JPS6013274B2 - Terminal structure in flexible circuit and its manufacturing method - Google Patents
Terminal structure in flexible circuit and its manufacturing methodInfo
- Publication number
- JPS6013274B2 JPS6013274B2 JP51112807A JP11280776A JPS6013274B2 JP S6013274 B2 JPS6013274 B2 JP S6013274B2 JP 51112807 A JP51112807 A JP 51112807A JP 11280776 A JP11280776 A JP 11280776A JP S6013274 B2 JPS6013274 B2 JP S6013274B2
- Authority
- JP
- Japan
- Prior art keywords
- flexible circuit
- conductor
- terminal
- reinforcing
- base film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Description
【発明の詳細な説明】
本発明は、銅箔の如き薄状導体を可犠牲の絶縁性ベース
フィルム上に所要パターンで形成したフレキシブル印刷
配線板、所謂フレキシブルサーキットにおける端子構造
及びその製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a terminal structure in a flexible printed wiring board, a so-called flexible circuit, in which a thin conductor such as copper foil is formed in a desired pattern on a sacrificial insulating base film, and a method for manufacturing the same.
この種のフレキシブルサーキットにおける従来製品は、
格別に端子部とも云うべき構造を備えることなく、所要
の回路パターンを単に絶縁性の可徒性をもつベースフィ
ルム上に形成しただけのものである為、斯かるフレキシ
ブルサーキットを回路部品を実装する周知のプリント基
板等に接続する場合には、たとえばプリント基板側に設
けられた接続用プリント導体にフレキシブルサーキット
の一端部分を重ね、相互のパターンをハンダ付け等の手
段で接続しているのが実情である。Conventional products for this type of flexible circuit are
Since the required circuit pattern is simply formed on a base film that has insulating properties and has no structure that can be called a terminal part, such a flexible circuit can be used to mount circuit components. When connecting to a well-known printed circuit board, for example, one end of the flexible circuit is overlapped with a connecting printed conductor provided on the printed circuit board side, and the mutual patterns are connected by means such as soldering. It is.
このような接続手段によるときは、プリント基板側の導
体とフレキシブルサーキット側の導体との確実な接続を
期待できないこと、及びその為の接続作業が煩雑であっ
て能率性を欠く等の難点がある。そこで、プリント基板
等に予め接続用コネクタ−を装置し、このコネクターに
フレキシプルサ−キットを差し込んで両者を接続する方
法も実用に供されているが、このような手段によれば上
記に比しより確実な両者の接続を確保できるという利点
を持つ一方、コネクター等の接続具を設けるスペースを
要すると共に斯かる接続手段そのものがコスト高を招来
するという欠点を持つ。本発明は、上記従前の接続態様
に内在する諸問題を根本的に解決し得るフレキシブルサ
ーキットに於ける端子構造を提供すると同時に、この端
子構造を好適に実施する為の製造方法をも併せて提供す
るものである。When using this type of connection method, there are disadvantages such as a reliable connection between the conductor on the printed circuit board side and the conductor on the flexible circuit side, and the connection work for that purpose is complicated and lacks efficiency. . Therefore, a method has been put into practice in which a connector is installed in advance on a printed circuit board, etc., and a flexible circuit is inserted into this connector to connect the two. While this method has the advantage of ensuring a reliable connection between the two, it also has the drawbacks of requiring space for a connecting device such as a connector and increasing the cost of such a connection means itself. The present invention provides a terminal structure for a flexible circuit that can fundamentally solve the problems inherent in the conventional connection methods described above, and also provides a manufacturing method for suitably implementing this terminal structure. It is something to do.
即ち、本発明の主要な目的は、たとえばプリント基板に
回路部品を組込むと同様な態様でフレキシブルサーキッ
トを簡単かつ確実にこの種プリント基板等に接続可能な
端子構造を提供することにある。That is, a main object of the present invention is to provide a terminal structure that allows a flexible circuit to be easily and reliably connected to a printed circuit board of this type in the same manner as, for example, a circuit component is incorporated into a printed circuit board.
また、本発明の他の目的は、作業能率を高め得るように
この端子構造の強度を良好に高めることの可能な端子構
造を得ることにある。Another object of the present invention is to obtain a terminal structure capable of satisfactorily increasing the strength of the terminal structure so as to improve work efficiency.
