。According to the first embodiment configured in this way, the insulating layer in the conventional example is not required, and the piezoelectric elements 22b, 22b are provided over two layers, so that the value of stray capacitance hardly changes. The equivalent capacitance of the piezoelectric elements 22a and 22b can be approximately doubled without causing any damage, and by applying a pulse signal (pulse voltage) for ultrasonic excitation (sending), the strength is approximately twice that of the conventional example. Ultrasonic waves can be transmitted (both piezoelectric elements 22 joined in a laminated manner)
Pulse voltages with opposite polarities are applied to a and 22b, but since they are attached so that they are polarized in the polar directions, the piezoelectric element as a whole is excited like a single piezoelectric element. ). Furthermore, since the waves are received in two layers, it is possible to obtain electrical signals with approximately twice the strength. Large ultrasound images can be obtained. Therefore, when used in an ultrasonic diagnostic device, clear ultrasonic tomographic images can be obtained, making it easy to make accurate diagnoses. Furthermore, I
t123a, -23b, 24. ? ll et al. (7) ti
The structure for attaching the polar wires 26, 25, etc. is not limited to the above-mentioned structure, but may also be structured as in the second embodiment shown in FIG. 7, for example.
即も、第７図に示す超音波探触子３１（の一部）におい
ては、両アース側電極２３ａ 、２３ｂを一方の端面（
側面）に沿わせるように延出させ、これ両端部を途中（
例えば中央）で半田３２付けあるいは導電性接着剤等で
導通させである。この場合、内側の非アース側電極２４
は、上記端面には届かないように、端面より内側にとど
めて短絡しない様にしである。又、他方の端部側におけ
る各電極線２５も、端面（側面〉に沿うように取付けて
あり、この場合にも下部側のアース電極２３ｂは該端部
に届かないように形成しである。く尚、ダンピング層９
に接する部分は雲母板等の絶縁板を介装したり、テフロ
ンフィルム等を介装したりしである。）その他は上記第
１実施例と同様の構成であり、その作用効果も略同様の
ものとなる。In the ultrasonic probe 31 (a part of it) shown in FIG.
(side), and extend both ends along the middle (
For example, solder 32 (for example, in the center) or conductivity can be established using a conductive adhesive or the like. In this case, the inner non-ground electrode 24
is kept inside the end surface so as not to reach the end surface, so as not to cause a short circuit. Further, each electrode wire 25 on the other end side is also attached along the end surface (side surface), and in this case also, the ground electrode 23b on the lower side is formed so as not to reach the end. Additionally, damping layer 9
The portion that comes into contact with is interposed with an insulating plate such as a mica plate, or with a Teflon film or the like. ) The rest of the structure is the same as that of the first embodiment, and the operation and effect thereof are also substantially the same.
上記第７図に示すものに限らず、第８図又は第９図にそ
れぞれ示す第３実施例あるいは第４実施例のような構造
にすることもできる。そのようにしても略同様の作用効
果を得ることができる。The structure is not limited to that shown in FIG. 7, but may also be structured as in the third or fourth embodiment shown in FIG. 8 or 9, respectively. Even in this case, substantially the same effects can be obtained.
第８図に示す第３実施例においては、上記第１実施例に
おける積層状にした２枚の圧電素子２２ｄ、２２ｂにお
ける上部側の圧電素子２２ａを一方に突出させ、電極線
２５を下部側の圧電素子２２ｂ端面に沿わせることなく
、取付けたものである。他方の端部側は上記第１実施例
と同様であり、その他の構成も同様である。In the third embodiment shown in FIG. 8, the upper piezoelectric element 22a of the two laminated piezoelectric elements 22d and 22b in the first embodiment is made to protrude to one side, and the electrode wire 25 is connected to the lower part. The piezoelectric element 22b is attached without being placed along the end face. The other end side is the same as that of the first embodiment, and the other configurations are also the same.
