JPS60135267A - Thermal printer head - Google Patents
Thermal printer headInfo
- Publication number
- JPS60135267A JPS60135267A JP24370183A JP24370183A JPS60135267A JP S60135267 A JPS60135267 A JP S60135267A JP 24370183 A JP24370183 A JP 24370183A JP 24370183 A JP24370183 A JP 24370183A JP S60135267 A JPS60135267 A JP S60135267A
- Authority
- JP
- Japan
- Prior art keywords
- bent
- green sheet
- substrate
- heat generating
- resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】 〔発明の技術分野〕 本発明はサーマルプリンタヘッドに関する。[Detailed description of the invention] [Technical field of invention] The present invention relates to a thermal printer head.
サーマルプリンタヘッドは、複数の発熱抵抗体を有し、
パターンに応じ選択された抵抗体を発熱させ、感熱紙上
又は熱転写法を用いて普通紙上に町望のパターンを形成
するのに用いられるもので、ある。The thermal printer head has multiple heating resistors,
It is used to generate heat in resistors selected according to the pattern and to form a pattern on thermal paper or plain paper using a thermal transfer method.
この発熱抵抗体は例えば８本／、、でアレイ状に形成さ
れている。この発熱抵抗体の駆動回路（例えばＩＣチッ
プ）も機器の小型化、印刷配線で結線できるため結線が
容易等の理由から、一般には発熱抵抗体が形成された基
板上に設けられている。The heating resistors are formed in an array, for example, eight pieces/. The drive circuit (for example, an IC chip) for this heat generating resistor is also generally provided on the substrate on which the heat generating resistor is formed, for reasons such as miniaturization of the device and easy connection because it can be connected by printed wiring.
このようすを第１図に示す。第１図はサーマルプリンタ
ヘッドの部分断面図である。This situation is shown in Figure 1. FIG. 1 is a partial sectional view of a thermal printer head.
基板（１）上には発熱抵抗体（２）が紙面垂直方向にア
レイ状に配列されている。また駆動回路を形成する。Ｉ
Ｃチップ、抵抗体等の電子部品（３）が同一基板（１）
上に設置されておシ、気密封土用キャップ（４）で気密
封止されている。Heat generating resistors (2) are arranged in an array on a substrate (1) in a direction perpendicular to the plane of the paper. A drive circuit is also formed. I
Electronic components (3) such as C chips and resistors are on the same board (1)
It is placed on top and hermetically sealed with an airtight soil cap (4).
第１図に示すように印刷時には記録紙（５）が発熱抵抗
体（２）に接触するが１図中への部分で気密封土用キャ
ップ（４）と記録紙（５）が接触しやすくなり、摩耗に
より穴があき、気密が維持できなくなる恐れがあるため
、記録紙のカイトロール（図示せず）を工夫してなるべ
く接触をさけるようにしている。しかしながらこのよう
な方法によっても接触は避けがたいため１図中（Ｌ）の
長さをある程度長くすることが必要である。As shown in Figure 1, the recording paper (5) comes into contact with the heating resistor (2) during printing, but the airtight sealing cap (4) and the recording paper (5) tend to come into contact in the middle of Figure 1. There is a risk that holes may form due to wear and that airtightness cannot be maintained, so the Kiteroll (not shown) of the recording paper is devised to avoid contact as much as possible. However, even with this method, contact is unavoidable, so it is necessary to increase the length (L) in Figure 1 to some extent.
ここでサーマルプリンタヘッドの小型化を考えた場合、
高密度にＩＣ等が実装されているため、この（Ｌ） ’
ｃ短かくすることがもっとも効率的である。When considering the miniaturization of thermal printer heads,
Because ICs etc. are mounted in high density, this (L)'
It is most efficient to shorten c.
しかしながら、前述の問題等があｐ、この（Ｌ）を短か
くするのには限界があった。However, due to the above-mentioned problems, there is a limit to how short (L) can be made.
本発明は以上の点を考慮してなされたもので。 The present invention has been made in consideration of the above points.
小形化可能なサーマルプリンタヘッドを提供することを
目的とする。The purpose of the present invention is to provide a thermal printer head that can be made smaller.
本発明は基板上に発熱抵抗体と、前記発熱抵抗体の駆動
回路部とを有するサーマルプリンタヘッドにおいて、前
記基板として、前記発熱抵抗体が形成された第１の基板
領域と、前記駆動回路部が形成された第２の基板領域と
が別の平面をなすように折曲げられた形状を有する基板
を用い、第１の基板領域と第２の基板領域とがなす角度
のうち。The present invention provides a thermal printer head having a heat generating resistor on a substrate and a drive circuit section for the heat generating resistor, wherein the substrate includes a first substrate area on which the heat generating resistor is formed, and a drive circuit section for the heat generating resistor. Among the angles formed by the first substrate region and the second substrate region, using a substrate having a shape that is bent so that the second substrate region on which is formed forms a separate plane.
