JPS60130129A - Method for sealing isolation-type semiconductor element with resin - Google Patents

Method for sealing isolation-type semiconductor element with resin

Info

Publication number
JPS60130129A
JPS60130129A JP23753983A JP23753983A JPS60130129A JP S60130129 A JPS60130129 A JP S60130129A JP 23753983 A JP23753983 A JP 23753983A JP 23753983 A JP23753983 A JP 23753983A JP S60130129 A JPS60130129 A JP S60130129A
Authority
JP
Japan
Prior art keywords
resin
pins
lead frame
mold
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23753983A
Other languages
Japanese (ja)
Inventor
Kaoru Toyoda
豊田　薫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP23753983A priority Critical patent/JPS60130129A/en
Publication of JPS60130129A publication Critical patent/JPS60130129A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C45/14073—Positioning or centering articles in the mould using means being retractable during injection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C45/14073—Positioning or centering articles in the mould using means being retractable during injection
    • B29C2045/1409—Positioning or centering articles in the mould using means being retractable during injection using control means for retraction of the centering means

Abstract

PURPOSE:To improve the reliability of dielectric strength, by holding one end of a lead frame with a mold while supporting the other end by reciprocating pins to control the position of the frame, and sealing the frame with resin injected under a predetermined pressure. CONSTITUTION:One end 10a of a lead frame 10 is held by mold pieces 4 and 5 while the other end 10b is supported by pins 7 from the both sides so as to adjust the frame in a parallel position. The cavity in the mold is filled with resin. The sealing pressure is detected by 6 so that when the pressure is somewhat lower than a predetermined injection pressure, a driving source 8 is actuated. The pins are pulled off before the final filling so as to control the thickness of the resin on the rear face of the heat radiating plate of the lead frame, and the spaces left by the pins are filled with resin. According to this constitution, hanging pins as seen in the prior art are eliminated but only marks of the pins are left on the surface of a molded piece. Therefore, the need of cutting the hanging pins and cracks resulting therefrom are eliminated, so that a device with high withstand voltage and high reliability can be obtained.

Description

【発明の詳細な説明】 〔発明の属する技術分野の説明〕 本発明は、絶縁型半導体素子の樹脂旧市方法に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION [Description of the technical field to which the invention pertains] The present invention relates to a resin molding method for an insulated semiconductor element.

〔従来技術の説明〕[Description of prior art]

半導体素子は、半導体ペレットにろう付けされた放熱板
自身がデバイスの電極となる場合があるため、放熱板と
取付フィンとの間を電気的に絶縁する必要がある。更に
、半導体ペレットで発生する熱を放熱板を通して外部放
散させる必要もある。In a semiconductor element, the heat sink itself, which is brazed to the semiconductor pellet, may serve as the electrode of the device, so it is necessary to electrically insulate between the heat sink and the mounting fins. Furthermore, it is also necessary to dissipate the heat generated by the semiconductor pellets to the outside through a heat sink.

従って、絶縁型半導体素子は、放熱板を封止樹脂中に浮
かせて、デバイス表面に金属部を露出させない構造で、
かつ放熱板裏面の樹脂厚を精度よくコントロールする必
要がある。Therefore, an insulated semiconductor device has a structure in which the heat sink is suspended in a sealing resin so that no metal parts are exposed on the device surface.
In addition, it is necessary to precisely control the resin thickness on the back side of the heat sink.

従来、この種の半導体素子は第１図、第２図に示すよう
に、リードフレーム１０の放熱板に吊りビン１を設け、
リード部１０ＬＬおよび吊りビン１を樹脂制止用上、下
ｍ２，３でクランプしリードフレームの平行度を出しだ
状態で樹脂封止をしていた。Conventionally, as shown in FIGS. 1 and 2, this type of semiconductor device has a hanging bottle 1 provided on a heat sink of a lead frame 10.
The lead part 10LL and the hanging bottle 1 were clamped with the upper and lower resin stoppers m2 and 3, and the lead frame was sealed with resin while maintaining parallelism.