斯かるフレキシブルサーキットに於ける端子構造は、端
子部を形成すべき部分に各回路導体パタ−ンにそれぞれ
連続して対応する導体片を裏面に備えるように補強部を
設け、この補強部の各導体パターン部分をそれぞれ突出
させることにによって得られる。In the terminal structure of such a flexible circuit, a reinforcing part is provided in the part where the terminal part is to be formed so that the back side thereof is provided with a conductor piece that corresponds to each circuit conductor pattern continuously, and each part of this reinforcing part is This is obtained by making the conductor pattern portions respectively protrude.
端子部に上記の如く突出した各導体パターン部分は、従
ってプリント基板等に設けられた透孔に簡単に差し込む
ことが可能になる為、プリント基板に組込むべきコンデ
ンサ、抵抗ｌｃ等の他の回路部品と同時に、該基板の裏
面に突出した脚に溶融ハンダ液を自動的に付着せしめて
接続作業の高能率化を促進できることとなる。その際、
本発明の端子構造によれば、その端子部の両面に導体を
備えている都合上、ハンダ液の付着を一様化してより強
固かつ確実な基板への接続を行なうことが可能となる。
このような端子構造を達成するため、本発明の他の目的
はその好適な製造方法を提供しようとするものであって
、これは端子部の端部近傍における導体パターン間のべ
−スフィルムを先ず長孔状に打ち抜く作業から出発し、
次いで打ち抜いた最孔部分を境にして折り曲げてベース
フィルム相互を重ね合せるか、または初めに上記のよう
に折り曲げて重ね合せたのち、ベースフィルムの先端部
を適度に切除し、最後にこの重ね合せ目を適宜接合する
という迅速なステップにより実施できるもので、かかる
各工程は必要に応じて容易に自動化を行なうことも可能
である。Each of the conductor pattern parts protruding from the terminal part as described above can therefore be easily inserted into a through hole provided on a printed circuit board, etc., so that other circuit components such as capacitors and resistors LC to be incorporated into the printed circuit board can be easily inserted. At the same time, the molten solder liquid is automatically applied to the legs protruding from the back surface of the board, thereby promoting high efficiency of the connection work. that time,
According to the terminal structure of the present invention, since conductors are provided on both sides of the terminal portion, the adhesion of the solder liquid can be made uniform and a stronger and more reliable connection to the board can be achieved.
In order to achieve such a terminal structure, another object of the present invention is to provide a suitable manufacturing method, which involves forming a base film between the conductor patterns near the ends of the terminal part. First, we start by punching out a long hole.
Next, the base films are folded using the punched out hole as a boundary, and the base films are stacked on top of each other. Alternatively, the base films are first folded and stacked as described above, and then the leading edge of the base film is cut off appropriately, and the base films are stacked together. It can be carried out by a quick step of appropriately joining the eyes, and each of these steps can be easily automated if necessary.
本発明の上記目的並びに特長を含めてその他の事項をよ
り詳解する為、以下、添附図面に示す実施例を参照しな
がら本発明を詳細に説明する。In order to understand the above-mentioned objects and features of the present invention as well as other matters in more detail, the present invention will be described in detail below with reference to embodiments shown in the accompanying drawings.
