JPS60136162U - Optical coupling semiconductor device - Google Patents
Optical coupling semiconductor deviceInfo
- Publication number
- JPS60136162U JPS60136162U JP2361484U JP2361484U JPS60136162U JP S60136162 U JPS60136162 U JP S60136162U JP 2361484 U JP2361484 U JP 2361484U JP 2361484 U JP2361484 U JP 2361484U JP S60136162 U JPS60136162 U JP S60136162U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- optically coupled
- light
- optical coupling
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は本考案による一実施例を示す平面図、第2図乃
至第4図は従来の光結合半導体装置を示−す断面図及び
平面図である。
3:発光素子、4:受光素子、5:透明樹脂、6:不透
明樹脂、9:1次側リード、10:2次側リード、11
:間隙。FIG. 1 is a plan view showing an embodiment of the present invention, and FIGS. 2 to 4 are a sectional view and a plan view showing a conventional optically coupled semiconductor device. 3: Light emitting element, 4: Light receiving element, 5: Transparent resin, 6: Opaque resin, 9: Primary side lead, 10: Secondary side lead, 11
:gap.
Claims (2)
ードの一方に発光素子を、他方に受光素子を搭載し、該
素子搭載部を透光性樹脂で被って光学的に結合し、該透
光性樹脂外表面を不透光性樹脂で被ってなる光結合半導
体装置において、一方の素子搭載リードの、他方の素子
塔載リードと相対向するリード先端部を曲線状に形成し
てなることを特徴とする光結合半導体装置。(1) A light emitting element is mounted on one of the primary and secondary leads arranged on the same plane, and a light receiving element is mounted on the other, and the element mounting part is covered with a translucent resin and optically coupled. In the optically coupled semiconductor device in which the outer surface of the light-transmitting resin is covered with a non-light-transmitting resin, the leading end of one of the element-mounting leads facing the other element-mounting lead is formed into a curved shape. An optically coupled semiconductor device characterized by:
し、他方の素子搭載り−ドは受光素子を搭載してなるこ
とを特徴とする請求の範囲第1項記載の光結合半導体装
置。(2) The optically coupled semiconductor device according to claim 1, wherein the one element mounting lead mounts a light emitting element, and the other element mount lead mounts a light receiving element.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2361484U JPS60136162U (en) | 1984-02-20 | 1984-02-20 | Optical coupling semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2361484U JPS60136162U (en) | 1984-02-20 | 1984-02-20 | Optical coupling semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60136162U true JPS60136162U (en) | 1985-09-10 |
JPH0132369Y2 JPH0132369Y2 (en) | 1989-10-03 |
Family
ID=30517005
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2361484U Granted JPS60136162U (en) | 1984-02-20 | 1984-02-20 | Optical coupling semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60136162U (en) |
-
1984
- 1984-02-20 JP JP2361484U patent/JPS60136162U/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH0132369Y2 (en) | 1989-10-03 |
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