しかしながら、従来構造のものにおいては樹脂封止後吊
りビン１を切断する必要があり、その際、樹脂クラック
が生じ易く、耐湿性に欠け、或いは吊りビン切断個所か
デバイス表面に露出するため、取付フィンと吊シピンと
の間で空中放電が生じ易いという欠点があった。その対
策として吊りピン部に放電防止樹脂を塗るなどしていた
が、樹脂を塗る工数がかかるうえ、絶縁耐圧の信頼性が
良くないという欠点が残っていた。However, with the conventional structure, it is necessary to cut the hanging bottle 1 after resin sealing, and at that time, the resin tends to crack, lacks moisture resistance, or the cut part of the hanging bottle is exposed on the device surface, making it difficult to install. There was a drawback that air discharge was likely to occur between the fin and the hanging pin. As a countermeasure, the suspension pins were coated with anti-discharge resin, but the drawbacks were that it took a lot of time to coat the resin and the reliability of the dielectric strength was poor.

〔発明の詳細な説明〕[Detailed description of the invention]

本発明の目的は前記問題点を解消し／こ絶縁型半導体素
子を製造する樹脂封止方法を堤０（することにある。SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems and to provide a resin sealing method for manufacturing an insulated semiconductor element.

〔発明の構成〕[Structure of the invention]

本発明は金型によシリードフレームの一端ヲ保持すると
ともに、金型内に進退動するリードフレーム固定用ビン
により該リードフレームの他端を両側から支え、所定射
出圧力で樹脂封止する前にリードフレーム固定用ピンを
出入させて金型内でのリードフレームの姿勢を規制し、
その後所定射出圧力で樹脂封止することを特徴とする絶
縁型半導体素子の樹脂方法である。In the present invention, one end of the lead frame is held by a mold, and the other end of the lead frame is supported from both sides by a lead frame fixing pin that moves back and forth within the mold, and before sealing with resin at a predetermined injection pressure. The position of the lead frame in the mold is controlled by moving the lead frame fixing pin in and out.
This is a resin method for an insulated semiconductor device, which is characterized in that the device is then sealed with a resin at a predetermined injection pressure.

〔実施例の説明〕[Explanation of Examples]

以下に、本発明の一実施例を図により説明する。 An embodiment of the present invention will be described below with reference to the drawings.

第３図において、キャビティを形成する上型４及び下型
５にそれぞれリードフレーム固定用ピン７．７をキャビ
ティ内に進退動可能に設け、キャビティ内圧を測定する
キャビティ内圧センサ６を下型５に設置する。さらに、
ビン７．７をキャビティ内に出入れしてリードフレーム
の姿勢を規制し７て平行度を出す駆動源８，８にリード
フレーム固定用ピン７．７を連結する。In FIG. 3, lead frame fixing pins 7 and 7 are provided in the upper mold 4 and lower mold 5 that form a cavity so as to be able to move forward and backward into the cavities, and a cavity internal pressure sensor 6 for measuring the cavity internal pressure is installed in the lower mold 5. Install. moreover,
Lead frame fixing pins 7.7 are connected to drive sources 8, 8 which move the bins 7.7 in and out of the cavity to regulate the attitude of the lead frame 7 and provide parallelism.

樹脂封止するには、上型４及び下型５で型締を行うと同
時に、リードフレーム１０の一端１０ａを上下型４，５
で保持し、一方、ビン７．７によりリードフレーム１０
の他端１０ｂを両側から支えてその平行度を出す。To perform resin sealing, the upper mold 4 and the lower mold 5 are used to clamp the mold, and at the same time, one end 10a of the lead frame 10 is placed between the upper and lower molds 4 and 5.
while the lead frame 10 is held by the bin 7.7.
The other end 10b is supported from both sides to ensure its parallelism.