第９図に示す実施例においては、各圧電素子２２ａ、２
２ｂのアース側電極２３ａ 、２３ｂを一方の端部にお
いては端面を沿わせて、内側、つまり非アース側電極２
４面にまで達するように延在させてあり、この部分から
微小間隔を隔てて非アース側電極が形成しである。その
他は上記第２実施例と同様である。In the embodiment shown in FIG. 9, each piezoelectric element 22a, 2
The ground side electrodes 23a and 23b of 2b are placed on the inner side, that is, the non-ground side electrode 2, with the end surfaces aligned at one end.
It extends to reach all four sides, and a non-ground side electrode is formed at a very small distance from this part. The rest is the same as the second embodiment.
尚、電極線２５．２６は、例えばテフロン等のフレキシ
ブル基板の外側の面にプリントパターン状（全面でも良
い）のアースラインを、内側に微小ピッチでライ群状に
形成したプリントパターンを利用することもできる。こ
の場合、各電極２３ａ、２３ｂ、２４等への接続部分は
リード線で行えば良い。尚、非アース側電極！２５は、
上述のように一方の端部側から引き出すのに限らず、他
方の端部側から引き出したり、両端部を用いて交互に引
き出して、各隣接するピッチ間隔を大きくすることもで
きる。For the electrode wires 25 and 26, use a printed pattern in which a ground line in the form of a printed pattern (or the entire surface may be formed) is formed on the outside surface of a flexible substrate such as Teflon, and a line group is formed at a minute pitch on the inside. You can also do it. In this case, the connections to the electrodes 23a, 23b, 24, etc. may be made using lead wires. In addition, the non-ground side electrode! 25 is
It is not limited to pulling out from one end side as described above, but it is also possible to pull out from the other end side or alternately using both ends to increase the pitch interval between adjacent ones.
尚、上述においては、各圧Ｎ素子エレメント２２ａ、２
２ｂが貼り合わされて（１層構造の）圧電素子部が形成
しであるが、上記貼り合わしたものを単位構成として、
該単位構成のものを積層した２層構造のもの（圧電素子
を単位にすると４層となる）で圧電素子部を形成するこ
ともできる。In addition, in the above, each pressure N element element 22a, 2
2b are bonded together to form a piezoelectric element (single-layer structure), but the bonded structure described above is used as a unit structure,
The piezoelectric element portion can also be formed of a two-layer structure (four layers when the piezoelectric element is used as a unit) in which the unit structures are laminated.
さらに多層にして３層、４層等のように多層化した圧電
素子部も本発明に属するものである。この多層にした場
合において、超音波送受波の際の位相変化のため、信号
強度が積層数に比例しなくなる場合には、積層にしたも
のを同時に駆動しないで、上記単位構成のものくあるい
はその整数倍のもの）を遅延線（又は遅延手段）をそれ
ぞれ介して信号の送受波する構成にすれば良い（信号伝
達線は増加する。）。Furthermore, the present invention also includes piezoelectric element portions having multiple layers such as three or four layers. When using multiple layers, if the signal strength is no longer proportional to the number of laminated layers due to phase changes during ultrasonic wave transmission and reception, do not drive the laminated layers at the same time, and try to (the number of signal transmission lines increases) through delay lines (or delay means).
尚、本発明は微小間隔で裁断したアレイ状の超音波探触
子に限らず、アレイ状に裁断しないでメカニカルスキャ
ン等に用いる場合の超音波探触子にも利用できるもので
ある。The present invention is not limited to array-shaped ultrasonic probes cut at minute intervals, but can also be applied to ultrasonic probes that are not cut into arrays and are used for mechanical scanning or the like.
［発明の効果］
以上述べたように本発明によれば、各圧電素子エレメン
トを積層状に構成して超音波を送受波するようにしであ
るので、ＳＮ比の大きな超音波信号を得ることができる
。従って、超音波診断装置に用いると、診断に適した鮮
明な超音波診断像を得ることができる。又、非アース電
極をアース電極で覆うようにしであるので安全性が高く
、又、電気ノイズの混入も少くでき信頼性の高い超音波
探触子を実温できる。[Effects of the Invention] As described above, according to the present invention, since each piezoelectric element element is configured in a laminated manner to transmit and receive ultrasonic waves, it is possible to obtain an ultrasonic signal with a large S/N ratio. can. Therefore, when used in an ultrasonic diagnostic apparatus, clear ultrasonic diagnostic images suitable for diagnosis can be obtained. Furthermore, since the non-earthed electrode is covered with the earthed electrode, safety is high, electrical noise is also reduced, and a highly reliable ultrasonic probe can be heated at actual temperature.