鈍角をなす側に前記発熱抵抗体が形成されていることを
特徴としたサーマルプリンタヘッドである。The thermal printer head is characterized in that the heating resistor is formed on the side forming an obtuse angle.
基板としては折曲部分での配線形成が容易となるように
、グリーンシート状態で配線形成された未焼結のセラミ
ック基板を用い、折曲げた後に焼結すれば良い。又、金
属基板を用い配線形成した後、折曲げても良い。折曲げ
た後に配線を形成するのは困難であるので、前述のごと
く配線形成の後形状の加工が可能であり、かつサーマル
ヘッドとしての耐熱性１強度を備えたセラミックシート
。As the substrate, an unsintered ceramic substrate on which wiring is formed in the form of a green sheet may be used, and the substrate may be bent and then sintered so that wiring can be easily formed at the bent portion. Alternatively, after wiring is formed using a metal substrate, it may be bent. Since it is difficult to form wiring after bending, the ceramic sheet can be processed into a shape after wiring is formed as described above, and has heat resistance and 1 strength for use as a thermal head.
金属基板を用いることが好ましい。Preferably, a metal substrate is used.
このような構造をとる本発明のサーマルプリンタヘッド
は、折曲形状とすることにより、平面的にみた場合の占
有面積が小さくなり、小形化ができる。また、別平面に
発熱抵抗体と、駆動回路部を別々に形成したため、記録
紙と保護キャップとの接触を防止することができるので
前述のＬを短かくすることができる。従ってよシ小形化
が可能となる。By forming the thermal printer head of the present invention having such a structure into a bent shape, the area occupied when viewed from above is reduced, and the head can be made smaller. Furthermore, since the heating resistor and the drive circuit section are formed separately on separate planes, contact between the recording paper and the protective cap can be prevented, so that the above-mentioned length L can be shortened. Therefore, it is possible to make it more compact.
また、前述のような保護キャップと記録紙の摩擦によシ
、保護キャップが損傷をうけることもないので、長寿命
、高信頼となる。Furthermore, the protective cap is not damaged due to friction between the protective cap and the recording paper as described above, resulting in a long life and high reliability.
以上説明したように本発明によれば、サーマルプリンタ
ヘッドの小形化を達成できる。As explained above, according to the present invention, it is possible to achieve miniaturization of the thermal printer head.
以下に本発明の詳細な説明する。第２図はサーマルプリ
ンタヘッドの部分断面図である。The present invention will be explained in detail below. FIG. 2 is a partial sectional view of the thermal printer head.
基板（１）をグリーンシートから形成する。A substrate (1) is formed from a green sheet.
アルミナ質の無機材料の原意を所定量に秤量した後、こ
れを一定の粒径・粒度分布になるように粉砕・混合する
。つぎに、得られた混合粉末にノくインタ゛−１可塑剤
等を、それぞれ所定量添加した後、混練し、混線物を脱
泡してスリップを調整する。その後、このスリップにド
クターブレード法を適用してキャリヤフィルム上に所定
の厚さで塗布し、これを順次、ドクターブレード装置の
乾燥部を通過せしめて溶剤等を飛散せしめ、生シート。After weighing a predetermined amount of alumina-based inorganic material, it is ground and mixed to obtain a constant particle size and particle size distribution. Next, a predetermined amount of Inter-1 plasticizer, etc. is added to the obtained mixed powder, and the mixture is kneaded, and the mixed wire is defoamed to adjust the slip. Thereafter, a doctor blade method is applied to this slip to coat it on a carrier film at a predetermined thickness, and the slip is sequentially passed through a drying section of a doctor blade device to scatter solvents, etc., to form a green sheet.
いわゆるグリーンシートを作成する。このグリーンシー
ト上にタングステン（Ｗ） 、モリブデン（Ｍｏ）等か
らなる導体ペーストとグリーンシートと同材質の絶縁ペ
ーストを交互に印刷多層法で印刷してそれぞれ形成して
、多層配線構造化した後、第２図でしめしたように発熱
抵抗体（２）を形成する部分を折シ曲げる。多層配線（
図示せず）は抵抗体形成部迄延びており、折ｐ曲げ部は
グリーンシートの状態で折り曲げられる為、抵抗なく、
自由に曲げられる。あまり大きく曲げると断線、亀裂の
恐れがあるため、４５°程度以下、２０°程度の角度が
好ましい。Create a so-called green sheet. A conductive paste made of tungsten (W), molybdenum (Mo), etc. and an insulating paste made of the same material as the green sheet are alternately printed on this green sheet using a multilayer printing method to form a multilayer wiring structure. As shown in FIG. 2, bend the part that will form the heating resistor (2). Multilayer wiring (
(not shown) extends to the resistor forming part, and the folded part is bent as a green sheet, so there is no resistance.