そして、上下型４，５で形成されるキャビティ内に樹脂
に注入し、その樹脂封止圧力をセンサ６で検出し７、該
センサ６の信号に基づき所定射出圧力より若干低めの圧
力時に駆動源８，８を作動させ、最終充填前にリードフ
レーム固定用ピン７．７をキャビティ内に出入し、リー
ドフレームの放熱板裏面の樹脂厚をコントロールする。Then, resin is injected into the cavity formed by the upper and lower molds 4 and 5, and the resin sealing pressure is detected by a sensor 6. Based on the signal from the sensor 6, the driving source is supplied when the pressure is slightly lower than the predetermined injection pressure. 8 and 8 to move the lead frame fixing pin 7.7 into and out of the cavity before the final filling to control the resin thickness on the back side of the heat sink of the lead frame.

その後、第４図に示すように、ビン７．７をキャビティ
から引き抜き、ビン７．７が上下動したキャビティの空
間に所定射出圧力により樹脂を充填して樹脂封止をする
。Thereafter, as shown in FIG. 4, the bottle 7.7 is pulled out from the cavity, and the space in the cavity in which the bottle 7.7 has moved up and down is filled with resin at a predetermined injection pressure to seal the resin.

本発明によれば、第５図に示すように樹脂封止された半
導体素子には従来のように吊りビンが存在せず表面に固
定ビン７の跡が付くだけである。According to the present invention, as shown in FIG. 5, the resin-sealed semiconductor element does not have a hanging bottle as in the conventional case, and only the marks of the fixing bottle 7 are left on the surface.

〔発明の詳細な説明〕[Detailed description of the invention]

以上の説明から明らかなように、本発明によれば、樹脂
封止後の吊りビン切断工程が省略でき、前記切断工程に
伴なう樹脂クラックの発生を防止でき、さらにデバイス
表面全て樹脂で覆われているため、高耐圧、高信頼度素
子を得ることができる。さらに最終的に充填する前にリ
ードフレーム固定用ピンを出入し２てリードフレームの
姿勢を規制するので、リードフレームの放熱板裏面の樹
脂厚を精度よくコントロールできる効果を有するもので
ある。As is clear from the above description, according to the present invention, the process of cutting the hanging bottle after resin sealing can be omitted, the generation of resin cracks accompanying the cutting process can be prevented, and the entire surface of the device can be covered with resin. Therefore, it is possible to obtain a high-voltage, high-reliability device. Furthermore, since the lead frame fixing pin is moved in and out 2 to regulate the attitude of the lead frame before the final filling, it is possible to precisely control the resin thickness on the back surface of the heat sink of the lead frame.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の半導体素子の外観図、第２図は従来構造
の樹脂封止金型の一実施例を示す断面図、第３．４図は
本発明による樹脂封止装置の一実施例を示す断面図、第
５図は本発明により得られた絶縁型半導体素子の外観図
である。 ４・・上型、５・下型、６・・・キャビティ内圧センサ
、７・・リードフレーム固定用ピン、８・・・駆動源第
４図 第５図Fig. 1 is an external view of a conventional semiconductor element, Fig. 2 is a sectional view showing an embodiment of a resin sealing mold with a conventional structure, and Fig. 3.4 is an embodiment of a resin sealing device according to the present invention. FIG. 5 is an external view of an insulated semiconductor element obtained by the present invention. 4. Upper mold, 5. Lower mold, 6. Cavity internal pressure sensor, 7. Lead frame fixing pin, 8. Drive source Fig. 4 Fig. 5

Claims (1)

