JPS6012750A - Mounting device for semiconductor element - Google Patents
Mounting device for semiconductor elementInfo
- Publication number
- JPS6012750A JPS6012750A JP12062383A JP12062383A JPS6012750A JP S6012750 A JPS6012750 A JP S6012750A JP 12062383 A JP12062383 A JP 12062383A JP 12062383 A JP12062383 A JP 12062383A JP S6012750 A JPS6012750 A JP S6012750A
- Authority
- JP
- Japan
- Prior art keywords
- monolithic
- semiconductor element
- substrate
- circuit
- transparent resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 8
- 239000011347 resin Substances 0.000 claims abstract description 5
- 229920005989 resin Polymers 0.000 claims abstract description 5
- 239000000758 substrate Substances 0.000 abstract description 10
- 239000000919 ceramic Substances 0.000 abstract description 9
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 238000009434 installation Methods 0.000 abstract description 3
- 238000001514 detection method Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
本考案は、光の照度を検出して自動車のテールライト、
ヘッドライトの点消灯を自動的に行うライトコントロー
ルセンサに適用するのに適した半導体素子の実装装置に
関するものである。[Detailed Description of the Invention] The present invention detects the illuminance of light and
The present invention relates to a semiconductor element mounting apparatus suitable for application to a light control sensor that automatically turns on and off headlights.
従来ライトコントロールセンサはホトダイオードや増幅
用ICからなるが、これらを回路基板につけるときそれ
ぞれ、基板にグイボンデングし′ζいたが、実装スペー
スをとるため小型化に限界があった。Conventional light control sensors consist of photodiodes and amplification ICs, but when these are attached to a circuit board, they are each bonded to the board, but this takes up mounting space, which limits miniaturization.
本発明はさらに実装密度をあげることにより、小型化を
狙ったものである。The present invention aims at miniaturization by further increasing the packaging density.
以下に第1図〜第3図に示す本発明実施例について説明
する。第1図は本発明によってハイブリッドICとなっ
た実装装置の断面図である。1は回路基板をなすセラミ
ック基板、2は第3図に回路図が示しである第1のモノ
リシックIC,2は図示上部からの光を検出するための
ホトダイオード(第2のノモリシックIC)、4は受光
用の透明樹脂5の流出を防止する囲い、6はホトダイオ
ード3とセラミック基板1の回路ばたーんとを接続する
ためのターミナルである。なお、第2−2図は第1図の
平面即、第3図は第1図の実施回路例を示している。Embodiments of the present invention shown in FIGS. 1 to 3 will be described below. FIG. 1 is a cross-sectional view of a mounting device that has become a hybrid IC according to the present invention. 1 is a ceramic substrate forming a circuit board; 2 is a first monolithic IC whose circuit diagram is shown in FIG. 3; 2 is a photodiode (second nomolithic IC) for detecting light from the upper part of the figure; An enclosure 6 for preventing the light receiving transparent resin 5 from flowing out is a terminal for connecting the photodiode 3 and the circuit board of the ceramic substrate 1. 2-2 shows a plan view of FIG. 1, and FIG. 3 shows an example of the circuit shown in FIG. 1.
以下その作動について説明する。セラミック基板l上の
IC2によって構成される回路2は、ホトダイオード3
の出力を第3図の増幅器7で増幅し、比較器8で照度設
定電圧と比較して出力を出すものである。The operation will be explained below. A circuit 2 constituted by an IC 2 on a ceramic substrate 1 includes a photodiode 3
The output is amplified by the amplifier 7 shown in FIG. 3, and compared with the illuminance setting voltage by the comparator 8 to produce an output.
本装置において、ホトダイオード3はモノリシックIC
2上に接着材等を用いて固定され、かつホトダイオード
3は、その端子数山部からターミナル6を介してセラミ
ック回路基板1に接続される。なお、モノリシックIC
2は、セラミック回路基板1上に、フェイスダウンボン
ディングされている。In this device, the photodiode 3 is a monolithic IC.
The photodiode 3 is fixed onto the ceramic circuit board 2 using an adhesive or the like, and the photodiode 3 is connected to the ceramic circuit board 1 via the terminal 6 from its terminal ridges. In addition, monolithic IC
2 is face-down bonded onto the ceramic circuit board 1.
このため、2つの実装密度が格段に向上し、ライトコン
トロールセンサとしての取付スペースが著しく小さくな
る。Therefore, the mounting density of the two is significantly improved, and the installation space for the light control sensor is significantly reduced.
なお、前記構成において基板lはセラミック基板以外に
回路素子を実装できるものであればよく、IC3は受光
素子に限るものではない。Note that in the above configuration, the substrate l may be any substrate other than a ceramic substrate as long as it can mount a circuit element, and the IC 3 is not limited to a light receiving element.
また、IC2フエクスダウンボンデイングせずに、IC
3よりも大きいチップザイスにして、はみ出た部分にラ
ンドを設け”Cワイヤボンド接続し°ζもよい。Also, without IC2 fex down bonding, IC
It is also good to make a chip size larger than 3, provide a land on the protruding part, and connect with a "C" wire bond.