第１図ないし第３図は従来例に係り、第１図は従来のア
レイ型超音波探触子を示す断面図、第２図は第１図と直
角方向に切断し、円内を一部拡大して示す側面断面図、
第３図は各圧電素子の等価回路を示す回路図、第４図な
いし第６図は本発明の第１実施例に係り、第４図は第１
実施例のアレイ型超音波探触子を示す断面図、第５図は
第４図のＡ−ＡＩ断面図、Ｍ６図は第４図の電極取付は
部分周辺を拡大して示す断面図、第７図は本発明の第２
実施例の一部を示す断面図、第８図は本発明の第３実施
例の一部を示す断面図、第９図は本発明の第４実施例の
一部を示す断面図である。
５．６・・・整合層 ７・・・レンズ
９・・・ダンピング層
２’１．３１・・・アレイ型超音波探触子２２ａ、２２
ｂ・・・圧電素子（エレメント）２３ａ 、２３ｂ・・
・アース側電極
２４・・・（非アース側）電極
２５．２６・・・電極線 ２７・・・金属箔手 続 補
正 店 （自発）
昭和５）９年４月１８１」
特許□１ ８ ゎ 、１］ よ ３ 適１、事件の表示
昭和５８年特許願第２４６９９２号
２、発明の名称
超音波探触子
３、補正をする者
事件との関係 特許出願人
住 所 東京都渋谷区幅ケ谷二丁ＩＥＪ ／１．３番２
￥′ｉ名 称 （０３７）オリンパス光学」二業株式会
社代表者 下 山 敏 部
４、代理人
５、補正命令の日付 自 発
６、補正の対象 明細書の特許請求の範囲の欄１、特許
請求の範囲を次のように訂正Ｊる。
［（１）音響的整合層、圧電素子部、ダンピング層を積
層状にした超音波探触子において、前記圧電素子部は２
枚の圧電素子を、分極方向が互いに逆となるように貼り
合わＵ、且つ貼り合わせ１ｃ内側の面が非アース側電極
、他の外側の２面がアース側電極としたものを少くとも
１対右することを特徴とする超音波探触子。
（２）前記２枚の圧電素子は、互いに異る長さどして両
者の長さの差部の電極に電気１３号伝達線を接続したこ
とを特徴とする特許請求の範囲第１項記載の超音波探触
子。
（３）前記２枚の圧電素子は、両外側のアース側電極が
金属筋を介して導通したことを特徴とする特許請求の範
囲第１項記載の超音波探触子。
（４）前記２枚の圧電素子は、両外側のアース側電極を
それぞれの圧電素子の側面まで引き伸ばして半田等の導
通手段で導通させると共に、内側の非アース側電極は前
記側面までは伸ばさないで、短絡しなイＸようにしたこ
とを特徴とする特許請求の範囲第１項記載の超音波探触
子。
（５）前記２枚の圧電素子は、両外側のアース側電極を
それぞれの圧電素子の側面を沿わけて他方の而の端部ま
でまわり込まけ、両ハニ電素子の貼り合わせ詩に互いに
導通させたことを１′１徴どりる特許請求の範囲第１項
記載の超音波探触子。
（６）前記２枚の圧電素子は、微小間隔を隔てて細長の
超音波振動子をアレイ状に形成したことを特徴とする特
許請求の範囲第１項記載の超音波探触子。
（７）前記２枚の圧電素子は、多層にして圧電素子部を
形成した場合には、遅延手段を介して信号の送受を行う
ようにしたことを特徴ど、゛りる持ｗ１請求の範囲第１
項記載の超音波探触子。」２、明細書中箱１０ページの
第１４１ｊ目に「・・・空気容■」とあるのを「・・・
電気容量」にｔ］圧する。
３、明ｍ書中第１０ページの第１９行１１に「・・・空
気的整合」とあるのを１・・・電気的整合」に訂正する
。
４、明細書中箱１２ページの第１１ｆｉ［：ｌに「・・
・１層設」とあるのを「・・・１対設」に訂正する。
５、明細ｍ中第１４ページの第１行目に「・・・（Ｃ／
す。）Ｘｌ、２川」とあるのを「・・・（Ｃ／す０）／
１．２・・・」に訂正Ｊる。
以 上Figures 1 to 3 relate to conventional examples; Figure 1 is a cross-sectional view showing a conventional array type ultrasound probe; Figure 2 is a cross-sectional view of a conventional array-type ultrasonic probe; Figure 2 is a cross-sectional view of a conventional array-type ultrasound probe; An enlarged side sectional view,
FIG. 3 is a circuit diagram showing an equivalent circuit of each piezoelectric element, FIGS. 4 to 6 relate to the first embodiment of the present invention, and FIG.