この種のフレキシブルサーキットは、第１図に示すとお
り、可操性の薄い絶縁性ベースフィルム２１上にエッチ
ングまたはスタンプ等の周知手段で所要の回路用導体パ
ターン２２を形成して構成されている。本発明は、この
ようなフレキシブルサーキットにおいて、様子を形成す
べき部分２０の終機に近い個所であって複数の導体パタ
ーン２２の間に占めるベースフィルム２１を整列させて
同一形状の最孔２３を適宜のダイス等を用いて同時に打
ち抜く工程から出発する。最孔２３の大きさは、このフ
レキシブルサ−キツトの大きさおよび取付けるべき図示
しないプリント基板等の厚さ等その他の要素を加味して
定め得る。斯かる穿孔作業を終了したら、第２図に破線
Ｌで示すように、各長孔２３の中間部を結ぶこの線Ｌを
境として裏面に折り曲げ、ベースフィルム２１を相互に
重ね合せると、第３図のように端子部２０の先端部分に
切欠部２３ａを介してそれぞれ導体パターン部分２２ａ
を突出させることができると同時に、第４図の断面図か
ら明らかなとおり、重ね合せによる補強部２４を形成す
ることができる。従って、この補強部２４の裏面には、
導体パターン２２による表面のそれと各々連続した導体
片２２ｂを備えることとなるので、最終的に上記折り曲
げ重ね部分を接着材２５を用いて適宜接合するか、また
は、接着材２５を使用せずしてベースフィルム２１間を
直接圧薮して熱融着させるか、若しくは超音波ボンディ
ングを行なう等、各種の態様で接合させ得る。この様に
して構成されたフレキシブルサーキットの端子構造は、
両面に上記の如き導体部材を有する補強部２４を具備す
る為、相応の曲げ強さを備えるが、端子部２０の横中を
相当大きくするフレキシブルサーキットの場合には、第
５図〜第７図に示すように、別体の補強部材２６を用い
ることも可能である。As shown in FIG. 1, this type of flexible circuit is constructed by forming a required circuit conductor pattern 22 on a thin, flexible insulating base film 21 by known means such as etching or stamping. In such a flexible circuit, the present invention aligns the base film 21 that is near the end of the portion 20 where the pattern is to be formed and occupies between the plurality of conductor patterns 22 to form the smallest hole 23 of the same shape. The process begins with simultaneous punching using an appropriate die or the like. The size of the largest hole 23 can be determined by considering other factors such as the size of the flexible circuit and the thickness of a printed circuit board (not shown) to be attached. After completing the perforation work, as shown by the broken line L in FIG. As shown in the figure, a conductor pattern portion 22a is inserted into the tip portion of the terminal portion 20 through a notch portion 23a.
At the same time, as is clear from the sectional view of FIG. 4, a reinforcing portion 24 can be formed by overlapping. Therefore, on the back side of this reinforcing part 24,
Since each conductor piece 22b is continuous with that of the surface formed by the conductor pattern 22, the above-mentioned folded and overlapped portions are finally joined appropriately using the adhesive 25, or the adhesive 25 is not used. The base films 21 can be bonded in various ways, such as by directly pressurizing the base films 21 and heat-sealing them, or by ultrasonic bonding. The terminal structure of the flexible circuit configured in this way is
Since the reinforcing part 24 has conductor members as described above on both sides, it has a corresponding bending strength. However, in the case of a flexible circuit in which the width and center of the terminal part 20 are considerably large, the structure shown in FIGS. 5 to 7 is It is also possible to use a separate reinforcing member 26, as shown in FIG.
即ち、上記長孔の中間部を結ぶ線Ｌに端縁を合せてこの
フレキシブルサーキットの裏面に両面粘着テープを粘着
するか、若しくは他の硬質板を仮接着する等の手段で適
宜補強部村２６を配置する。然る後、この補強部材２６
に半分を占め得るべく上記の態様で長孔２７を穿談し、
以下、同機方法で糠Ｌから先端部分を裏面に折り曲げて
補強部材２６に折り曲げ部分のベースフィルム２１を接
着材２７等で適宜接合すると、第７図の如き補強鞠材２
６を介在させた強固な補強部２８を端子部に形成するこ
とが出来る。この補強部２８の場合も、上記実施例と同
様に、表面に導体パターン２２による導体と、表面には
これと連続する導体片２２ｂを備えることができる。裏
面に具備すべき上記導体片２２ｂは、この両実施例によ
るときは表面に形成された導体パターン２２の端部に該
当するものであるが、その為、この導体片２２ｂの形成
工程は、上記折り曲げ工程と同時に行なわれるので、余
分の作業を不要とする。尚、補強部材２６として、たと
えば両面粘着テープ若しくはこれと同等の資材を適用す
る場合には、第８図および第９図に示すとおり、端子部
２０の先端までカバーする中広の両面粘着テープ部材２
６ａを貼着し、次に上記の如く長孔２７ａを穿設したの
ち、同様に線Ｌから折り曲げて重ね合せるだけで、他の
接着材を用いずにこの重ね合せ部分を同時に接合するこ
とも出来る。一方、補強部材２６に硬質基板等を用いる
場合にも予めフレキシブルサーキットの裏面に上記の如
き中広の両面粘着テープを貼着しておけば、接着材２７
をこの粘着テープで代えることも可能である。上記実施
例によれば、折り曲げ重ね合せ工程をいずれも長孔の穿