【特許請求の範囲】[Claims] （１）金型によりリードフレームの一端を保持するとと
もに、金型内に進退動するリードフレーム固定用ビンに
より該リードフレームの他端を両側から支え、所定射出
圧力で樹脂封止する前にリードフレーム固定用ピンを出
入させて金型内でのリードフレームの姿勢を規制し、そ
の後所定射出圧力で樹脂封止をすることを特徴とする絶
縁型半導体素子の樹脂封止方法。(1) One end of the lead frame is held by a mold, and the other end of the lead frame is supported from both sides by a lead frame fixing pin that moves forward and backward into the mold, and the lead frame is held before being sealed with resin at a predetermined injection pressure. A resin sealing method for an insulated semiconductor element, which comprises regulating the posture of a lead frame within a mold by moving frame fixing pins in and out, and then sealing the lead frame with resin at a predetermined injection pressure.
JP23753983A 1983-12-16 1983-12-16 Method for sealing isolation-type semiconductor element with resin Pending JPS60130129A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23753983A JPS60130129A (en) 1983-12-16 1983-12-16 Method for sealing isolation-type semiconductor element with resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23753983A JPS60130129A (en) 1983-12-16 1983-12-16 Method for sealing isolation-type semiconductor element with resin

Publications (1)

Publication Number Publication Date
JPS60130129A true JPS60130129A (en) 1985-07-11

Family

ID=17016829

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23753983A Pending JPS60130129A (en) 1983-12-16 1983-12-16 Method for sealing isolation-type semiconductor element with resin

Country Status (1)

Country Link
JP (1) JPS60130129A (en)