5 is a sectional view showing the array type ultrasonic probe of the embodiment, FIG. 5 is a sectional view taken along line A-AI in FIG. 4, FIG. Figure 7 shows the second embodiment of the present invention.
FIG. 8 is a sectional view showing a part of the third embodiment of the present invention, and FIG. 9 is a sectional view showing a part of the fourth embodiment of the present invention. 5.6... Matching layer 7... Lens 9... Damping layer 2'1.31... Array type ultrasound probe 22a, 22
b...Piezoelectric elements (elements) 23a, 23b...
・Earth side electrode 24...(non-earth side) electrode 25.26...Electrode wire 27...Metal foil procedure correction shop (voluntary) April 1930, 181'' Patent□18ゎ, 1] Yo 3 Applicant 1, Indication of the case Patent Application No. 246992, filed in 1982, 2, Name of the invention: Ultrasonic probe 3, Relationship with the person making the amendment Patent applicant's address: Haba Ke, Shibuya-ku, Tokyo Tani 2-cho IEJ /1.3-2
¥'i Name (037) Olympus Optical Nigyo Co., Ltd. Representative Satoshi Shimoyama Department 4, Agent 5, Date of amendment order Voluntary 6, Subject of amendment Claims column 1 of the specification, Patent The scope of claims is amended as follows. [(1) In an ultrasonic probe in which an acoustic matching layer, a piezoelectric element part, and a damping layer are laminated, the piezoelectric element part has two
At least one pair of piezoelectric elements are pasted together so that their polarization directions are opposite to each other, and the inside surface of the pasted 1c is a non-ground electrode, and the other two outer surfaces are earth electrodes. An ultrasonic probe characterized by the following: (2) The two piezoelectric elements have different lengths, and an electrical No. 13 transmission line is connected to the electrode at the difference in length between the two piezoelectric elements. ultrasonic probe. (3) The ultrasonic probe according to claim 1, wherein the two piezoelectric elements are electrically connected to each other through a metal wire between the two outer ground side electrodes. (4) For the two piezoelectric elements, both outer ground side electrodes are extended to the sides of each piezoelectric element and electrically connected using a conductive means such as solder, and the inner non-ground side electrodes are not extended to the side surfaces. The ultrasonic probe according to claim 1, wherein the ultrasonic probe is configured such that no short circuit occurs. (5) The above-mentioned two piezoelectric elements are connected to each other by wrapping the outer ground side electrodes along the sides of each piezoelectric element to the end of the other piezoelectric element. The ultrasonic probe according to claim 1, wherein the ultrasonic probe has the following features: (6) The ultrasonic probe according to claim 1, wherein the two piezoelectric elements are formed into an array of elongated ultrasonic transducers separated by a minute interval. (7) When the two piezoelectric elements are multi-layered to form a piezoelectric element section, the two piezoelectric elements transmit and receive signals via a delay means. 1st
Ultrasonic probe as described in section. ” 2. On page 141j of box 10 of the statement, replace “...air capacity ■” with “...
t] pressure on the capacitance. 3. In the 10th page, line 19, line 11 of the Memorandum, the phrase ``...pneumatic matching'' is corrected to ``1...electrical matching.'' 4. In box 12 of the statement, 11th fi[:l indicates "...