設後に行なうようにしているが、最初にフレキシブルサ
ーキットを先ず所要部分だけ折り曲げて重ね合せ、然る
後、端部における導体パターン間のベースフィルムをそ
れぞれ切除して、該パターン部分を適度に突出形成する
ことも勿論可能である。斯かる工程の変更を行なう場合
には、折り曲げて重ね合せ目を接合すると同時に先端部
の導体パターン部分を突出すべくベースフィルムをパン
チアウトする等して切欠することが出釆るので、工程の
簡易化を図れる。第５図〜第９図に示す実施例は、横中
の比較的広いフレキシブルサーキットに上記の端子構造
を形成する方法を例図したものであって、その意図する
ところは、主として接続作業に伴なう中方向の曲げ強度
を強化して接続すべきプリント基板等に対する装置作業
を容易ならしめることにある。That is, the reinforcing portion 26 is suitably reinforced by adhering double-sided adhesive tape to the back surface of the flexible circuit, or by temporarily adhering another hard plate, with the edge aligned with the line L connecting the intermediate portions of the long holes. Place. After that, this reinforcing member 26
The long hole 27 is bored in the above manner so as to occupy half of the hole,
Hereinafter, by bending the tip portion from the bran L to the back side and bonding the bent portion of the base film 21 to the reinforcing member 26 using an adhesive 27 or the like, the reinforcing ball material 2 as shown in FIG.
A strong reinforcing portion 28 having a reinforcing portion 6 interposed therebetween can be formed in the terminal portion. In the case of this reinforcing portion 28 as well, similarly to the above embodiment, a conductor formed by the conductor pattern 22 can be provided on the surface, and a conductor piece 22b continuous with the conductor can be provided on the surface. The conductor piece 22b to be provided on the back surface corresponds to the end of the conductor pattern 22 formed on the front surface in both of these embodiments. Since this is done at the same time as the folding process, no extra work is required. In addition, when applying double-sided adhesive tape or an equivalent material as the reinforcing member 26, for example, as shown in FIGS. 8 and 9, a medium-wide double-sided adhesive tape member that covers the tip of the terminal portion 20 is used. 2
6a, and then drilling the elongated hole 27a as described above, it is also possible to join these overlapped parts at the same time without using any other adhesive by simply bending them from the line L and overlapping them in the same way. I can do it. On the other hand, even if a hard substrate or the like is used for the reinforcing member 26, if a medium-wide double-sided adhesive tape as described above is attached to the back side of the flexible circuit in advance, the adhesive 27
It is also possible to replace it with this adhesive tape. According to the above embodiment, the folding and stacking process is performed after the elongated holes are drilled. First, the flexible circuit is first folded in the required portion and stacked, and then the conductor pattern is formed at the end. Of course, it is also possible to cut out the base films in between and form the pattern portions to protrude appropriately. When making such a change in the process, the base film must be punched out to make the conductor pattern part at the tip protrude at the same time as the overlap is joined by bending, so the process changes. It can be simplified. The embodiments shown in FIGS. 5 to 9 illustrate a method for forming the above-mentioned terminal structure on a relatively wide flexible circuit in the horizontal direction, and are intended primarily for connection work. The object of this invention is to strengthen the bending strength in the middle direction so as to make it easier to work with the equipment on printed circuit boards and the like to be connected.