Can be bent freely. If the wire is bent too much, there is a risk of wire breakage or cracking, so the angle is preferably about 45° or less and about 20°.
その後、１６００℃還元雰囲気で焼成後１発熱抵抗体形
成部にスパッタで抵抗（２） （Ｔａ Ｓ ｉ０２ 、
ＴａＮ等）を形成する。このとき、タングステン導体路
と発熱抵抗体（２）との接続も同時に行なわれる。Then, after firing in a reducing atmosphere at 1600°C, a resistor (2) (TaSi02,
(TaN, etc.). At this time, the tungsten conductor path and the heating resistor (2) are also connected at the same time.
ドツト分割の為の抵抗体エツチングを行ない、折多曲げ
基板が完成する。The resistor is etched to separate the dots, and the folded board is completed.
この後、所定のドライバＩＣ１制御ＩＣ，ラッチＩＣほ
かの電子部品（３）を塔載し、ポンディジグした後に、
気密封止キャップ（４）１’ｌ１ｍよフ封止し。After that, after mounting the predetermined driver IC1 control IC, latch IC, and other electronic components (3) and performing pondage,
Seal the airtight sealing cap (4) from 1'11m.
最後に信号及び電源線（図示せず）を接続してサーマル
・ヘッドを完成した。Finally, signal and power lines (not shown) were connected to complete the thermal head.
従来、キャップ（４）と発熱抵抗体（２）間の距離りが
８咽程度必要であったが１本発明によるサーマルプリン
タヘッド（ＴＰＨ）では４ＩｌＩｌＩ＋程度と半分に短
縮でき、 ＴＰＥ（の小形化を達成した。Conventionally, the distance between the cap (4) and the heat generating resistor (2) was required to be about 8mm, but with the thermal printer head (TPH) according to the present invention, it can be shortened to half to about 4IlIlI+, making the TPE (smaller). achieved.
またサーマルヘッド使用時に基板（２１）が斜めになっ
ている為に感熱紙（２６）から出る紙屑が基板（２１）
上、キャップ（２４）上に堆積することなく、発熱、蓄
熱が防げる効果も得ることができる。Also, since the substrate (21) is slanted when using the thermal head, paper waste from the thermal paper (26) is attached to the substrate (21).
It is also possible to obtain the effect of preventing heat generation and heat accumulation without being deposited on the cap (24).
さらに、複数のヘッドを用いる場合、駆動回路部分が重
なるように配置できるので、小面積におさめることがで
きる。Furthermore, when using a plurality of heads, the driving circuit portions can be arranged so as to overlap, so that the area can be kept small.
第１図は従来技術によるサーマルプリンタヘッドの部分
断面図、第２図は本発明によるサーマルプリンタヘッド
の部分断面図である。FIG. 1 is a partial sectional view of a thermal printer head according to the prior art, and FIG. 2 is a partial sectional view of a thermal printer head according to the present invention.
Claims (1)
を有するサーマルプリンタヘッドにおいて、前記基板と
して、前記発熱抵抗体が形成された第１の基板領域と、
前記駆動回路部が形成された第２の基板領域とが別の平
面をなすように折曲げられた形状を有する基板を用い、
第１の基板伸域と第２の基板領域とがなす角度のうち、
鈍角をなす側に前記発熱抵抗体が形成されていることを
特徴としたサーマルプリンタヘッド。In a thermal printer head having a heating resistor on a substrate and a drive circuit section for the heating resistor, a first substrate region on which the heating resistor is formed as the substrate;
Using a substrate having a shape bent so that the second substrate region in which the drive circuit portion is formed forms a different plane,
Among the angles formed by the first substrate expansion area and the second substrate area,
A thermal printer head characterized in that the heating resistor is formed on a side forming an obtuse angle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24370183A JPS60135267A (en) | 1983-12-26 | 1983-12-26 | Thermal printer head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24370183A JPS60135267A (en) | 1983-12-26 | 1983-12-26 | Thermal printer head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60135267A true JPS60135267A (en) | 1985-07-18 |
Family
ID=17107696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24370183A Pending JPS60135267A (en) | 1983-12-26 | 1983-12-26 | Thermal printer head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60135267A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6469364A (en) * | 1987-09-10 | 1989-03-15 | Rohm Co Ltd | Production of thermal head |
| US4896977A (en) * | 1987-03-12 | 1990-01-30 | Brother Kogyo Kabushiki Kaisha | Thermal printer having a structure for supporting a print head with a driver on its front surface |
-
1983
- 1983-12-26 JP JP24370183A patent/JPS60135267A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4896977A (en) * | 1987-03-12 | 1990-01-30 | Brother Kogyo Kabushiki Kaisha | Thermal printer having a structure for supporting a print head with a driver on its front surface |
| JPS6469364A (en) * | 1987-09-10 | 1989-03-15 | Rohm Co Ltd | Production of thermal head |
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