・Correct the phrase ``1-layer installation'' to ``...1 pair installation.'' 5. In the first line of page 14 of details m, write “...(C/
vinegar. )
1.2...” is corrected. that's all
Claims (1)
状にした超音波探触子において、前記圧電素子部は２枚
の圧電素子を、分極方向が互いに逆となるように貼り合
わせ、且つ貼り合わせた内側の面が非アース側電極、他
の外側の２面がアース側電極としたものを少くともＩＦ
ｖＩ有することを特徴とする超音波探触子。 く２）前記２枚の圧電素子は、互いに異る長さとして両
者の長さの差部の電極に電気信号伝達線を接続したこと
を特徴とする特許請求の範囲第１項記載の超音波探触子
。 （３）前記２枚の圧電素子は、両外側のアース側電極が
金属箔を介して導通したことを特徴とする特許請求の範
囲第１項記載の超音波探触子。 （々）前記２枚の圧電素子は、両外側のアース側電極を
それぞれの圧電素子の側面まで引き伸ばして半田等の導
通手段で導通させると共に、内側の非アース側電極は前
記側面までは伸ばさないで、短絡しないようにしたこと
を特徴とする特許請求の範囲第１項記載の超音波探触子
。 （５）前記２枚の圧電素子は、両外側のアース側電極を
それぞれの圧電素子の側面を沿わせて他方の面の端部ま
でまわり込ませ、両圧電素子の貼り合わせ時に互いに導
通させたことを特徴とする特許請求の範囲第１項記載の
超音波探触子。 （６）前記２枚の圧電素子は、微小間隔を隔てて細長の
超音波振動子をアレイ状に形成したことを特徴とする特
許請求の範囲第１￥４記載の超音波探触子。 （７）前記２枚の圧電素子は、多層にして圧電素子部を
形成した場合には、遅延手段を介して信号の送受を行う
ようにしたことを特徴とする特許請求の範囲第１項記載
の超音波探触子。[Scope of Claims] (1) In an ultrasonic probe in which an acoustic matching layer, a piezoelectric element part, and a damping layer are laminated, the piezoelectric element part connects two piezoelectric elements with polarization directions opposite to each other. At least an IF
An ultrasonic probe characterized by having a vI. 2) The ultrasonic wave according to claim 1, wherein the two piezoelectric elements have different lengths, and an electric signal transmission line is connected to the electrode at the difference in length between the two piezoelectric elements. probe. (3) The ultrasonic probe according to claim 1, wherein the two piezoelectric elements are electrically connected to each other through a metal foil between the two outer ground side electrodes. (5) The two piezoelectric elements are connected by extending the outer ground side electrodes to the sides of each piezoelectric element using a conductive means such as solder, and do not extend the inner non-ground side electrodes to the sides. 2. The ultrasonic probe according to claim 1, wherein the ultrasonic probe is configured to prevent short-circuiting. (5) For the two piezoelectric elements, the ground side electrodes on both outer sides were placed along the sides of each piezoelectric element and wrapped around to the end of the other side, so that they were electrically connected to each other when the two piezoelectric elements were bonded together. An ultrasonic probe according to claim 1, characterized in that: (6) The ultrasonic probe according to claim 1, wherein the two piezoelectric elements are formed into an array of elongated ultrasonic transducers separated by a minute interval. (7) When the two piezoelectric elements are multi-layered to form a piezoelectric element section, signals are transmitted and received through delay means, as set forth in claim 1. ultrasonic probe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24699283A JPS60137200A (en) | 1983-12-26 | 1983-12-26 | Ultrasonic probe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24699283A JPS60137200A (en) | 1983-12-26 | 1983-12-26 | Ultrasonic probe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60137200A true JPS60137200A (en) | 1985-07-20 |
Family