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62131525A (en) * 1985-12-03 1987-06-13 Nec Kansai Ltd Manufacture of semiconductor device
JPS6362239A (en) * 1986-08-27 1988-03-18 エスジ−エス・マイクロエレットロニカ・エス・ピ−・エ− Manufacture of semiconductor device enclosed in plastic capsule
JPS6416634U (en) * 1987-07-20 1989-01-27
JPH01105550A (en) * 1987-10-19 1989-04-24 Sanyo Electric Co Ltd Manufacture of resin-sealed semiconductor device
JPH01169936A (en) * 1987-12-24 1989-07-05 T & K Internatl Kenkyusho:Kk Resin seal molding method for semiconductor element and its equipment
JPH01179332A (en) * 1987-12-31 1989-07-17 Sanken Electric Co Ltd Manufacture of plastic-sealed electronic device
EP0342237A1 (en) * 1987-07-27 1989-11-23 KANEKO, Michio Floating insert molding method and apparatus
JPH01292834A (en) * 1988-05-20 1989-11-27 Nec Corp Resin sealed type semiconductor device manufacturing apparatus
WO1989011386A1 (en) * 1988-05-17 1989-11-30 Marianne Wieser Process for accurately positioning cores and/or mats in plastic mouldings
JPH02168637A (en) * 1988-12-21 1990-06-28 Sharp Corp Manufacture of semiconductor device
JPH02184040A (en) * 1989-01-11 1990-07-18 Nec Corp Manufacture of semiconductor device
EP0381223A2 (en) * 1989-02-02 1990-08-08 Friedrich Theysohn GmbH Method for moulding a box-shaped container by injection
JPH02216838A (en) * 1989-02-17 1990-08-29 Fuji Electric Co Ltd Manufacture of resin-sealed semiconductor device
JPH0316333U (en) * 1989-06-29 1991-02-19
JPH0360146A (en) * 1989-07-28 1991-03-15 Nec Kansai Ltd Resin mold type semiconductor device and resin molding equipment
US5133921A (en) * 1987-12-31 1992-07-28 Sanken Electric Co., Ltd. Method for manufacturing plastic encapsulated electronic semiconductor devices
WO1992016348A1 (en) * 1991-03-14 1992-10-01 Wera Werk Hermann Werner Gmbh & Co. Tool, especially a screwdriver, and device and process for injection-moulding a plastic handle thereon
JPH08204099A (en) * 1995-01-31 1996-08-09 Rohm Co Ltd Constitution of semiconductor device and its forming method
WO1998002919A1 (en) * 1996-07-12 1998-01-22 Fujitsu Limited Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the device
WO2001096095A1 (en) * 2000-06-16 2001-12-20 Abb Ab Method and moulding tool for manufacturing fibre-reinforced products
WO2002081170A1 (en) * 2001-04-06 2002-10-17 Sherwood Services Ag Retractable overmolded insert retention apparatus
US6881611B1 (en) 1996-07-12 2005-04-19 Fujitsu Limited Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62131525A (en) * 1985-12-03 1987-06-13 Nec Kansai Ltd Manufacture of semiconductor device
JPS6362239A (en) * 1986-08-27 1988-03-18 エスジ−エス・マイクロエレットロニカ・エス・ピ−・エ− Manufacture of semiconductor device enclosed in plastic capsule
JPS6416634U (en) * 1987-07-20 1989-01-27
EP0342237A1 (en) * 1987-07-27 1989-11-23 KANEKO, Michio Floating insert molding method and apparatus
JPH01105550A (en) * 1987-10-19 1989-04-24 Sanyo Electric Co Ltd Manufacture of resin-sealed semiconductor device
JPH01169936A (en) * 1987-12-24 1989-07-05 T & K Internatl Kenkyusho:Kk Resin seal molding method for semiconductor element and its equipment
JPH01179332A (en) * 1987-12-31 1989-07-17 Sanken Electric Co Ltd Manufacture of plastic-sealed electronic device
US4954307A (en) * 1987-12-31 1990-09-04 Sanken Electric Co., Ltd. Method for manufacturing plastic encapsulated electronic semiconductor devices
JPH0513536B2 (en) * 1987-12-31 1993-02-22 Sanken Electric Co Ltd
US5133921A (en) * 1987-12-31 1992-07-28 Sanken Electric Co., Ltd. Method for manufacturing plastic encapsulated electronic semiconductor devices
WO1989011386A1 (en) * 1988-05-17 1989-11-30 Marianne Wieser Process for accurately positioning cores and/or mats in plastic mouldings
JPH01292834A (en) * 1988-05-20 1989-11-27 Nec Corp Resin sealed type semiconductor device manufacturing apparatus
JPH02168637A (en) * 1988-12-21 1990-06-28 Sharp Corp Manufacture of semiconductor device
JPH02184040A (en) * 1989-01-11 1990-07-18 Nec Corp Manufacture of semiconductor device
EP0381223A2 (en) * 1989-02-02 1990-08-08 Friedrich Theysohn GmbH Method for moulding a box-shaped container by injection
EP0381223A3 (en) * 1989-02-02 1991-07-03 Friedrich Theysohn GmbH Method for moulding a box-shaped container by injection
JPH02216838A (en) * 1989-02-17 1990-08-29 Fuji Electric Co Ltd Manufacture of resin-sealed semiconductor device
JPH0316333U (en) * 1989-06-29 1991-02-19
JPH0360146A (en) * 1989-07-28 1991-03-15 Nec Kansai Ltd Resin mold type semiconductor device and resin molding equipment
WO1992016348A1 (en) * 1991-03-14 1992-10-01 Wera Werk Hermann Werner Gmbh & Co. Tool, especially a screwdriver, and device and process for injection-moulding a plastic handle thereon
JPH08204099A (en) * 1995-01-31 1996-08-09 Rohm Co Ltd Constitution of semiconductor device and its forming method
WO1998002919A1 (en) * 1996-07-12 1998-01-22 Fujitsu Limited Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the device
EP1189271A3 (en) * 1996-07-12 2003-07-16 Fujitsu Limited Wiring boards and mounting of semiconductor devices thereon
US6881611B1 (en) 1996-07-12 2005-04-19 Fujitsu Limited Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device
WO2001096095A1 (en) * 2000-06-16 2001-12-20 Abb Ab Method and moulding tool for manufacturing fibre-reinforced products
WO2002081170A1 (en) * 2001-04-06 2002-10-17 Sherwood Services Ag Retractable overmolded insert retention apparatus

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