それ故、斯かる効果を一層促進する一便法としては、第
１０図に示す如く、この種のフレキシブルサーキットを
製造する際、導体パターン２２と一諸に予めベースフィ
ルム２１上における端子部２０となるべき先端縁に補強
導体２９を上記パターン２２と接することなく形成した
フレキシブルサーキットを用いることである。このよう
なフレキシブルサーキットを用いて上記実施例と同様方
法で行なうと、第４図．第９図および第７図にそれぞれ
対応した製品であって、第１１図〜第１３図のように各
製品の補強部３０，３０ａおよび３１の裏面に上記補強
導体２９を配置せしめた端子構造を得ることが出来る。
本発明による上記端子構造は、以上の説明から分かるよ
うに、フレキシブルサーキットの端子部裏面に補強部を
設け、上記端子部に形成された導体パターンと対応する
位置であってこれらの導体パターンと各別に接続された
導体片をこの補強部外面に設け、上記端子部における各
導体パターン及び導体片闇のベースフィルム及び補強部
分を切除して各導体パターン及び導体片の各部分のみを
真直に突出形成させて端子部を所謂櫛歯状に構成すると
共に、その為の製造方法を伴せて提供したもので、この
ような手法により、突出形成された端子となるべき部分
に補強部を形成してある為、第１４図に示すとおり、た
とえばプリント配線基板３２に接続するような場合には
、該基板に予め設けられている透孔３２ａに他の回路部
品３５と同様に補強部２４（または、２８，３０．３１
等）の突出した導体パターン部分を挿入して基板３２の
裏面に適度に突出させることができる一方、その挿入作
業を著しく容易にする。Therefore, as a convenient method to further promote this effect, when manufacturing this type of flexible circuit, as shown in FIG. The purpose is to use a flexible circuit in which a reinforcing conductor 29 is formed at the tip edge without contacting the pattern 22. If such a flexible circuit is used in the same manner as in the above embodiment, the result shown in FIG. Products corresponding to FIGS. 9 and 7, respectively, have a terminal structure in which the reinforcing conductor 29 is placed on the back surface of the reinforcing portions 30, 30a, and 31 of each product as shown in FIGS. 11 to 13. You can get it.
As can be seen from the above description, the terminal structure according to the present invention includes a reinforcing portion provided on the back surface of the terminal portion of the flexible circuit, and a reinforcing portion is provided at a position corresponding to the conductor pattern formed on the terminal portion, and is connected to each conductor pattern. Separately connected conductor pieces are provided on the outer surface of this reinforcing part, and the base film and reinforcing parts of each conductor pattern and conductor piece in the terminal part are cut out to form only each part of each conductor pattern and conductor piece to protrude straight. The terminal part is formed into a so-called comb-teeth shape, and a manufacturing method for that purpose is also provided.By such a method, a reinforcing part is formed in the protruding part that is to become the terminal. Therefore, as shown in FIG. 14, when connecting to a printed wiring board 32, for example, the reinforcing part 24 (or 28, 30.31
etc.) can be inserted and made to protrude moderately from the back surface of the substrate 32, while making the insertion work considerably easier.
このようにして基板３２に取付け後には、たとえばハン
ダ溶融液Ｍに基板３２の裏面を浸すだけで、他の回路部
分の脳３４と同時に突出した導体パターン部分にハンダ
３３を付着させることが出来る。その際、補強部の両面
には、相連続した導体部分を備えることから、ハンダ３
３はその一面のみに付着するなど不均等な付着が防止さ
れ、一様に十分なハンダ量を付着させ得る。よって、ハ
ンダ付着による端子部と基板との接続は極めて強固かつ
良好となり、電気的接続特性の優れた製品を提供できる
。したがって、従釆のように、基板３２上に端子部を直
接接続する手法または別途コネクター等の接続金具を用
いる手段に比し、接続作業の簡易化並びに迅速化を図る
ことによって高能率に処理できる。また、接続不良等の
好ましくない事態の発生をほぼ完全に防ぐことも出来る
こととなって、製品の信頼性をも格段に高め得る。更に
、このような端子構造及びその製法自体においてもこれ
を極めて簡単かつ能率よく実施可能である等、この種フ
レキシブルサーキットの接続手段に適用して最適である
。After being attached to the board 32 in this manner, the solder 33 can be attached to the protruding conductor pattern portions at the same time as the brains 34 of other circuit parts by simply dipping the back side of the board 32 in, for example, the solder melt M. At that time, since both sides of the reinforcing part are provided with continuous conductor parts, solder 3
3 prevents uneven adhesion, such as adhesion to only one surface, and allows a sufficient amount of solder to be evenly applied. Therefore, the connection between the terminal portion and the board by solder attachment is extremely strong and good, and a product with excellent electrical connection characteristics can be provided. Therefore, compared to the method of directly connecting the terminal section on the board 32 or the method of using a separate connection fitting such as a connector, as in the case of a secondary connector, the connection work can be simplified and speeded up, and processing can be performed with high efficiency. . Furthermore, it is possible to almost completely prevent the occurrence of undesirable situations such as poor connections, and the reliability of the product can be greatly improved. Furthermore, such a terminal structure and its manufacturing method itself can be implemented extremely simply and efficiently, making it ideal for application to connection means for this type of flexible circuit.