ID=17156761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24699283A Pending JPS60137200A (en) | 1983-12-26 | 1983-12-26 | Ultrasonic probe |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60137200A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63217799A (en) * | 1987-03-05 | 1988-09-09 | Toshiba Corp | Ultrasonic wave probe |
| JPH02261437A (en) * | 1989-03-31 | 1990-10-24 | Toshiba Corp | Ultrasonic probe |
| JP2013005403A (en) * | 2011-06-21 | 2013-01-07 | Olympus Medical Systems Corp | Ultrasonic unit, ultrasonic endoscope, and method for manufacturing ultrasonic unit |
| JP2018017955A (en) * | 2016-07-29 | 2018-02-01 | キヤノン株式会社 | Electronic apparatus, and installation method of detection unit |
| JP2021067822A (en) * | 2019-10-24 | 2021-04-30 | 豊田合成株式会社 | Surgery simulator |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57193199A (en) * | 1981-05-23 | 1982-11-27 | Kureha Chem Ind Co Ltd | Ultrasonic transducer |
-
1983
- 1983-12-26 JP JP24699283A patent/JPS60137200A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57193199A (en) * | 1981-05-23 | 1982-11-27 | Kureha Chem Ind Co Ltd | Ultrasonic transducer |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63217799A (en) * | 1987-03-05 | 1988-09-09 | Toshiba Corp | Ultrasonic wave probe |
| JPH02261437A (en) * | 1989-03-31 | 1990-10-24 | Toshiba Corp | Ultrasonic probe |
| JP2013005403A (en) * | 2011-06-21 | 2013-01-07 | Olympus Medical Systems Corp | Ultrasonic unit, ultrasonic endoscope, and method for manufacturing ultrasonic unit |
| JP2018017955A (en) * | 2016-07-29 | 2018-02-01 | キヤノン株式会社 | Electronic apparatus, and installation method of detection unit |
| JP2021067822A (en) * | 2019-10-24 | 2021-04-30 | 豊田合成株式会社 | Surgery simulator |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2758199B2 (en) | Ultrasonic probe | |
| EP2610860B1 (en) | Ultrasound probe and manufacturing method thereof | |
| EP0750883B2 (en) | Method of making a transducer assembly for an imaging device | |
| US11806752B2 (en) | Ultrasound transducer and method for wafer level front face attachment | |
| US20060058681A1 (en) | Ultrasound transducer assembly | |
| US7288069B2 (en) | Ultrasonic probe and method of manufacturing the same | |
| JP4933392B2 (en) | Ultrasonic probe and manufacturing method thereof | |
| US20080238259A1 (en) | Ultrasonic probe and production method thereof | |
| US10152963B2 (en) | Ultrasound transducer with differential mode signaling | |
| CN108459085B (en) | Ultrasonic probe | |
| JP4936597B2 (en) | Ultrasonic probe and ultrasonic probe manufacturing method | |
| JP2007142555A (en) | Ultrasonic probe and ultrasonic diagnostic equipment | |
| EP0306288B1 (en) | Ultrasonic imaging apparatus | |
| JPS60137200A (en) | Ultrasonic probe | |
| JP4004845B2 (en) | Array type ultrasonic transducer | |
| JP2011124997A (en) | Ultrasonic probe and method of manufacturing the same | |
| KR20150073056A (en) | Ultrasonic diagnostic instrument and manufacturing method thereof | |
| JPH11347032A (en) | Ultrasonic probe | |
| JP3934202B2 (en) | Ultrasonic probe | |
| JPH07312799A (en) | Ultrasonic wave probe and its manufacture | |
| JPH0161062B2 (en) | ||
| JPS60116339A (en) | Array type ultrasonic probe and its production | |
| JP2009072349A (en) | Ultrasonic transducer, its manufacturing method and ultrasonic probe | |
| JPH04211599A (en) | Ultrasonic probe and production thereof | |
| KR102623559B1 (en) | Ultrasound prove |