以上のように本発明は、第1.第2のICC壬子積み重
ね載置したことにより、小型化が図られるとともに、上
部に受光素子が位置するようにすればライトコンI・ロ
ールセンサとし゛ζ自動車への取付スペースがきわめて
コンパクトとなる。As described above, the present invention has the following advantages: By stacking the second ICC, it is possible to reduce the size, and by positioning the light-receiving element at the top, the installation space for the light control I/roll sensor in the vehicle becomes extremely compact.
第1図は本発明の実施例を示す断面図、第2図はその平
面図、第3図はその回路実施例図である。
■・・・回路基板、2・・・第1のICをなすモノリミ
ックIC,3・・・m2のICをなずホトダイオード。
5・・・透明樹脂。
代理人弁理士 岡 部 隆FIG. 1 is a sectional view showing an embodiment of the present invention, FIG. 2 is a plan view thereof, and FIG. 3 is a diagram showing an embodiment of the circuit. ■...Circuit board, 2...Monolithic IC forming the first IC, 3...M2 IC is a photodiode. 5...Transparent resin. Representative Patent Attorney Takashi Okabe
Claims (1)
C上に載置された第2のICと、第1、第2のICと回
路基板とを電気的に接続する手段とを備えてなる半導体
素子の実装装置。 (2)第2のICと第1のIcとが接着固定されている
特許請求の範囲第1項記載の半導体素子の実装装置。 (3)第2のICが受光素子である特許請求の範囲第1
項または第2項記載の半導体素子の実装装置。 (4)第1、第2のICが回路基板上で透明樹脂により
モールドされている特許請求の範囲第3項記載の半導体
素子の実装装置。 (51第1.第2のICがモノリミックICである特許
請求の範囲第1項乃至第4項いずれかに記載の半導体素
子の実装装置。[Claims] (11 A first IC mounted on a circuit board and a first I
1. A semiconductor element mounting apparatus comprising: a second IC placed on a semiconductor chip; and means for electrically connecting the first and second ICs to a circuit board. (2) The semiconductor element mounting apparatus according to claim 1, wherein the second IC and the first IC are adhesively fixed. (3) Claim 1 in which the second IC is a light receiving element
2. A semiconductor device mounting apparatus according to item 1 or 2. (4) The semiconductor element mounting apparatus according to claim 3, wherein the first and second ICs are molded with transparent resin on a circuit board. (51.1. The semiconductor element mounting apparatus according to any one of claims 1 to 4, wherein the second IC is a monolithic IC.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12062383A JPS6012750A (en) | 1983-07-01 | 1983-07-01 | Mounting device for semiconductor element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12062383A JPS6012750A (en) | 1983-07-01 | 1983-07-01 | Mounting device for semiconductor element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6012750A true JPS6012750A (en) | 1985-01-23 |
Family
ID=14790807
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12062383A Pending JPS6012750A (en) | 1983-07-01 | 1983-07-01 | Mounting device for semiconductor element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6012750A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5296207A (en) * | 1990-08-31 | 1994-03-22 | Benno Lux | Composite element, process for its preparation and its use |
US5503016A (en) * | 1994-02-01 | 1996-04-02 | Ic Sensors, Inc. | Vertically mounted accelerometer chip |
WO1996017505A1 (en) * | 1994-12-01 | 1996-06-06 | Motorola Inc. | Method, flip-chip module, and communicator for providing three-dimensional package |
GB2374726A (en) * | 2001-04-20 | 2002-10-23 | Kingpak Tech Inc | Stacked structure of an image sensor having image sensing chip located above integrated circuit |
WO2011034054A1 (en) * | 2009-09-18 | 2011-03-24 | 株式会社ケーヒン | Electronic control device for vehicle |
-
1983
- 1983-07-01 JP JP12062383A patent/JPS6012750A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5296207A (en) * | 1990-08-31 | 1994-03-22 | Benno Lux | Composite element, process for its preparation and its use |
US5503016A (en) * | 1994-02-01 | 1996-04-02 | Ic Sensors, Inc. | Vertically mounted accelerometer chip |
WO1996017505A1 (en) * | 1994-12-01 | 1996-06-06 | Motorola Inc. | Method, flip-chip module, and communicator for providing three-dimensional package |
GB2374726A (en) * | 2001-04-20 | 2002-10-23 | Kingpak Tech Inc | Stacked structure of an image sensor having image sensing chip located above integrated circuit |
WO2011034054A1 (en) * | 2009-09-18 | 2011-03-24 | 株式会社ケーヒン | Electronic control device for vehicle |
JP2011064156A (en) * | 2009-09-18 | 2011-03-31 | Keihin Corp | Electronic control device for vehicle |
EP2479410A4 (en) * | 2009-09-18 | 2017-12-27 | Keihin Corporation | Electronic control device for vehicle |
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