第１図は、通常のフレキシブルサーキットの端子となる
べき部分を示す概念的斜視図、第２図は端子部分のベー
スフィルムに長孔を穿設する工程を示す説明図、第３図
は補強部材を使用しないで端子部に補強部を形成した端
子構造の斜視図、第４図は第３図の拡大断面図、第５図
はフレキシブルサーキットの裏面に補強部材を配置する
説明図、第６図は第２図と同様な穿孔工程を示す図「第
７図は補強部材を有する端子構造の拡大断面図、第８図
は補強部材として両面粘着テープを薄用する場合の説明
図、第９図はその完成断面図、第１０図はフレキシブル
サ−キットの端部に予め導体を形成した状態を示す図、
第１１図及び第１３図は第１０図のフレキシブルサーキ
ットを用いて構成される端子構造の拡大断面図、第１４
図は本発明による端子構造を用いて回路基板等に接続す
る態様を説明する図である。
２０・・・・・・端子を形成すべき部分、２６・・・…
補強部村、２１・・・・・・ベースフィルム、２６ａ・
・・・・・両面粘着テープ、２２……導体パターン、２
９・…・・導体、２３・・・・・・長孔、３３・・…・
付着したハンダ、２４・…・・補強部、Ｍ…・・・ハン
ダ液。
第／図
第ｚ図
第Ｊ図
第ぷ図
弟ょ図
第５図
第７図
第Ｊ図
第？図
弟／０図
策／／図
第／Ｚ図
第′３図
第ノム図Figure 1 is a conceptual perspective view showing the part that will become the terminal of a normal flexible circuit, Figure 2 is an explanatory diagram showing the process of drilling a long hole in the base film of the terminal part, and Figure 3 is a reinforcing member. Fig. 4 is an enlarged cross-sectional view of Fig. 3, Fig. 5 is an explanatory diagram of placing a reinforcing member on the back side of the flexible circuit, Fig. 6 7 is an enlarged cross-sectional view of a terminal structure with a reinforcing member, FIG. 8 is an explanatory diagram of the case where double-sided adhesive tape is thinly used as a reinforcing member, and FIG. 9 is a diagram showing the same drilling process as FIG. 2. 10 is a cross-sectional view of the completed flexible circuit, and FIG.
11 and 13 are enlarged sectional views of the terminal structure constructed using the flexible circuit shown in FIG. 10, and FIG.
The figure is a diagram illustrating a mode of connecting to a circuit board or the like using the terminal structure according to the present invention. 20... Portion where a terminal is to be formed, 26...
Reinforcement part village, 21...Base film, 26a.
...Double-sided adhesive tape, 22...Conductor pattern, 2
9... Conductor, 23... Long hole, 33...
Adhered solder, 24...Reinforcement part, M...Solder liquid. Figure / Figure Z Figure J Figure P Figure Younger brother Figure 5 Figure 7 Figure J ? Younger brother / 0 diagram / / diagram / Z diagram '3 Nomu diagram
Claims (1)
に補強部を設け、上記端子部に形成された導体パターン
と対応する位置であってそれらと各別に接続された導体
片を上記補強部の外面に設け、上記端子部における各導
体パターン及び導体片間のベースフイルム及び補強部分
を切除して各導体パターン及び導体片の各部分のみを真
直に突出形成するように構成したことを特徴とするフレ
キシブルサーキツトに於ける端子構造。 ２ 予め所要導体パターンをベースフイルム上に形成し
たフレキシブルサーキツトにおける端子部の終端近傍に
位置させて上記導体パターン間のベースフイルムを長孔
状に打ち抜き、該長孔部分の中央部における該長孔部分
の長手方向と直交する線を境にして折り曲げて相互のベ
ースフイルムを重ね合せ、この合せ目を接合して補強部
を形成することを特徴とするフレキシブルサーキツトに
於ける端子構造の製造方法。[Claims] 1. A reinforcing portion is provided on the back surface of a terminal portion formed on a flexible circuit, and conductor pieces are connected to each other at positions corresponding to the conductor patterns formed on the terminal portion. The reinforcing portion is provided on the outer surface thereof, and the base film and the reinforcing portion between each conductor pattern and conductor piece in the terminal portion are removed so that only each portion of each conductor pattern and conductor piece protrudes straight. A terminal structure in a flexible circuit characterized by: 2. A required conductor pattern is formed in advance on a base film, and the base film is located near the terminal end of the terminal portion of the flexible circuit, and the base film between the conductor patterns is punched out in the shape of a long hole, and the long hole is punched in the center of the long hole portion. A method for manufacturing a terminal structure in a flexible circuit, which comprises folding base films along a line perpendicular to the longitudinal direction of the parts, overlapping each other, and joining the seams to form a reinforcing part. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP51112807A JPS6013274B2 (en) | 1976-09-20 | 1976-09-20 | Terminal structure in flexible circuit and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP51112807A JPS6013274B2 (en) | 1976-09-20 | 1976-09-20 | Terminal structure in flexible circuit and its manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5337858A JPS5337858A (en) | 1978-04-07 |
| JPS6013274B2 true JPS6013274B2 (en) | 1985-04-05 |
Family
ID=14596011
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP51112807A Expired JPS6013274B2 (en) | 1976-09-20 | 1976-09-20 | Terminal structure in flexible circuit and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6013274B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62282424A (en) * | 1985-11-27 | 1987-12-08 | Meiji Natl Ind Co Ltd | Manufacture of coil |
| JPH0585229B2 (en) * | 1988-10-25 | 1993-12-06 | Nippon Kansen Kogyo Kk | |
| WO1996010326A1 (en) * | 1994-09-27 | 1996-04-04 | Seiko Epson Corporation | Printed wiring board, method of producing the same and electronic devices |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60147175U (en) * | 1984-03-12 | 1985-09-30 | アルプス電気株式会社 | Connection end structure of flexible flat cable |
| JPH041662Y2 (en) * | 1985-06-11 | 1992-01-21 | ||
| JPH0612614Y2 (en) * | 1987-04-14 | 1994-03-30 | カシオ計算機株式会社 | Circuit board unit |
| JPH01115171U (en) * | 1987-12-28 | 1989-08-02 | ||
| JP2629950B2 (en) * | 1989-03-16 | 1997-07-16 | 住友化学工業株式会社 | Method for racemizing dihalovinylcyclopropanecarboxylic acid halides |
| JP2787228B2 (en) * | 1989-07-26 | 1998-08-13 | 日本メクトロン株式会社 | Method of manufacturing flexible circuit board |
| JP2780381B2 (en) * | 1989-09-27 | 1998-07-30 | 住友化学工業株式会社 | Method for producing trans-2,2-dimethyl-3- (2,2-dihalovinyl) -cyclopropanecarboxylic acid |
| JPH0737328Y2 (en) * | 1991-02-08 | 1995-08-23 | 住友電気工業株式会社 | Flexible printed wiring board |
| JP2002057416A (en) * | 2000-08-10 | 2002-02-22 | Sony Chem Corp | Flexible wiring board for both-side connection |
| JP6423781B2 (en) * | 2015-11-20 | 2018-11-14 | 株式会社ジャパンディスプレイ | Display device |
-
1976
- 1976-09-20 JP JP51112807A patent/JPS6013274B2/en not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62282424A (en) * | 1985-11-27 | 1987-12-08 | Meiji Natl Ind Co Ltd | Manufacture of coil |
| JPH0585229B2 (en) * | 1988-10-25 | 1993-12-06 | Nippon Kansen Kogyo Kk | |
| WO1996010326A1 (en) * | 1994-09-27 | 1996-04-04 | Seiko Epson Corporation | Printed wiring board, method of producing the same and electronic devices |
| US6121988A (en) * | 1994-09-27 | 2000-09-19 | Seiko Epson Corporation | Printed wiring board and its manufacturing method, and electronic apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5337858A (en) | 1978-04-07 |
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